| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/30/2014 | CN103763856A Master control circuit board for automobile combined instrument development |
| 04/30/2014 | CN103763855A Photoelectric printed board and manufacturing method thereof |
| 04/30/2014 | CN103763854A Printed circuit board and manufacturing method thereof |
| 04/30/2014 | CN103763853A Multi-layer flexible printed circuit board |
| 04/30/2014 | CN103763852A Power panel and main board with power panel |
| 04/30/2014 | CN103763851A Dustproof heat-conduction circuit board |
| 04/30/2014 | CN103763850A Protection cover for circuit board |
| 04/30/2014 | CN103763849A High-heat radiation copper-based circuit board |
| 04/30/2014 | CN103763848A Mixed signal system three-dimensional packaging structure based on digital-analog mixture requirements and manufacturing method |
| 04/30/2014 | CN103756315A Thermosetting resin composition and applications thereof |
| 04/30/2014 | CN103756257A Thermosetting epoxy resin composition and use thereof |
| 04/30/2014 | CN103755989A Circuit substrate and preparation method thereof |
| 04/30/2014 | CN103053225B High-frequency signal line and electronic device |
| 04/30/2014 | CN102822304B Resin composition for adhesive agent, adhesive agent and adhesive sheet each comprising same, and printed circuit board comprising same as adhesive agent layer |
| 04/30/2014 | CN102413633B Apparatus for detecting misregistration of multilayer circuit board and method thereof |
| 04/30/2014 | CN102265710B Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using rolled copper foil or electrolytic copper foil |
| 04/30/2014 | CN102238802B Circuit board assembly |
| 04/30/2014 | CN102083277B Printed circuit board and wiring method thereof |
| 04/30/2014 | CN102066864B Heat pipe, method of manufacturing heat pipe, and circuit board with heat pipe function |
| 04/30/2014 | CN102056401B 印刷电路板 A printed circuit board |
| 04/30/2014 | CN102045939B Metal layer structure of flexible multilayer base plate and preparation method thereof |
| 04/29/2014 | US8713228 Shared system to operationally connect logic nodes |
| 04/29/2014 | US8711575 Printed circuit board unit having routing unit mounted thereon and computer device having the same |
| 04/29/2014 | US8711573 Using interrupted through-silicon-vias in integrated circuits adapted for stacking |
| 04/29/2014 | US8711572 Circuit board having semiconductor chip embedded therein |
| 04/29/2014 | US8711570 Flexible circuit routing |
| 04/29/2014 | US8711108 Direct connect single layer touch panel |
| 04/29/2014 | US8710664 Wafer-level chip scale package |
| 04/29/2014 | US8710377 Electric connection box |
| 04/29/2014 | US8710374 Printed wiring board with reinforced insulation layer and manufacturing method thereof |
| 04/29/2014 | US8710373 Bundled flexible cable with water resistant structure |
| 04/29/2014 | US8709185 Functional textile structures |
| 04/24/2014 | WO2014062343A1 Tape-on retrofit leds for fluorescent troffers |
| 04/24/2014 | WO2014062301A1 Methods and apparatus for reducing the occurrence of metal whiskers |
| 04/24/2014 | WO2014062014A1 Surface-mounted clamp |
| 04/24/2014 | WO2014061983A1 Electrolytic copper foil, electric part and battery including same, and method for manufacturing same |
| 04/24/2014 | WO2014061812A1 Resin composition, prepreg, laminate, and printed wiring board |
| 04/24/2014 | WO2014061811A1 Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board |
| 04/24/2014 | WO2014061765A1 Electroconductive paste |
| 04/24/2014 | WO2014061483A1 Conductive pattern member and method for manufacturing conductive pattern member |
| 04/24/2014 | WO2014061450A1 Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film |
| 04/24/2014 | WO2014059654A1 Cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same |
| 04/24/2014 | WO2014059653A1 Cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same |
| 04/24/2014 | WO2014059632A1 Photoelectronic device |
| 04/24/2014 | US20140113518 Prepreg, metal foil-clad laminate, and printed wiring board |
| 04/24/2014 | US20140113415 Method of manufacturing circuit board and chip package and circuit board manufactured by using the method |
| 04/24/2014 | US20140113121 Metal foil composite, flexible printed circuit, formed product and method of producing the same |
| 04/24/2014 | US20140113118 Halogen-free resin composition and application thereof |
| 04/24/2014 | US20140112015 Electronic unit |
| 04/24/2014 | US20140111957 Three-dimensional backplane |
| 04/24/2014 | US20140111955 High efficiency embedding technology |
| 04/24/2014 | US20140111954 Foldable display device |
| 04/24/2014 | US20140111951 High performance vertical interconnection |
| 04/24/2014 | US20140111946 Arrangement for cooling subassemblies of an automation or control system |
| 04/24/2014 | US20140111945 Circuit board |
| 04/24/2014 | US20140111926 Printed circuit board features of a portable computer |
| 04/24/2014 | US20140111908 Method and apparatus for multiple input power distribution to adjacent outputs |
| 04/24/2014 | US20140111711 Conductive sheet, touch panel, display device, method for producing said conductive sheet, and non-transitory recording medium |
| 04/24/2014 | US20140111704 Television receiver, electronic apparatus, and substrate assembly |
| 04/24/2014 | US20140111684 Antenna Structures and Electrical Components with Grounding |
| 04/24/2014 | US20140111264 Printed circuit board and method for controlling signal timing sequence thereof |
| 04/24/2014 | US20140110832 Co-support circuit panel and microelectronic packages |
| 04/24/2014 | US20140110162 Stacked packages using laser direct structuring |
| 04/24/2014 | US20140110161 Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure |
| 04/24/2014 | US20140110160 Multilayer ceramic substrate and manufacturing method therefor |
| 04/24/2014 | US20140110159 Stress-reduced circuit board and method for forming the same |
| 04/24/2014 | US20140110158 Carbon fiber spacecraft panel with integral metallic foil power return |
| 04/24/2014 | US20140110157 Printed Circuit Board Module and Module Side Wall |
| 04/24/2014 | US20140110156 Heat radiating substrate and method of manufacturing the same |
| 04/24/2014 | US20140110155 Flexible multilayer substrate |
| 04/24/2014 | US20140110154 Bus apparatus for use with circuit interrupters or other devices |
| 04/24/2014 | US20140110153 Wiring board and method for manufacturing the same |
| 04/24/2014 | US20140110152 Printed circuit board and method for manufacturing same |
| 04/24/2014 | DE112012002829T5 Mehrschichtige Leiterplatte und Verfahren zum Herstellen einer mehrschichtigen Leiterplatte Multilayer printed wiring board and method for producing a multilayer printed circuit board |
| 04/24/2014 | DE102013220543A1 Elektronische vorrichtung Electronic device |
| 04/24/2014 | DE102013111569A1 Semiconductor package of semiconductor system, has chip that is provided with several contact pads on first major surface, and substrate that is located in first Vias tab that is provided with first antenna structure |
| 04/24/2014 | DE102013111286A1 Wärmeableitungsstruktur für eine Multilayer-Platine und Verfahren zur Herstellung dieser Struktur Heat dissipation structure for a multilayer board and method for producing this structure |
| 04/24/2014 | DE102012219131A1 Connection assembly for two contact elements used in gear box of motor car, has electrically leading filling material to electrically and mechanically interconnect plated-through holes of contact regions of contact elements |
| 04/23/2014 | EP2722589A2 Angled emitter channel letter lighting |
| 04/23/2014 | EP2722417A1 Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells |
| 04/23/2014 | EP2721114A1 Silver-containing aqueous ink formulation for producing electrically conductive structures, and ink jet printing method for producing such electrically conductive structures |
| 04/23/2014 | CN203563261U Electromagnetic oven and circuit board of electromagnetic oven |
| 04/23/2014 | CN203563260U Induction cooker and circuit board thereof |
| 04/23/2014 | CN203563259U Circuit board and electric heating apparatus comprising same |
| 04/23/2014 | CN203563258U Connecting structure of double-element substrate |
| 04/23/2014 | CN203563257U Protective cover with humiture sensor circuit board |
| 04/23/2014 | CN203563256U PCB board and household electrical appliance provided with same |
| 04/23/2014 | CN203562272U Integrated magnetic component and integrated LED driving power |
| 04/23/2014 | CN203562211U Constantan wire, circuit board assembly and electromagnetic oven |
| 04/23/2014 | CN103748977A Component-mounting printed circuit board and manufacturing method for same |
| 04/23/2014 | CN103748973A Terminal unit with security features |
| 04/23/2014 | CN103748672A Substrate, method for producing same, heat-releasing substrate, and heat-releasing module |
| 04/23/2014 | CN103748413A Hybrid solid state emitter printed circuit board for use in a solid state directional lamp |
| 04/23/2014 | CN103748251A Rolled copper foil |
| 04/23/2014 | CN103748048A Compositions for low K, low temperature co-fired composite (LTCC) tapes and low shrinkage, multi-layer LTCC structures formed therefrom |
| 04/23/2014 | CN103747637A PCB (printed circuit board) machining method and PCB |
| 04/23/2014 | CN103747623A Printed circuit board with small-spacing bonding pads and preparation method thereof |
| 04/23/2014 | CN103747616A Method for manufacturing module with built-in component, and module with built-in component |
| 04/23/2014 | CN103747615A Power supply module structure and electronic device therewith |
| 04/23/2014 | CN103747614A Multi-sample-based spliced board and production process for same |