Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
03/2008
03/20/2008US20080066953 Circuit board assembly and manufacturing method thereof, electronic part assembly and manufacturing method thereof, and electronic device
03/20/2008US20080066952 Alloy circuit board and manufacturing method thereof
03/20/2008US20080066951 Multi-Dielectric material circuit board supporting high-speed and low-speed signaling
03/20/2008US20080066950 Wiring board and method of manufacturing wiring board
03/20/2008US20080066660 Latching mechanism
03/20/2008US20080066304 Technique for laminating multiple substrates
03/20/2008DE102004022178B4 Verfahren zur Herstellung einer Leiterbahn auf einem Substrat und Bauelement mit einer derart hergestellten Leiterbahn A method of fabricating a wiring on a substrate and the component to a conductor track manufactured in such a way
03/20/2008DE102004004880B4 Verbindungsverfahren für direkt verbundene gestapelte integrierte Schaltungen sowie integrierter Schaltungschip und integriertes Schaltungsgehäuse Connection method to directly connected stacked integrated circuits and integrated circuit chip and integrated circuit package
03/19/2008EP1901593A2 LCD signal transfer members
03/19/2008EP1901350A1 Heat dissipation device and power module
03/19/2008EP1901110A2 Liquid crystal display
03/19/2008EP1900488A1 Method for producing ceramic sheet, ceramic substrate using ceramic sheet obtained by such method, and use thereof
03/19/2008EP1900264A1 Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor
03/19/2008EP1900263A1 Fabrication of electronic components in plastic
03/19/2008EP1899986A2 An electrically conductive composite
03/19/2008EP1493187A4 Lighting device and method
03/19/2008CN201039667Y Surface chip separator
03/19/2008CN201039659Y Shielding device preventing from electromagnetic wave interference and its combination with electronic device shell of circuit board
03/19/2008CN201039591Y A PCB line with Na diode
03/19/2008CN201039590Y No inductive capacitance board structure
03/19/2008CN201039589Y An anti-shock electronic device
03/19/2008CN201039588Y Double-side circuit board with welding tray structure
03/19/2008CN201039587Y Welding structure and printed circuit board with this welding structure
03/19/2008CN201039586Y A flexible line board for preventing gold fingers from breaking
03/19/2008CN201039585Y Layout structure for circuit board
03/19/2008CN201039584Y Flexible electrode plate for building leakage prevention device
03/19/2008CN201039583Y Multi-layer high heat conduction metal base plate and high heat conductive metal plate with this base plate
03/19/2008CN201039582Y Power supply layer structure for PCB circuit board
03/19/2008CN201039581Y Circuit board structure with heat radiator slice
03/19/2008CN201039580Y A PCB board and corresponding circuit board printing device and steel mesh
03/19/2008CN201039550Y Circuit board structure for car discharging lamp rectifier
03/19/2008CN201039549Y A circuit board for car discharging lamp rectifier
03/19/2008CN201039298Y Circuit board structure compatible to non correction circuit
03/19/2008CN201038928Y Fixing structure for micro-motor printed circuit board
03/19/2008CN201038293Y Solder paste printing apparatus for antenna substrate and feeding needle splicing
03/19/2008CN201038189Y Elliptical light-emitting diode with pin ranked along short axis and display screen display module
03/19/2008CN201038159Y Light emitting diode module substrate with heat-conductive efficiency
03/19/2008CN101147435A Printed board with a pin for mounting a component
03/19/2008CN101147434A ITFC with optimized C(T)
03/19/2008CN101147433A Multilayer circuit board with embedded components and method of manufacture
03/19/2008CN101147432A 电路板设计 Circuit board design
03/19/2008CN101146933A Electrolytic copper foil and process for producing electrolytic copper foil, surface treated electrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wi
03/19/2008CN101146850A Polyimide film
03/19/2008CN101146432A Printed circuit board unit having void for receiving fan
03/19/2008CN101146408A Wiring forming system and wiring forming method for forming wiring on wiring board
03/19/2008CN101146405A Welding structure between circuit board
03/19/2008CN101146404A Base board bar and micro shooting module using this bar
03/19/2008CN101146403A Pressing base board bar
03/19/2008CN101146402A Circuit welding pad structure
03/19/2008CN101146401A Multilayer wiring plate
03/19/2008CN101146400A Printed circuit board assembly and its assembling method
03/19/2008CN101146399A Circuit board
03/19/2008CN101145553A Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same
03/19/2008CN101145552A Integrated circuit package substrate and making method
03/19/2008CN101145547A Ground wire layout graph for reducing microwave single-sheet integrated circuit standing wave ratio
03/19/2008CN101145416A Surface mounted electronic element
03/19/2008CN101145136A Processor memory array having memory macros and its protecting method
03/19/2008CN101144966A Test device for mobile phone camera module with automatic focusing function and the test method
03/19/2008CN101144919A Liquid crystal display
03/19/2008CN101144890A Automatic microdistance regulation type mobile phone camera module group assembling process
03/19/2008CN101144889A Mobile phone camera module group lens splicing board assembling method
03/19/2008CN101143500A Laminate and use thereof
03/19/2008CN100376127C Heating element radiating structure
03/19/2008CN100376126C Flexible substrate, multilayer flexible substrate and process for producing the same
03/19/2008CN100376125C Surface-treated copper foil and its preparing method
03/19/2008CN100376124C Printed circuit board
03/19/2008CN100376022C Method for packing semiconductor device on printing circuit board and the printing circuit board
03/18/2008US7345892 Semiconductor device, noise reduction method, and shield cover
03/18/2008US7345891 Circuit board assembly
03/18/2008US7345889 Method and system for reducing radiated energy emissions in computational devices
03/18/2008US7345888 Component built-in wiring board and manufacturing method of component built-in wiring board
03/18/2008US7345887 Flexible printed board mounting structure and optical pick up having the same
03/18/2008US7345645 Method of manufacturing substrate for circuit board and smart label having the substrate
03/18/2008US7345633 Low-loss substrate antenna structure and method of manufacture thereof
03/18/2008US7345591 Measuring device
03/18/2008US7345563 Embedded inductor for semiconductor device circuit
03/18/2008US7345558 Circuit device
03/18/2008US7345552 Constant temperature type crystal oscillator
03/18/2008US7345359 Integrated circuit package with chip-side signal connections
03/18/2008US7345247 Circuit board threadplate
03/18/2008US7345246 Wiring board and capacitor to be built into wiring board
03/18/2008US7345245 Robust high density substrate design for thermal cycling reliability
03/18/2008US7345244 Flexible substrate and a connection method thereof that can achieve reliable connection
03/18/2008US7345140 Phenol-reacted non-ester alicyclic diepoxides
03/18/2008US7344918 Electronic assembly with integrated IO and power contacts
03/18/2008US7344085 Multilayer expansion card for electronic apparatus and relative production method
03/18/2008CA2460520C Metal-containing web processed with a continuous etch process
03/15/2008CA2601621A1 Motor starter
03/13/2008WO2008030272A2 System, apparatus and methods for board cooling
03/13/2008WO2008029580A1 Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape
03/13/2008WO2008009492A3 Conductor carrier and arrangement comprising a conductor carrier
03/13/2008WO2008008520A3 Photosensitive conductive paste for electrode formation and electrode
03/13/2008WO2007103011A3 Methods of forming a flexible circuit board
03/13/2008US20080064849 Adhesive film for circuit connection, and circuit connection structure
03/13/2008US20080064264 Power connector
03/13/2008US20080064235 Electrical components coupled to circuit boards
03/13/2008US20080064207 Semiconductor Device Power Interconnect Striping
03/13/2008US20080064140 Semiconductor device having curved leads offset from the center of bonding pads
03/13/2008US20080063792 Board for printed wiring, printed wiring board, and method for manufacturing them
03/13/2008US20080062734 Interchangeable connection arrays for double-sided DIMM placement
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