| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/27/2014 | US8735740 Method and apparatus for optically transparent via filling |
| 05/27/2014 | US8735739 Wiring board and method for manufacturing the same |
| 05/27/2014 | US8735738 Printed circuit board grounding structure for use with communication apparatus |
| 05/27/2014 | US8735737 Substrate having leads |
| 05/27/2014 | US8735736 Electronic component module and its manufacturing method |
| 05/27/2014 | US8735735 Electronic module with embedded jumper conductor |
| 05/27/2014 | US8735734 Z-directed delay line components for printed circuit boards |
| 05/27/2014 | US8735733 Resin composition, prepreg laminate obtained with the same and printed-wiring board |
| 05/27/2014 | US8735732 Multilayer substrate |
| 05/27/2014 | US8735731 Flexible circuit board |
| 05/27/2014 | US8735730 Touch panel and method of manufacturing the same |
| 05/27/2014 | US8735729 Double-sided substrate, semiconductor device and method for the same |
| 05/27/2014 | US8735728 Printed circuit board with fins |
| 05/27/2014 | US8734936 Transparent conductive film, method for production thereof and touch panel therewith |
| 05/22/2014 | WO2014077961A1 Component mounting structure with flexible jumper |
| 05/22/2014 | WO2014077119A1 Wiring substrate and electronic device using same |
| 05/22/2014 | WO2014077076A1 Resin sheet |
| 05/22/2014 | WO2014076988A1 Electronic component unit, and wire harness system |
| 05/22/2014 | WO2014076779A1 Method for production of embedded board |
| 05/22/2014 | WO2014076746A1 Printed wiring board and power supply unit |
| 05/22/2014 | WO2014076697A1 Device kit and method for absorbing leakage current |
| 05/22/2014 | WO2014076303A1 Electrical vacuum-compatible feedthrough structure and detector assembly using such feedthrough structure |
| 05/22/2014 | WO2014076233A1 Angle-adjustable and/or angled printed circuit board structure having at least two printed circuit board sections and method for producing same |
| 05/22/2014 | WO2014075826A1 Reflector arrangement |
| 05/22/2014 | WO2014075758A1 Video endoscope and method for production thereof |
| 05/22/2014 | US20140142571 Liquid Crystalline Polymer Composition for Melt-Extruded Substrates |
| 05/22/2014 | US20140141629 Connector and flexible printed board |
| 05/22/2014 | US20140141274 Copper foil structure having blackened ultra-thin foil and manufacturing method thereof |
| 05/22/2014 | US20140141238 Process for producing conductive coating film, and conductive coating film |
| 05/22/2014 | US20140140031 Wireless module |
| 05/22/2014 | US20140140030 Conductive material, conductive paste, circuit board, and semiconductor device |
| 05/22/2014 | US20140140029 Display panel and bonding apparatus for manufacturing the same |
| 05/22/2014 | US20140140026 Package substrate and semiconductor package having the same |
| 05/22/2014 | US20140140021 Component Mounting Structure With Flexible Jumper |
| 05/22/2014 | US20140140020 Stretchable and Foldable Electronic Devices |
| 05/22/2014 | US20140140018 Flexible Printed Circuit Connector Protection Structures |
| 05/22/2014 | US20140140016 Power metal mesh and semiconductor memory device and method including the same |
| 05/22/2014 | US20140139508 Display device including line on glass |
| 05/22/2014 | US20140139310 Wiring board |
| 05/22/2014 | US20140138635 Stretchable base plate, stretchable organic light-emitting display device using the same, and method of manufacturing the stretchable base plate and the stretchable organic light emitting display device |
| 05/22/2014 | US20140138253 Composition and method for the deposition of conductive polymers on dielectric substrates |
| 05/22/2014 | US20140138143 Touch window |
| 05/22/2014 | US20140138142 Interposed substrate and manufacturing method thereof |
| 05/22/2014 | US20140138141 Peripheral circuit structure |
| 05/22/2014 | US20140138140 Pcb pad for imager of vehicle vision system |
| 05/22/2014 | US20140138139 Multilayer wiring board and method for manufacturing the same |
| 05/22/2014 | US20140138138 Printed circuit board having electronic component embedded therein |
| 05/22/2014 | US20140138135 Silicon/germanium particle inks, doped particles, printing and processes for semiconductor applications |
| 05/22/2014 | US20140138134 Wiring substrate |
| 05/22/2014 | US20140138133 Transparent Electrode Comprising Electrode Line of High-Viscosity Conductive Nano Ink Composition and Touch Sensor, Transparent Heater and Electromagnetic Wave Shielding Material Using the Transparent Electrode |
| 05/22/2014 | US20140138132 Printed circuit board and manufacturing method thereof |
| 05/22/2014 | US20140138131 Conductive trace hiding materials, articles, and methods |
| 05/22/2014 | US20140138130 Substrate structure having component-disposing area and manufacturing process thereof |
| 05/22/2014 | US20140138129 Substrate having a low coefficient of thermal expansion (cte) copper composite material |
| 05/22/2014 | US20140138128 Low Loss Pre-Pregs and Laminates and Compositions Useful for the Preparation Thereof |
| 05/22/2014 | US20140138127 Circuit board with signal routing layer having consistent impedance |
| 05/22/2014 | US20140138126 Method of manufacturing multilayer printed wiring board and multilayer wiring board obtained thereby |
| 05/22/2014 | US20140138125 Circuit board and method of manufacturing the same, touch panel sensor sheet and screen printing plate |
| 05/22/2014 | US20140138124 Method of manufacturing an electronic high-current circuit by means of gas injection technology and sealing with an insulating polymer |
| 05/22/2014 | US20140138123 Circuit stack structure |
| 05/22/2014 | DE202013100760U1 Kaffeemaschine Coffee machine |
| 05/22/2014 | DE102012221250A1 Lighting apparatus e.g. LED lighting apparatus has support plate that is provided with two adjacent portions which are fixed with semiconductor light sources and connected by bonding wire, and notch formed between adjacent portions |
| 05/22/2014 | DE102012221229A1 Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe The optoelectronic assembly and method of making an optoelectronic assembly |
| 05/22/2014 | DE102012221002A1 Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung Be angled and / or bent circuit board structure comprising at least two circuit board portions, and methods for their preparation |
| 05/22/2014 | DE102012215788B4 Mehrlagige LED-Leiterplatte Multi-layer LED Circuit Board |
| 05/22/2014 | DE102012106135A1 Baluns for use in amplifier unit of high frequency amplifier of e.g. base station of radio system, have layered structure provided with underside that is connected to temperature heat sink element directly or indirectly over metallic layer |
| 05/22/2014 | DE102012022475A1 Videoendoskop und Verfahren zu seiner Herstellung Videoendoscope and process for its preparation |
| 05/21/2014 | EP2734018A1 Electrical vacuum-compatible feedthrough structure and detector assembly using such feedthrough structure |
| 05/21/2014 | EP2733791A1 Connector and flexible printed board |
| 05/21/2014 | EP2733759A1 Multi-layer composite with metal-organic layer |
| 05/21/2014 | EP2733755A1 Circuit board for having semiconductor light emitting device mounted thereon, light emitting module, illuminating apparatus, and illuminating system |
| 05/21/2014 | EP2733528A1 Display device |
| 05/21/2014 | EP2733177A1 Resin composition for printed wiring boards |
| 05/21/2014 | EP2732680A1 Method of manufacturing a printed circuit board or a sub-assembly thereof as well as printed circuit board or a sub-assembly thereof and use thereof |
| 05/21/2014 | EP2732534A2 Rotating electric machine and related packaging method |
| 05/21/2014 | EP2732464A1 Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package |
| 05/21/2014 | CN203608470U 一种汽车集成式中央电器盒 An automobile integrated central electrical box |
| 05/21/2014 | CN203608456U 功率放大器的固定装置 Fixing means of the power amplifier |
| 05/21/2014 | CN203608455U 具有支撑座的电路板 A circuit board having a support base |
| 05/21/2014 | CN203608454U 一种大尺寸对接生产的挠性印制电路板 One kind of large-size docking flexible printed circuit board production |
| 05/21/2014 | CN203608453U 一种柔性印刷线路板及组装结构 A flexible printed circuit boards and assembly structure |
| 05/21/2014 | CN203608452U Smt减法高密度封装多层线路板结构 Smt subtraction high-density packaging multilayer circuit board structure |
| 05/21/2014 | CN203608451U Smt加法高密度封装多层线路板结构 Smt the addition of high-density packaging multilayer circuit board structure |
| 05/21/2014 | CN203608450U 柔性线路板 Flexible circuit boards |
| 05/21/2014 | CN203608449U 一种印制电路板修补铜箔 One of a printed circuit board repair foil |
| 05/21/2014 | CN203608448U 一种聚光光伏光电转换接收器陶瓷电路板 One kind of CPV photoelectric conversion receiver ceramic circuit board |
| 05/21/2014 | CN203608447U 一种led灯珠安装线路板 One kind of led lights bead board installation |
| 05/21/2014 | CN203608446U 一种带保护功能的大电流聚光光伏光电转换接收器 A tape protection feature large current CPV photoelectric conversion receiver |
| 05/21/2014 | CN203608445U 一种聚光光伏光电转换接收器铝基电路板 One kind of CPV photoelectric conversion receiver aluminum board |
| 05/21/2014 | CN203608444U 一种防止ic被静电击伤的fpc An ic was wounded fpc prevent electrostatic |
| 05/21/2014 | CN203608443U 印刷电路和包括该印刷电路的电子模块 Printed circuits and printed circuit comprising an electronic module |
| 05/21/2014 | CN203608194U 一种具有天线和usb接口的线路板及无线收发装置 An antenna and usb interface board and a wireless transceiver device having |
| 05/21/2014 | CN203607457U 一种新型cob基板 A new cob board |
| 05/21/2014 | CN103814628A 用于3d封装的电压调节以及制造其的方法 Voltage regulator for 3d package, and manufacturing method thereof |
| 05/21/2014 | CN103814627A 用于将嵌入的芯片连接到印刷电路板中的方法和设备 Embedding the chip for connecting to a method and apparatus for a printed circuit board |
| 05/21/2014 | CN103814527A 移动终端 The mobile terminal |
| 05/21/2014 | CN103814482A 电路板结构 Circuit board structure |
| 05/21/2014 | CN103814158A 电子部件用金属材料及其制备方法 Electronic components with a metal material and method |
| 05/21/2014 | CN103814100A 粘接剂组合物、膜状粘接剂、粘接片材、电路连接体、电路构件的连接方法、粘接剂组合物的使用、膜状粘接剂的使用以及粘接片材的使用 Using an adhesive composition, the film-like adhesive, adhesive sheet, a circuit-connected body, the circuit member connection method, the use of the adhesive composition, the use of film-like adhesive and bonding the sheet |
| 05/21/2014 | CN103813656A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method |