Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
04/2014
04/03/2014WO2014051233A2 Printed circuit board
04/03/2014WO2014051066A1 Silver ink composition, conductor and communication device
04/03/2014WO2014050871A1 Method for producing multilayer substrate, multilayer insulating film, and multilayer substrate
04/03/2014WO2014050657A1 Laminate, electroconductive pattern, and electric circuit
04/03/2014WO2014050555A1 Conductive paste and printed wiring board
04/03/2014WO2014050539A1 Composition for forming conductive film and method for producing conductive film
04/03/2014WO2014050466A1 Method for producing conductive film and composition for forming conductive film
04/03/2014WO2014050420A1 Epoxy resin, curable resin composition, cured product thereof, and printed circuit board
04/03/2014WO2014050419A1 Epoxy resin, curable resin composition, cured product thereof, and printed circuit board
04/03/2014WO2014049721A1 Component-embedded substrate manufacturing method and component-embedded substrate manufactured with said method
04/03/2014WO2014049537A1 Planar electric board with pliable wings and system for sensing components along three coordinate axis of inner forces in a block made of a building material
04/03/2014WO2014048111A1 Printed circuit board, and drilling method and device for printed circuit board
04/03/2014WO2013189373A3 Terminal with internal heat dissipation
04/03/2014US20140094222 Circuit structure
04/03/2014US20140093743 Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used For Said Laminate
04/03/2014US20140093736 Resin composition, prepreg, and metal foil-clad laminate
04/03/2014US20140093723 Substrate, method for producing same, heat-releasing substrate, and heat-releasing module
04/03/2014US20140092576 Film interposer for integrated circuit devices
04/03/2014US20140092575 Zero-length or near-zero-length lead for electrical component
04/03/2014US20140092573 Contact protection for integrated circuit device loading
04/03/2014US20140092572 Bga structure using ctf balls in high stress regions
04/03/2014US20140092569 Wiring board
04/03/2014US20140092034 Electronic Devices With Flexible Circuit Light Shields
04/03/2014US20140091784 Artificial Defect for Eddy Current Inspection
04/03/2014US20140090884 Elastic conductive material
04/03/2014US20140090882 Pad structure
04/03/2014US20140090881 Passive device embedded in substrate and substrate with passive device embedded therein
04/03/2014US20140090880 Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same
04/03/2014US20140090879 Embedded architecture using resin coated copper
04/03/2014US20140090878 Printed wiring board and method for manufacturing the same
04/03/2014US20140090877 Method for manufacturing printed wiring board and printed wiring board
04/03/2014US20140090876 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
04/03/2014US20140090698 Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body
04/03/2014US20140090243 In-Situ Fold-Assisting Frame for Flexible Substrates
04/03/2014DE102012216148A1 Electronic circuit device for use in electronic commutated electromotor, has electrical conductive connection unit extending between electrical bonding surfaces and electrically connected with one another
04/03/2014DE102012216101A1 Verfahren zum Herstellen einer in einem Substrat integrierten oder auf einem Substrat aufgebrachten Spule und elektronisches Gerät A method of fabricating an integrated in a substrate or applied to a substrate coil and electronic device
04/02/2014EP2713683A1 Method for manufacturing circuit board, circuit board and electronic apparatus
04/02/2014EP2712491A2 Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same
04/02/2014CN203523150U Circuit connection plate
04/02/2014CN203523149U LED layout circuit
04/02/2014CN203523148U PCB (printed circuit board) jointed plate
04/02/2014CN203523147U Rigid-flexible PCB
04/02/2014CN203523146U Box type electronic device
04/02/2014CN203523145U Pcb
04/02/2014CN203523144U Circuit board for near field communication antenna
04/02/2014CN203523143U Flexible circuit board
04/02/2014CN203523142U Anticorrosive aluminum substrate
04/02/2014CN203523141U Flexible circuit board and TV set
04/02/2014CN203523140U HDI plate capable of realizing quick detection on conduction of crossed blind and buried holes
04/02/2014CN203523139U Novel printed circuit board
04/02/2014CN203523138U Electroplating capability test module for HDI plate
04/02/2014CN203523137U Circuit board and electronic device
04/02/2014CN203523136U CTP touch assembly
04/02/2014CN203523135U Remote controller with quincunx metal domes
04/02/2014CN203523134U High-frequency partial hybrid board
04/02/2014CN203523133U Circuit board system with mechanical protection
04/02/2014CN203523132U Flexible circuit board
04/02/2014CN203523131U Multilayer flexible circuit board
04/02/2014CN203521395U Circuit arrangement structure capable of reducing temperature rising of transistor
04/02/2014CN203521391U Flexible substrate prefabricated assembly
04/02/2014CN203516387U Nut and electronic product
04/02/2014CN103703874A Wiring board incorporating electronic component, and method for manufacturing wiring board incorporating electronic component
04/02/2014CN103703872A Compact, thermally-enhanced substrate for lighting applications
04/02/2014CN103703871A Circuit board and multi-cavity circuit board
04/02/2014CN103703610A Wireless module
04/02/2014CN103703526A Electronic component
04/02/2014CN103703314A Modular lighting assembly adapter part
04/02/2014CN103702515A High-power LED (light emitting diode) lamp bead metal substrate structure and manufacturing method thereof
04/02/2014CN103702514A Colored metal-based printed board and manufacturing method thereof
04/02/2014CN103702513A Carrier film suitable for single-sided flexible circuit board, as well as preparation method and application thereof
04/02/2014CN103702512A Unnotched half etching steel strap and manufacturing method thereof
04/02/2014CN103702511A High thermal conductivity metal substrate and manufacturing method thereof
04/02/2014CN103702510A Circuit system
04/02/2014CN103702509A Step-shaped circuit board and manufacturing method thereof
04/02/2014CN103702508A Flexible printed circuit board and circuit-board connection structure
04/02/2014CN103702507A Transmission line system
04/02/2014CN103700642A Flip-chip packaging structure
04/02/2014CN103700499A Laminated chip electronic component, board for mounting the same, and packing unit thereof
04/02/2014CN103699263A Touch screen FPC (flexible printed circuit)
04/02/2014CN103694925A Circuit board adhesive layer
04/02/2014CN103694702A Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
04/02/2014CN103694701A Polyamide acid combination, polyimide combination, laminated body, circuit board, usage thereof, laminated body and manufacturing method of the laminated body
04/02/2014CN103694642A Thermosetting resin composition and application thereof
04/02/2014CN103694631A Halogen-free epoxy resin composition and cover film prepared by using halogen-free epoxy resin composition
04/02/2014CN102687600B High-frequency signal line
04/02/2014CN102573329B Method for fabricating conductive column of circuit board, system and circuit board
04/02/2014CN102438413B Second-order ladder groove bottom graphical printed board and processing method thereof
04/02/2014CN102372900B Epoxy resin composition, and prepreg material and printed circuit board prepared from the same
04/02/2014CN102361532B Multilayer printed circuit board and manufacturing process thereof
04/02/2014CN102340929B Single-sided circuit board made by respectively hot-pressing insulating layers on two sides of flat wires
04/02/2014CN102291974B Cutting side positioning type welding structure and method for preventing pins from shifting
04/02/2014CN102264213B Method for combining thermal module
04/02/2014CN102177627B Electrostatic discharge protector
04/02/2014CN102160245B Ground termination with dampened resonance
04/02/2014CN101983003B 电路板 Circuit board
04/02/2014CN101580659B Printable compound containing silver nanometer particles, method for producing electrical conducting coatings and prepared coatings
04/01/2014US8687380 Wiring board and method for manufacturing the same
04/01/2014US8687379 Signal conversion device with dual chip
04/01/2014US8687373 Card structure, socket structure, and assembly structure thereof
04/01/2014US8687372 Flexible circuit assembly with wire bonding
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