Patents for H05K 1 - Printed circuits (98,583)
03/2008
03/06/2008US20080053688 Printed circuit board and method of manufacturing the same
03/06/2008US20080053687 Printed circuit board able to suppress simultaneous switching noise
03/06/2008US20080053686 Wired circuit board and production method thereof
03/06/2008US20080052904 Method Of Manufacturing An Electronic Circuit Assembly
03/05/2008EP1895821A1 Printed wiring board with component-mounting pins and electronic equipment using the same
03/05/2008EP1895820A2 Wired circuit board and production method thereof
03/05/2008EP1895589A2 Semiconductor package substrate
03/05/2008EP1895587A2 Semiconductor package substrate
03/05/2008EP1895586A2 Semiconductor package substrate
03/05/2008EP1895584A1 Thermally conductive substrate with leadframe and heat radiation plate and manufacturing method thereof
03/05/2008EP1895032A2 Silicone-based fiber, nonwoven fabric formed therefrom, and methods of producing same
03/05/2008EP1895024A1 Copper foil for printed wiring board
03/05/2008EP1894967A1 Filler for substrate and composition for use as material for inorganic/organic composite substrate formation
03/05/2008EP1894454A1 Transmission line
03/05/2008EP1894452A1 Passive electrical article
03/05/2008EP1894451A1 Dielectric substrate with holes and method of manufacture
03/05/2008EP1894277A1 Electrical interconnection system
03/05/2008EP1730566A4 Flexible active signal cable
03/05/2008EP1634342A4 Method of fabricating electronic interconnect devices using direct imaging of dielectric material
03/05/2008EP1472078A4 Thermal barriers with reversible enhanced thermal properties
03/05/2008EP1440607B1 Carrier arrangement for carrying optical components and connecting optical signals and method of manufacturing the same
03/05/2008EP1247432B1 Electronic ballast and electronic transformer
03/05/2008EP1053214B1 Polymer compound, the production and use thereof, and sintered compacts produced therefrom
03/05/2008EP0774498B1 Aqueous fluoropolymer dispersion
03/05/2008EP0692136B2 High strength conductive polymers
03/05/2008CN201032087Y Illumination structure of flexible and non-limiting figure
03/05/2008CN201032075Y High-energy conservation high-brightness LED sunlight lamp
03/05/2008CN101138089A Stacked type semiconductor device and method for fabricating the same
03/05/2008CN101137894A Method and apparatus for venting an electronic control module
03/05/2008CN101137273A Printed circuit board connection structure, high-frequency unit, method of connecting printed circuit boards, and method of manufacturing high-frequency unit
03/05/2008CN101137272A Wired circuit board and production method thereof
03/05/2008CN101137271A Printed circuit boards
03/05/2008CN101137270A Flexible multi-layer circuit board and its producing method
03/05/2008CN101136385A Internally burying type chip packaging manufacture process and circuit board having the same
03/05/2008CN101135793A 显示装置 The display device
03/05/2008CN101135753A Optical module
03/05/2008CN100373998C Power assembly and method for manufacturing the same
03/05/2008CN100373996C Display device with illuminating effect for output/input terminal
03/05/2008CN100373605C Electronic component packaging structure and method for producing the same
03/05/2008CN100372892C Resin composition
03/05/2008CN100372655C Integrated spark and switch apparatus for combustion power fastener driving tool
03/04/2008USRE40130 Liquid crystal display device video having signal driving circuit mounted on one side
03/04/2008US7340287 Flex circuit shielded optical sensor
03/04/2008US7340121 Optoelectric composite substrate and method of manufacturing the same
03/04/2008US7339798 Electronic assemblies and systems comprising interposer with embedded capacitors
03/04/2008US7339796 Electrical circuit having a multilayer printed circuit board
03/04/2008US7339795 Structure for fastening a circuit board on a case
03/04/2008US7339786 Modular server architecture with Ethernet routed across a backplane utilizing an integrated Ethernet switch module
03/04/2008US7339646 Connection structures of wiring board and connection structure of liquid crystal display panel
03/04/2008US7339568 Signal transmission film and a liquid crystal display panel having the same
03/04/2008US7339281 Circuit device and manufacturing method thereof
03/04/2008US7339277 Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate
03/04/2008US7339262 Tape circuit substrate and semiconductor apparatus employing the same
03/04/2008US7339260 Wiring board providing impedance matching
03/04/2008US7339118 Printed wiring board and method for manufacturing the same
03/04/2008US7338884 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
03/04/2008US7338716 Insulating polyimide resin layer etchable by aqueous alkaline solution, metal foil
03/04/2008US7338297 Connector mounting construction and method
03/04/2008US7338293 Circuit contact to test apparatus
03/04/2008US7338292 Board-to-board electronic interface using hemi-ellipsoidal surface features
03/04/2008US7338291 Intermediate electrical connector device and its connecting structure
03/04/2008US7338290 Printed wiring board with a plurality of pads and a plurality of conductive layers offset from the pads
03/04/2008US7338216 Transmitter subassembly ground return path
03/04/2008US7338205 Temperature monitoring system
03/04/2008US7338152 Inkjet head
03/04/2008US7337975 Method for producing a contactless ticket comprising a chip
03/04/2008CA2202364C Surface mounted directional coupler
02/2008
02/28/2008WO2008023565A1 Circuit connecting material, connection structure for circuit member using the same and production method thereof
02/28/2008WO2008023517A1 Optical/electrical mixed mounting substrate
02/28/2008WO2008023510A1 High frequency module
02/28/2008WO2008023506A1 Chip device
02/28/2008WO2008023405A1 Flexible printed board
02/28/2008WO2008023403A1 Board
02/28/2008WO2008022849A1 Method and system for electrically coupling an information carrier to a contact element
02/28/2008WO2007072249A3 Porous circuitry material for led submounts
02/28/2008WO2007047891A3 Systems and methods for electromagnetic noise suppression using hybrid electromagnetic bandgap structures
02/28/2008WO2001001451A3 Microwave circuit packages having a reduced number of vias in the substrate
02/28/2008US20080050943 Camera module and assembling process thereof
02/28/2008US20080050942 Electrical connector housing having stylized guide box
02/28/2008US20080050281 Sensor substrate and method of fabricating same
02/28/2008US20080049406 Multilayer printed wiring board
02/28/2008US20080049405 Multilayered printed wiring board and method for manufacturing the same
02/28/2008US20080049402 Printed circuit board having supporting patterns
02/28/2008US20080049392 Peripheral card with hidden test pins
02/28/2008US20080049377 Ultra low inductance multi layer ceramic capacitor
02/28/2008US20080048307 Module and Mounted Structure Using the Same
02/28/2008US20080047744 Multi-layer wiring board
02/28/2008US20080047743 Multilayer Substrate With Built-In Capacitors, Method For Manufacturing The Same, And Cold-Cathode Tube Lighting Device
02/28/2008US20080047742 Printed circuit board and method of manufacturing the same
02/28/2008US20080047741 High density integrated circuit apparatus, test probe and methods of use thereof
02/28/2008US20080047740 Circuit Board Assembly Having Passive Component and Stack Structure Thereof
02/28/2008US20080047739 Wired circuit board
02/28/2008US20080047738 Printed wiring board and printed circuit board
02/28/2008US20080047737 Multilayered printed wiring board and method for manufacturing the same
02/28/2008US20080047339 Electronic components packaging structure
02/28/2008US20080047137 Connection member and mount assembly and production method of the same
02/28/2008US20080047136 Laminate ceramic circuit board and process therefor
02/28/2008DE202007008410U1 Mit elektronischen Bauteilen bestücktes, transluzentes Einbauelement With electronic components stocked, translucent insert element
02/28/2008DE202006016320U1 Baugruppe Module
02/27/2008EP1893011A1 Semiconductor circuit board and semiconductor circuit