Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
04/2014
04/01/2014US8687371 Tamper respondent module
04/01/2014US8686572 Apparatus for stacking integrated circuits
04/01/2014US8686300 Printed wiring board and method for manufacturing the same
04/01/2014US8686299 Electronic element unit and reinforcing adhesive agent
04/01/2014US8686298 Wiring board and electronic component device
04/01/2014US8686297 Laminated flex circuit layers for electronic device components
04/01/2014US8686296 Electronic device having heat dissipation device
04/01/2014US8686295 Heat-dissipating substrate and fabricating method thereof
04/01/2014US8685529 Surface coating for electronic systems
03/2014
03/27/2014WO2014046259A1 Metallic foil having carrier
03/27/2014WO2014046256A1 Metallic foil having carrier
03/27/2014WO2014046074A1 Wiring board and wiring board production method
03/27/2014WO2014045862A1 Flexible multilayer substrate
03/27/2014WO2014045792A1 Circuit substrate and electronic device
03/27/2014WO2014045787A1 Wiring board
03/27/2014WO2014045775A1 Substrate with embedded circuit and composite module
03/27/2014WO2014045721A1 Wiring board and wiring board manufacturing method
03/27/2014WO2014045625A1 Insulating resin film, pre-cured product, laminate, and multi-layer substrate
03/27/2014WO2014045088A1 A method for making partially metallized precision synthetic thread square mesh fabrics for aesthetic or marking applications
03/27/2014WO2014044448A1 Contact arrangement for a multi-layer circuit carrier and method for contacting a multi-layer circuit carrier
03/27/2014WO2014044447A1 Contact arrangement for a multi-layer circuit carrier and method for contacting a multi-layer circuit carrier
03/27/2014WO2014043795A1 Topology for controlled power switch module
03/27/2014US20140088283 Phosphorus-containing compounds and their preparation process and use
03/27/2014US20140087614 Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board
03/27/2014US20140087149 Soluble aromatic polymer
03/27/2014US20140085856 Flexible printed circuit board and circuit-board connection structure
03/27/2014US20140085854 Circuit board incorporating semiconductor ic and manufacturing method thereof
03/27/2014US20140085852 Multilayer ceramic electronic component
03/27/2014US20140085851 Small form factor stacked electrical passive devices that reduce the distance to the ground plane
03/27/2014US20140085850 Printed circuit board with compact groups of devices
03/27/2014US20140085847 Wiring substrate
03/27/2014US20140085846 Microelectronic structures having laminated or embedded glass routing structures for high density packaging
03/27/2014US20140085845 Thick-film hybrid circuit structure and method of manufacture the same
03/27/2014US20140085843 Method for producing multi-layer substrate and multi-layer substrate
03/27/2014US20140085842 Method for fabricating glass substrate package
03/27/2014US20140085841 Circuit device and method of manufacturing the same
03/27/2014US20140085840 Electronic circuit and method of fabricating the same
03/27/2014US20140085838 Monitor and Working Vehicle Provided with the Monitor
03/27/2014US20140085837 Method of forming flexible conduction trace, flexible conduction trace and flexible electronic device using the same
03/27/2014US20140085835 DC Link Capacitor Bank
03/27/2014US20140085834 Device mounting board and semiconductor power module
03/27/2014US20140085833 Chip packaging substrate, method for manufacturing same, and chip packaging structure having same
03/27/2014US20140085831 Circuit board structure having measures against heat
03/27/2014US20140085830 Heat dissipating substrate, and element equipped with same
03/27/2014US20140085829 Multi-layered board and semiconductor package
03/27/2014US20140085827 Circuit board for electric components and circuit board system
03/27/2014US20140085551 Conductive substrate and touch panel comprising same
03/27/2014US20140085317 Transparent multi-layer structure with transparent electrical routing
03/27/2014US20140085034 Thermo/electrical conductor arrangement for multilayer printed circuit boards
03/27/2014US20140085031 Planar litz wire coil and method of making same
03/27/2014US20140084955 Fine pitch interposer structure
03/27/2014US20140084452 Element mounting board and semiconductor module
03/27/2014US20140083757 Printed circuit board and method for manufacturing same
03/27/2014US20140083756 Multi-Level Circuit Board for High-Frequency Applications
03/27/2014US20140083755 Laminated chip electronic component, board for mounting the same, and packing unit thereof
03/27/2014US20140083754 Blind via printed circuit board fabrication supporting press fit connectors
03/27/2014US20140083753 Method of forming copper wiring, method of manufacturing wiring board, and wiring board
03/27/2014US20140083752 Nanotube dispersants and dispersant free nanotube films therefrom
03/27/2014US20140083751 Touch panel
03/27/2014US20140083750 Raw glass plate for manufacturing touch panel and method of manufacturing touch panel using raw glass plate
03/27/2014US20140083749 Wiring substrate
03/27/2014US20140083748 Conductive pattern formation
03/27/2014US20140083747 Printed wiring board and method for manufacturing printed wiring board
03/27/2014US20140083746 Printed wiring board and method for manufacturing printed wiring board
03/27/2014US20140083745 Wiring substrate
03/27/2014US20140083744 Printed circuit board and method for manufacturing same
03/27/2014US20140083743 Manufacturing method for printed circuit board
03/27/2014US20140083742 Patterned transparent conductive film based on random grid
03/27/2014DE102012111472A1 Elektrodenpad, gedruckte Leiterplatte mit einem Elektrodenpad und Verfahren zur Herstellung einer gedruckten Leiterplatte Electrode pad, printed circuit board having an electrode pad and method for making a printed circuit board
03/27/2014DE102006037070B4 Verfahren zur Herstellung einer Platine A process for producing a printed circuit board
03/26/2014EP2712283A1 Light-emitting apparatus and luminaire
03/26/2014EP2712282A2 Thinned and flexible semiconductor elements on three dimensional surfaces
03/26/2014EP2712281A1 Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor
03/26/2014EP2711399A1 Thermoplastic resin composition, resin molding product, and method for producing resin molding product having plating layer
03/26/2014EP2710864A1 Circuit carrier
03/26/2014EP2710648A1 Ionic paper electronic platform (ipep)
03/26/2014CN203504884U Connection binding device of IC card electronic chip and flexible circuit board
03/26/2014CN203504883U LED soft lamp panel
03/26/2014CN203504882U Circuit board conduction part structure
03/26/2014CN203504881U Circuit board
03/26/2014CN203504880U Graphene heat conduction circuit substrate
03/26/2014CN203504879U Antistatic and anti-surge PCB structure
03/26/2014CN203504878U PCB plate with fixed wire harness
03/26/2014CN203504877U Flexible printed circuit board for LED liquid crystal display
03/26/2014CN203504876U Flexible printed circuit board for digital camera lens
03/26/2014CN203504875U Knitting structure of printed circuit board, pre-impregnated film, and stacked structure of pre-impregnated film
03/26/2014CN203504874U Double-sided circuit board structure for LED fluorescent lamp
03/26/2014CN203504873U Improved projector circuit cover plate
03/26/2014CN203503448U Planar transformer assembly used in electric steering engine system
03/26/2014CN203503440U High-voltage arc preventing power transformer
03/26/2014CN203500927U Spiral LED assembly and LED bulb lamp using same
03/26/2014CN203500078U Multipath resistor heat dissipation device
03/26/2014CN103688607A Novel conductive layer integrated flexible printed circuit (FPC)f
03/26/2014CN103688601A Ceramic substrate composite and method for producing ceramic substrate composite
03/26/2014CN103688599A PCB used in wireless terminal and wireless terminal
03/26/2014CN103688598A Wiring board and electronic device
03/26/2014CN103688381A Ionic paper electronic platform (IPEP)
03/26/2014CN103687909A Thermally conductive polymer composite material and article comprising same
03/26/2014CN103687459A Electromagnetic wave shielding structure and flexible printed circuit board with same
03/26/2014CN103687342A Printed circuit board with break hole and production method of printed circuit board
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