Patents for H05K 1 - Printed circuits (98,583)
06/2006
06/15/2006US20060127685 Layered polyimide/metal product
06/15/2006US20060127568 Multi-layer ceramic substrate and method for manufacture thereof
06/15/2006US20060126354 Automobile led light
06/15/2006US20060126316 Control circuit board and circuit structural body
06/15/2006US20060126313 Electronic component with a housing package
06/15/2006US20060126196 Transparent window with non-transparent contact surface for a soldering bonding
06/15/2006US20060125573 Novel radio frequency (RF) circuit board topology
06/15/2006US20060125103 Information handling system
06/15/2006US20060125076 Circuit boards, electronic devices, and methods of manufacturing thereof
06/15/2006US20060125061 Board or substrate for an organic electronic device and use thereof
06/15/2006US20060124583 Plating a resistive material onto a portion of the insulative substrate which is between the metallic areas, such that the resistive material connects the metallic areas, and thereafter trimming at least a portion of the resistive material from the insulative substrate
06/15/2006US20060124351 Flexible multilayer wiring board and manufacture method thereof
06/15/2006US20060124350 Electronic module comprising an element exposed on one surfce and method for making same
06/15/2006US20060124349 Diamond-coated silicon and electrode
06/15/2006US20060124348 Printed circuit board with insulative area for electrostatic discharge damage prevention
06/15/2006US20060124347 Electronic parts packaging structure and method of manufacturing the same
06/15/2006US20060124346 Current collection board for fuel cell
06/15/2006US20060124345 Method for manufacturing board with built-in device and board with built-in device and method for manufacturing printed wiring board and printed wiring board
06/14/2006EP1670300A2 Printed wiring board and manufacturing method of printed wiring board
06/14/2006EP1670296A1 Flexible circuit board, electronic circuit device, and mobile communication terminal
06/14/2006EP1670295A2 Ceramic substrate, ceramic package for housing light emitting element
06/14/2006EP1670091A1 Dielectric resonator, oscillator and transmitter/receiver
06/14/2006EP1669418A1 Spherical coated magnesium oxide powder and method for production thereof, and resin composition comprising the powder
06/14/2006EP1669412A1 Resin composition for composite dielectric body, composite dielectric body, and electrical circuit board using such composite dielectric body
06/14/2006EP1668898A1 Electronic device having bezel structure
06/14/2006EP1668698A1 Plastically deformable cooling body for electric and/or electronic components
06/14/2006EP1668697A2 Electrical circuit apparatus and methods for assembling same
06/14/2006EP1668056A2 Epoxy resin compositions, processes utilzing same and articles made therefrom
06/14/2006EP1401659B1 Corrosion prevention for cac component
06/14/2006EP1310107B1 Apparatus and method of replacing telephony cards without down time
06/14/2006EP1163292B1 Electrically conductive flexible composition, methods of making same
06/14/2006DE202005002017U1 Transponder e.g. active transponder, has connecting units guided through passages of chip carrier and antenna and flexibly formed as copper filament to sew together end region of antenna and terminal unit of antenna and/or chip and antenna
06/14/2006DE10237994B4 Systemplatine mit Steuereinheit und Verbindern System board controller and connectors
06/14/2006DE10204429B4 Elektronische Komponente und Herstellungsverfahren dafür Electronic component and manufacturing method thereof
06/14/2006DE102004058335A1 Substrat Substratum
06/14/2006CN2788317Y Lamination chip structure improvement
06/14/2006CN2787996Y LED linear lighting lamp
06/14/2006CN1788531A Connection structure of inner conductor and multilayer substrate
06/14/2006CN1788530A Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same
06/14/2006CN1788529A Method and device for aligning a substrate and a printing screen during solder paste printing
06/14/2006CN1788388A Radiating slit antenna system.
06/14/2006CN1788322A Aluminum alloy wiring material having high resistance to heat and target material
06/14/2006CN1788275A Method for mounting an electronic component on a substrate
06/14/2006CN1788111A Low surface roughness electrolytic copper foil and process for producing the same
06/14/2006CN1788053A Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards
06/14/2006CN1787726A Method for drilling deep hole and PCB product obtained by same method
06/14/2006CN1787723A Printed circuit substrate
06/14/2006CN1787722A Wiring structure for multilayer printed circuit board and mfg. method thereof
06/14/2006CN1787721A Method for positioning power controlling device of electric driving power electronic power converter and apparatus thereof
06/14/2006CN1259812C Method and system for eliminating noise and its disturbance by printing circuit board ground wiring
06/14/2006CN1259809C Thin circuit board and method for mfg. same
06/14/2006CN1259802C Element for electromagnetic shielding and method for mfg. thereof
06/14/2006CN1259775C Design, allocation and manufacturing method of shunting differential signal circuit
06/14/2006CN1259651C Flexible printed circuit board
06/14/2006CN1259200C Card type recording medium and production method therefor
06/13/2006US7062742 Routing structure for transceiver core
06/13/2006US7062354 Multi-layer printed circuit board fabrication system and method
06/13/2006US7062144 Architecture of connecting optical PCB, transceiver modules for optical PCB and optical connection block
06/13/2006US7062117 Layered board, and apparatus incorporated such layered board
06/13/2006US7061774 Computer board with dual shield housing and heat sink expansion zone apparatuses
06/13/2006US7061772 Electronic circuit with transmission line type noise filter
06/13/2006US7061771 Mechanism to cross high-speed differential pairs
06/13/2006US7061599 Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates
06/13/2006US7061361 Circuit board assembly and flat coil
06/13/2006US7061347 High frequency substrate comprised of dielectric layers of different dielectric coefficients
06/13/2006US7061342 Differential transmission channel link for delivering high frequency signals and power
06/13/2006US7061257 Probe card assembly
06/13/2006US7061178 Plasma display
06/13/2006US7061122 Components, methods and assemblies for multi-chip packages
06/13/2006US7061116 Arrangement of vias in a substrate to support a ball grid array
06/13/2006US7061109 Semiconductor substrate-based BGA interconnection for testing semiconductor devices
06/13/2006US7061106 Structure of image sensor module and a method for manufacturing of wafer level package
06/13/2006US7061100 Semiconductor built-in millimeter-wave band module
06/13/2006US7061095 Printed circuit board conductor channeling
06/13/2006US7061094 Multilayer printed circuit board including first and second signal traces and a first ground trace
06/13/2006US7060912 Circuit board and method of making circuit board
06/13/2006US7060911 Conductor strip formed with slit, cutout or grooves
06/13/2006US7060909 Composition for forming low dielectric constant insulating film, method of forming insulating film using the composition and electronic parts having the insulating film produced thereby
06/13/2006US7060784 Polyimide precursor resin solution composition sheet
06/13/2006US7060595 Circuit substrate and fabrication method thereof
06/13/2006US7060537 Microchip controller board manufacturing method
06/13/2006US7060513 Method of testing FPC bonding yield and FPC having testing pads thereon
06/13/2006US7060512 Patching methods and apparatus for fabricating memory modules
06/13/2006US7060418 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit
06/13/2006US7060364 Film carrier tape for mounting electronic devices thereon
06/13/2006US7060350 Composite magnetic material and magnetic molding material, magnetic powder compression molding material, and magnetic paint using the composite magnetic material, composite dielectric material and molding material, powder compression molding material, paint, prepreg, and substrate using the composite dielectric material, and electronic part
06/13/2006US7060204 Dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent
06/13/2006US7059919 Power connector
06/13/2006US7059866 integrated circuit contact to test apparatus
06/13/2006US7059049 Electronic package with optimized lamination process
06/13/2006US7059044 Method and material for manufacturing circuit-formed substrate
06/13/2006US7059042 Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink
06/13/2006CA2447893C Circuit board mounting system and releasable connector therefor
06/08/2006WO2006060495A1 Bga to lga interposer
06/08/2006WO2006060485A1 Methods for assembling a stack package for high density integrated circuits
06/08/2006WO2006059951A1 Resonator for a voltage controlled oscillator and manufacturing method thereof
06/08/2006WO2006059924A1 A printed circuit board with combined digital and high frequency applications
06/08/2006WO2006059706A1 Printed board and designing method therefor and ic package terminal designing method and connecting method therefor
06/08/2006WO2006059510A1 Optical wiring substrate and optical and electric combined substrate
06/08/2006WO2006059427A1 Multilayer printed circuit board and method for manufacturing same