Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
05/2014
05/21/2014CN103813654A 印刷电路板及其塞孔方法 Printed circuit board and plug hole method
05/21/2014CN103813650A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813649A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813648A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813647A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813646A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813640A 一种全印制电路板及其制造方法 A fully printed circuit board and its manufacturing method
05/21/2014CN103813637A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813636A 电子部件内置基板 An electronic component-embedded board
05/21/2014CN103813635A 高频电路模块 High-frequency circuit module
05/21/2014CN103813634A 具有埋入式连接杆的电路板及其制造方法 The method of manufacturing a circuit board having embedded connecting rod
05/21/2014CN103813633A 电路板、led 发光模块、led 发光装置及灯具 Circuit board, led light module, led light-emitting device and lighting
05/21/2014CN103813632A 电路板封装结构及其制造方法 Board packaging structure and manufacturing method
05/21/2014CN103813631A 布线基板和布线基板的制造方法 The method of manufacturing a wiring substrate and a printed circuit board
05/21/2014CN103813630A 复合布线板及复合布线板的制造方法 Method of manufacturing a composite wiring board and the composite wiring board
05/21/2014CN103813629A 配线材料及其制造方法 Wiring Materials and Methods
05/21/2014CN103813628A 带电路的悬挂基板集合体板及其制造方法 A substrate assembly with circuit board and its manufacturing method of a suspension
05/21/2014CN103813627A 多层电路基板 The multilayer circuit board
05/21/2014CN103813626A 电路板组件、电路板及灯具 Circuit board assembly, circuit boards and lamps
05/21/2014CN103813625A 印制电路板焊盘 Printed circuit board pad
05/21/2014CN103813624A 软性电路板 Flexible circuit board
05/21/2014CN103813623A 带有镀铜层的轧制铜箔 Rolled copper foil with a copper layer
05/21/2014CN103813622A 电路板及其制造方法 The circuit board and its manufacturing method
05/21/2014CN103813621A 电路板和该电路板的制造方法 And a method of manufacturing a circuit board of the circuit board
05/21/2014CN103813620A 复合布线板 Composite wiring board
05/21/2014CN103813619A 高电位电路板及其所属电子器件的防晕板 High potential circuit boards of electronic devices and their respective anti-corona board
05/21/2014CN103813618A 底座固定装置 Base fixtures
05/21/2014CN103813617A 线路板及其制作方法与具有此线路板的光电装置 Board and its production method and has a photoelectric device for this circuit board
05/21/2014CN103813616A 复合式叠构覆盖膜及具有该覆盖膜的电路板及其制法 Composite film having a stacked structure of the cover film covering the circuit board and its preparation method
05/21/2014CN103813615A 软性电路板结构及具有此软性电路板结构的电子装置 Flexible circuit board structure and electronic device with this flexible circuit board structure
05/21/2014CN103813614A Pcb板、用于制造pcb板的芯板和用于制造pcb板的方法 Pcb board, used in the manufacture pcb board pcb board core and a method for manufacturing
05/21/2014CN103813613A 电路板组合 Circuit board assembly
05/21/2014CN103813612A 覆金属层叠板、印制电路板、多层印制电路板 Metal clad laminated boards, printed circuit boards, multilayer printed circuit boards
05/21/2014CN103812798A 均衡器 Equalizer
05/21/2014CN103811179A 多层陶瓷电子部件及用于安装该电子部件的板 The multilayer ceramic electronic component and the board for mounting the electronic component
05/21/2014CN103811171A 多层陶瓷电容器、电路板的安装结构以及封装单元 The multilayer ceramic capacitor mounting structure and a circuit board packaging unit
05/21/2014CN103810940A 显示装置 The display device
05/21/2014CN103809678A 电子设备 Electronic Equipment
05/21/2014CN103809674A 存储设备 Storage devices
05/21/2014CN103809673A 电子设备 Electronic Equipment
05/21/2014CN103809671A 图形卡及用于其的基板和核心板 Graphics cards and board and for its core board
05/21/2014CN103809237A 光电混载基板 Opto
05/21/2014CN103807832A 基于柔性电路的led灯及其制造方法 Led lights and a manufacturing method based on flexible circuits
05/21/2014CN103802409A 层叠板、覆金属层叠板、印制电路板、多层印制电路板 Laminated panels, metal clad laminated board, printed circuit boards, multilayer printed circuit boards
05/21/2014CN103802390A 覆铜层压板及其制备方法和包括该覆铜层压板的印刷电路板 Copper-clad laminates and preparation method and include the copper-clad laminate printed circuit boards
05/21/2014CN102364383B 液晶显示面板及液晶显示设备 The liquid crystal display panel and a liquid crystal display device
05/20/2014US8730647 Printed wiring board with capacitor
05/20/2014US8729407 Wiring substrate and method for manufacturing wiring substrate
05/20/2014US8729406 Method of fabricating a printed circuit board
05/20/2014US8729405 Wiring board and method for manufacturing the same
05/20/2014US8729404 Method and apparatus for optically transparent via filling
05/20/2014US8729403 Electronic apparatus
05/20/2014US8729402 Polyimide precursor composition, use of the of the same, and production method of the same
05/20/2014US8729401 Wiring substrate and method of manufacturing the same
05/20/2014US8729400 Multilayer printed wiring board
05/20/2014US8729399 Flat cable and method for fabricating the same
05/20/2014US8729398 Electrical assembly with compliant pins for heat dissipation
05/20/2014US8729397 Embedded structure
05/20/2014US8729395 Wire bonding joint structure of joint pad, and method for preparing the same
05/20/2014US8728964 Glass composition with low coefficient of thermal expansion, and glass fiber produced from same
05/20/2014US8728615 Transparent conductive film and method of fabricating the same, transparent conductive base material, and light-emitting device
05/20/2014CA2565644C Led pool and spa light
05/15/2014WO2014074045A1 Heat dissipation assembly
05/15/2014WO2014073813A1 Interposer, and method for manufacturing same
05/15/2014WO2014073789A1 Resin composition, and laminate for printed circuit board comprising same
05/15/2014WO2014073696A1 Surface-treated copper foil and laminate using same
05/15/2014WO2014073695A1 Surface-treated copper foil and laminate using same
05/15/2014WO2014073694A1 Surface-treated copper foil and laminate using same, copper-clad laminate, printed circuit board, and electronic device
05/15/2014WO2014073693A1 Surface-treated copper foil and laminate using same
05/15/2014WO2014073692A1 Surface-treated copper foil and laminate using same, printed circuit board, and copper-clad laminate
05/15/2014WO2014073604A1 Glass ceramic substrate and housing for portable electronic equipment using substrate
05/15/2014WO2014073530A1 Conductive paste composition
05/15/2014WO2014073504A1 Display device
05/15/2014WO2014073421A1 Capacitor holder and capacitor holding structure
05/15/2014WO2014073085A1 Wiring board and method for manufacturing same
05/15/2014WO2014072038A1 Circuit board element and cell arrangement
05/15/2014WO2013034128A8 Conductor track unit for a motor vehicle
05/15/2014US20140133120 Substrate with built-in electronic component
05/15/2014US20140133119 Wiring board and method for manufacturing the same
05/15/2014US20140133118 Component-embedded board and method of manufacturing same
05/15/2014US20140133117 High frequency circuit module
05/15/2014US20140133116 Grounding gasket and electronic apparatus
05/15/2014US20140133115 Multilayer wiring board
05/15/2014US20140133114 Multilayer circuit substrate
05/15/2014US20140133111 Combined wiring board and method for manufacturing combined wiring board
05/15/2014US20140133110 Combined wiring board
05/15/2014US20140133107 Thin film type chip device and method for manufacturing the same
05/15/2014US20140133103 High frequency circuit module
05/15/2014US20140133101 Signal Transmission Device
05/15/2014US20140133075 Microelectronic substrate for alternate package functionality
05/15/2014US20140131889 Flexible printed circuit board for packaging semiconductor device and method of producing the same
05/15/2014US20140131085 Circuit board having tie bar buried therein and method of fabricating the same
05/15/2014US20140131084 Capacitor embedded substrate
05/15/2014US20140131083 Printed circuit board and method for manufacturing the same
05/15/2014US20140131082 Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor mounted thereon, and packing unit for multilayered ceramic capacitor
05/15/2014US20140131080 Surface treating composition for copper and copper alloy and utilization thereof
05/15/2014US20140131079 Conductive Nano Ink Composition and Electrode Line and Transparent Electrode Using the Same
05/15/2014US20140131078 Method of Manufacturing A Patterned Transparent Conductor
05/15/2014US20140131077 Device for electrical characterization of molecules using cnt-nanoparticle-molecule-nanoparticle-cnt structure
05/15/2014US20140131076 Ceramic substrate composite and method for manufacturing ceramic substrate composite
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