Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
04/2014
04/16/2014CN203552943U An installation construction body
04/16/2014CN103733741A High-frequency signal line and electronic device
04/16/2014CN103733740A Wiring board
04/16/2014CN103733737A Conductive pattern, method for forming the same, printed wiring board, and manufacturing method of the same
04/16/2014CN103733736A High frequency signal transmission line and electronic device
04/16/2014CN103733524A Tuner module, circuit board, and method for assembling circuit board
04/16/2014CN103733518A Printed circuit board comprising an electrode configuration of an capacitive sensor
04/16/2014CN103733485A Rotating electric machine and related packaging method
04/16/2014CN103733427A High-frequency signal transmission line and electronic equipment
04/16/2014CN103733329A Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module
04/16/2014CN103733293A Thermal overload protection apparatus
04/16/2014CN103733277A Composition set, electroconductive substrate and manufacturing method thereof, and electroconductive binding material composition
04/16/2014CN103732798A Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells
04/16/2014CN103732687A Composition for preparing thermosetting resin and cured article thereof, prepreg including cured article, and metal foil laminated plate and printed wiring board employing prepreg
04/16/2014CN103732558A Alumina ceramic, and ceramic wiring substrate and ceramic package using same
04/16/2014CN103732008A Piece connection circuit board and manufacturing method thereof
04/16/2014CN103731991A Attaching method of steel sheet enhancing sheets of flexible circuit board, jigs of flexible circuit board, and strip attaching steel sheets of flexible circuit board
04/16/2014CN103731985A Motor control device
04/16/2014CN103731984A Rigid flexible circuit board with impedance control structure
04/16/2014CN103731983A Printed circuit board and method for manufacturing the same
04/16/2014CN103731982A Wiring board and method for manufacturing the same
04/16/2014CN103731981A Aluminum magnesium alloy embedded-type circuit board and manufacturing method thereof
04/16/2014CN103731980A Copper clad laminate
04/16/2014CN103731979A Hybrid lamination substrate, manufacturing method thereof and package substrate
04/16/2014CN103731978A Printed circuit board and display device utilizing same
04/16/2014CN103731977A Non-symmetric flex-rigid combination circuit board and manufacturing method thereof
04/16/2014CN103731976A PCB compatible with at least two watchdog circuits
04/16/2014CN103731975A Foldable flexible circuit board, manufacturing method thereof and flexile LED strip-shaped lamp provided with same
04/16/2014CN103731974A Two-layer flexible substrate and printed circuit board using two-layer flexible substrate as base material
04/16/2014CN103731973A High-frequency signal line and method for manufacturing same
04/16/2014CN103731972A Detecting method of drilling depth of PCB and in-process PCB
04/16/2014CN103731971A Shielding structure and method for PCB metal holes
04/16/2014CN103731970A Multilayer electronic structures with improved control of dielectric thickness
04/16/2014CN103730743A Electronic device, method for manufacturing same, and flexible printed circuit board
04/16/2014CN103730742A Single-inserting piece, PCB component, inserting-connection method, single-inserting piece device and inserting piece component
04/16/2014CN103725917A Rolled copper foil
04/16/2014CN103724999A Cyanate resin composition and application thereof
04/16/2014CN103724998A Cyanate resin composition and application thereof
04/16/2014CN103724945A Halogen-free epoxy resin composition and application thereof
04/16/2014CN103221442B Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-p film
04/16/2014CN102775704B Composite dielectric material, its preparation method, plate capacitor and printed circuit board
04/16/2014CN102633952B Resin composition
04/16/2014CN102630126B Compound double-side copper clad laminate and manufacturing method thereof
04/16/2014CN102299085B Packaged semiconductor device having improved locking properties
04/16/2014CN102281715B Board reinforcing structure, board assembly, and electronic device
04/16/2014CN102187525B Printed board, and car-mounted electric connection box containing the printed board
04/16/2014CN102026473B Heat dissipating circuit board and method of manufacturing the same
04/16/2014CN101848601B Printed circuit board and method of manufacturing the same
04/16/2014CN101835342B Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity
04/15/2014US8699234 EMI noise shield board including electromagnetic bandgap structure
04/15/2014US8699233 Circuit module and method of manufacturing the same
04/15/2014US8698305 Multi-configuration GPU interface device
04/15/2014US8698044 Textile structures for heating or warming
04/15/2014US8698009 Printed wiring board and method for manufacturing the same
04/15/2014US8698008 Packaging substrate and fabrication method thereof
04/15/2014US8698007 Printed circuit board
04/15/2014US8698006 Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same
04/15/2014US8698005 Package structure, method for manufacturing same, and method for repairing package structure
04/15/2014US8698004 Multi-piece board and fabrication method thereof
04/15/2014US8698003 Method of producing circuit board, and circuit board obtained using the manufacturing method
04/15/2014US8698002 Conductive member and method for producing the same
04/15/2014US8698000 Substrate for display device and display device
04/15/2014US8697864 Flame retardant compositions with a phosphorated compound
04/15/2014US8696942 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
04/15/2014US8695212 Method for optimizing routing layers and board space requirements for a ball grid array land pattern
04/15/2014DE202014001474U1 UHF- RFID- Transponder UHF RFID transponder
04/15/2014DE202014000710U1 Modulsystem für die Montage und Verdrahtung von elektronischen Bauelementen auf der Oberseite einer Platine Modular system for mounting and wiring of electronic components on the top of a board
04/10/2014WO2014055064A1 Security shield assembly
04/10/2014WO2014054921A1 The printed circuit board and the method for manufacturing the same
04/10/2014WO2014054671A1 Conductive paste, and ceramic substrate produced using same
04/10/2014WO2014054618A1 Silver hybrid copper powder, method for producing same, conductive paste containing silver hybrid copper powder, conductive adhesive, conductive film and electrical circuit
04/10/2014WO2014054572A1 Conductive particle, conductive material and connecting structure
04/10/2014US20140099488 Printed wiring board and method for manufacturing printed wiring board
04/10/2014US20140098509 Electronic device and method for manufacturing thereof
04/10/2014US20140098507 Printed circuit board, semiconductor package using the same, and method for manufacturing the printed circuit board and the semiconductor package
04/10/2014US20140098506 Reduced pth pad for enabling core routing and substrate layer count reduction
04/10/2014US20140098505 Heterogeneous encapsulation
04/10/2014US20140098504 Electroplating method for printed circuit board
04/10/2014US20140098502 Metallization and anodization of plastic and conductive parts of the body of an apparatus
04/10/2014US20140098501 Cover lay film and flexible printed wiring board
04/10/2014US20140098498 Power system and power converting device thereof
04/10/2014US20140098307 Conductive laminate body, touch panel, and display device
04/10/2014US20140097537 Thin film compositions and methods
04/10/2014US20140097525 Circuit boards, methods of fabricating the same, and semiconductor packages including the circuit boards
04/10/2014US20140097408 Flexible display apparatus
04/10/2014US20140097231 Surface treating composition for copper and copper alloy and utilization thereof
04/10/2014US20140097013 Wiring substrate and method for manufacturing wiring substrate
04/10/2014US20140097012 Leadframe for semiconductor packages
04/10/2014US20140097011 Composite component with electrical lines
04/10/2014US20140097010 For Electrical Circuits
04/10/2014US20140097009 Wiring substrate
04/10/2014US20140097008 Method of Growing Electrically Conductive Tissue
04/10/2014US20140097007 Wiring substrate and method for producing the same
04/10/2014US20140097006 Etchant composition, metal wiring, and method of manufacturing a display substrate
04/10/2014US20140097005 Glass Wiring Board
04/10/2014US20140097004 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
04/10/2014US20140097003 Electrical components and methods and systems of manufacturing electrical components
04/10/2014US20140097002 Electrical components and methods and systems of manufacturing electrical components
04/10/2014DE112012002850T5 Leiterplatte und Herstellungsverfahren für eine Leiterplatte Printed circuit board and manufacturing method of a printed circuit board
04/10/2014DE112012002828T5 Leiterplatte Circuit board
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