Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
03/2014
03/20/2014US20140078416 Transparent conductive polymer electrode formed by inkjet printing, display device including the electrode, and method of manufacturing the electrode
03/20/2014US20140077742 Linear actuator system with means for fire detection
03/20/2014US20140076623 Printed circuit board and method for manufacturing the same
03/20/2014US20140076622 Printed circuit board with integrated thin film battery
03/20/2014US20140076621 Acoustically quiet capacitors
03/20/2014US20140076620 Conductive particle and method of manufacturing the same
03/20/2014US20140076619 Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same
03/20/2014US20140076618 Method of forming gold thin film and printed circuit board
03/20/2014US20140076617 Passive Devices in Package-on-Package Structures and Methods for Forming the Same
03/20/2014US20140076616 Laser direct structuring materials with improved plating performance and acceptable mechanical properties
03/20/2014US20140076615 Array substrate and mask plate
03/20/2014US20140076614 Wiring substrate
03/20/2014US20140076613 Method of Electrophoretic Depositing (EPD) a Film on a System and System Thereof
03/20/2014US20140076612 Conductive sheet and touch panel
03/20/2014US20140076611 Printed circuit board and method of manufacturing the same
03/20/2014US20140076610 Planarizing printed electronic device and method for manufacturing the same
03/20/2014DE102012216805A1 Multi-layer circuitry carrier used for high-current applications, has heat dissipation apparatus which is provided with electrically conductive heat sinks that are thermally coupled with inner metal layer through recess
03/20/2014DE102012108770A1 Elektronische Baugruppe mit einem räumlichen spritzgegossenen elektronischen Schaltungsträger Electronic assembly with a spatial molded electronic circuit board
03/20/2014DE102006017101B4 Leiterplatte und elektrisches Gerät PCB and electrical equipment
03/19/2014EP2709430A1 Substrate structure, method of mounting semiconductor chip, and solid state realy
03/19/2014EP2708098A1 Load control device having an electrically isolated antenna
03/19/2014EP2707968A2 Scalable high-bandwidth connectivity
03/19/2014CN203492325U Cover film and flexible printing wiring board
03/19/2014CN203492275U connecting structure
03/19/2014CN203492268U Multipath integration relay plate
03/19/2014CN203492267U Printed circuit board
03/19/2014CN203492266U Installation structure of direct plug-in type modules
03/19/2014CN203492265U Anti-shock circuit board
03/19/2014CN203492264U Multilayer circuit board for LED display
03/19/2014CN203492263U QFN packaged PCB heat radiating bonding pad structure
03/19/2014CN203492257U Interface grounded connector and electronic device with interface grounded connector
03/19/2014CN203491441U Miniature PCI-E connector, butting connector and circuit board
03/19/2014CN203491411U Radiator connecting assembly
03/19/2014CN203491385U PCB antenna
03/19/2014CN203490437U Flexible printed circuit board and OTP recording device
03/19/2014CN103650653A Wiring board
03/19/2014CN103650652A The printed circuit board and the method for manufacturing the same
03/19/2014CN103650651A Flexible multilayer substrate
03/19/2014CN103650648A Multilayer ceramic substrate and manufacturing method therefor
03/19/2014CN103650647A Method for producing heat-dissipating multilayer material for mounting boards
03/19/2014CN103650646A Method for verifying correct adhesion of a substrate on an electrically and thermally conductive body
03/19/2014CN103650362A Scalable high-bandwidth connectivity
03/19/2014CN103650185A Circuit board for having semiconductor light emitting device mounted thereon, light emitting module, illuminating apparatus, and illuminating system
03/19/2014CN103650130A Submount for electronic, optoelectronic, optical, or photonic components
03/19/2014CN103650082A Electronic component
03/19/2014CN103649377A Electrolytic copper foil, circuit board using said, and flexible circuit board
03/19/2014CN103649231A Flexible conductive material
03/19/2014CN103649219A Resin composition for printed wiring boards
03/19/2014CN103648670A Rolled copper foil, method for producing same, and laminate plate
03/19/2014CN103648232A Method for solving short circuit of signal through hole and packaging bonding pad
03/19/2014CN103648231A Pcb
03/19/2014CN103647165A A PCB plug-in and a method for manufacturing same
03/19/2014CN102523680B Organic solderability preservative (OSP) on surface of printed circuit board and presoaking stock and method for manufacturing OSP
03/19/2014CN102388682B Metal-based circuit board and method for producing same
03/19/2014CN102342187B Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
03/19/2014CN102256442B Welding pad structure for ball grid array packaging chip and multilayer printed circuit board for mobile phone
03/19/2014CN102037614B 粘接材料卷轴 Bonding-material reel
03/18/2014US8675458 Connection structure of flexible printed circuits and optical pickup device
03/18/2014US8675372 Electrooptic substrate, electrooptic device, and electronic apparatus
03/18/2014US8675371 Distributed computing
03/18/2014US8675369 Module board
03/18/2014US8675367 Module incorporating electronic component
03/18/2014US8674505 Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance
03/18/2014US8674236 Wiring substrate and method of manufacturing the same
03/18/2014US8674234 Multilayer ceramic capacitor mounting structure and multilayer ceramic capacitor
03/18/2014US8674233 Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate
03/18/2014US8674232 Device-embedded flexible printed circuit board and manufacturing method thereof
03/18/2014US8674231 Endoscope
03/18/2014US8674017 (Poly)carbonate polyol and carboxyl group-containing polyurethane obtained from the (poly)carbonate polyol
03/18/2014US8673462 Low viscosity electrostatic discharge (ESD) dissipating adhesive substantially free of agglomerates
03/18/2014US8673391 Method of manufacturing a circuit board
03/13/2014WO2014039845A1 Axially aligned electronic chassis
03/13/2014WO2014039072A1 Method and structure for forming contact pads on a printed circuit board using zero under- cut technology
03/13/2014WO2014038718A1 Surface-treated copper foil and laminate using same, copper-clad laminated board, printed circuit board, and electronic device
03/13/2014WO2014038717A1 Surface-treated copper foil and laminated board using same
03/13/2014WO2014038716A1 Surface-treated copper foil and laminated board using same
03/13/2014WO2014038611A1 Silver paste composition and method for producing same
03/13/2014WO2014038542A1 Wiring board
03/13/2014WO2014038534A1 Insulating resin material and multilayer substrate
03/13/2014WO2014038488A1 Printed wiring board production method and printed wiring board
03/13/2014WO2014038326A1 Process for producing intermediate for interposer, and intermediate for interposer
03/13/2014WO2014038230A1 Glass-ceramic composite material
03/13/2014WO2014038125A1 Wiring substrate and production method therefor
03/13/2014WO2014037755A1 Method for making flexible circuits
03/13/2014WO2014037638A1 Electrical device and electrical compressor
03/13/2014WO2014036796A1 Conductive pad connecting device and touch screen
03/13/2014WO2014036767A1 Printed circuit board, method for laminating printed circuit board and flexible circuit board, and liquid crystal display device
03/13/2014WO2014036712A1 Composite material, high frequency circuit substrate made from the same, and production method thereof
03/13/2014US20140072818 Epoxy resin composition, and prepreg and copper clad laminate made therefrom
03/13/2014US20140072780 Method for manufacturing electric film body
03/13/2014US20140072701 Composition for an fpcb coverlay and method for producing the same
03/13/2014US20140071646 Routing design for high speed input/output links
03/13/2014US20140071645 Electronic Component comprising a Ceramic Carrier and use of a Ceramic Carrier
03/13/2014US20140071644 Apparatus for controlling resonance frequency of device subject to wireless power transmission interference and method thereof
03/13/2014US20140071639 Flexible wiring board, method for manufacturing same, mounted product using same, and flexible multilayer wiring board
03/13/2014US20140071637 Touch panel and touch display device
03/13/2014US20140071636 Magnetic Core Inductor Integrated with Multilevel Wiring Network
03/13/2014US20140071634 Electronic Device Subassemblies
03/13/2014US20140071633 Power module substrate, power module, and method for manufacturing power module substrate
03/13/2014US20140071631 Printed circuit board unit
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