| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/27/2008 | US20080073113 Structuring and circuitizing printed circuit board through-holes |
| 03/27/2008 | US20080073112 Printed wiring board for mounting components |
| 03/27/2008 | US20080073111 Single Package Multiple Component Array With Ball Grid Array Mounting and Contact Interface |
| 03/27/2008 | US20080073110 Interposer and method for manufacturing the same |
| 03/27/2008 | US20080073109 Printed Circuit Board |
| 03/27/2008 | US20080073108 Surface mounting type electronic components and manufacturing method of the same |
| 03/27/2008 | US20080073107 Printed Circuit Board |
| 03/27/2008 | US20080073024 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus |
| 03/27/2008 | DE102006059127A1 Method for production of arrangement of optoelectronic components, involves manufacturing two attachment areas on connection carrier and bringing soldering material into attachment areas |
| 03/27/2008 | DE102006045052A1 Aqueous printing ink composition, useful e.g. to prepare electrically functional structures, comprises a water-soluble hardenable polymer or copolymer, crosslinked chemicals, electrical functional materials and solvent containing water |
| 03/27/2008 | DE102006043901A1 Electrical component e.g. surface mounted device-component, has piezoelectric transformer, which is arranged on flexible carrier foil and is connected with carrier foil, where carrier foil stands in interconnection with conductor layers |
| 03/27/2008 | DE102006043811A1 Coated article for printed circuit board used for assembly of electrical components, has electrically non-conducting base layer, copper and/or copper alloy layer, and layer containing electrically conductive polymer |
| 03/27/2008 | DE102006043785A1 Elektronische Baugruppe Electronic assembly |
| 03/27/2008 | DE102006041866A1 Circuit board has conductive path layout and single electrical contact point, which is accessible far from circuit board, is arranged above surface of circuit board at free end of guided piece |
| 03/26/2008 | EP1903841A1 Flexible printed circuit board |
| 03/26/2008 | EP1903840A1 Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method |
| 03/26/2008 | EP1903839A2 A method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure |
| 03/26/2008 | EP1903376A1 Liquid crystal display device and portable display apparatus using the same |
| 03/26/2008 | EP1902600A1 Improved printed circuit which can detect accidental heating |
| 03/26/2008 | EP1550678B1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 03/26/2008 | EP1348224A4 A connection between a conductive substrate and a laminate |
| 03/26/2008 | CN201042106Y A circuit board penetration hole and its circuit board |
| 03/26/2008 | CN201042105Y Circuit board |
| 03/26/2008 | CN201041605Y Liquid crystal display device |
| 03/26/2008 | CN101151946A Multi-layer laminate and flexible copper-clad laminated substrate production method |
| 03/26/2008 | CN101151945A Apertures for signal shaping using ground and signal PTH back-drilling |
| 03/26/2008 | CN101151944A Reinforcing structure for metal core board and electric connection box |
| 03/26/2008 | CN101151943A Rigid/flexible printed circuit board |
| 03/26/2008 | CN101151672A Laminate for HDD suspension and process for producing the same |
| 03/26/2008 | CN101151307A Surface graft material and producing method thereof, conductive material and producing method thereof, and conductive pattern material |
| 03/26/2008 | CN101150931A Circuit board and its making method |
| 03/26/2008 | CN101150914A Flexible printed circuit board |
| 03/26/2008 | CN101150913A Differential compatible circuit board |
| 03/26/2008 | CN101150912A Circuit base plate |
| 03/26/2008 | CN101150911A DC power layer structure |
| 03/26/2008 | CN101150121A Flexible circuits having improved reliability and thermal dissipation |
| 03/26/2008 | CN101150111A Encapsulation base plate |
| 03/26/2008 | CN101150012A Method for preparing electrode altitude difference absorption dielectric paste and laminated ceramic electronic components |
| 03/26/2008 | CN101149533A Backlight device |
| 03/26/2008 | CN101149528A Backlight module and liquid crystal display containing the backlight module |
| 03/26/2008 | CN101149497A Liquid crystal display device and portable display apparatus using the same |
| 03/26/2008 | CN101149496A Flat panel display device and portable display apparatus using the same |
| 03/26/2008 | CN101149495A LCD display module |
| 03/26/2008 | CN101149458A Chip packaged fixed focus focusing-free imaging module processing method |
| 03/26/2008 | CN101149448A 连接器安装结构 Connector mounting structure |
| 03/26/2008 | CN101148509A Preparation of polyimide thermosetting resin and application thereof in two-layer method flexibility coat copper plate |
| 03/26/2008 | CN100377634C Substrate holder and method for producing the same |
| 03/26/2008 | CN100377630C Circuit board and production method therefor |
| 03/26/2008 | CN100377627C Circuit board for preventing adjacent welding-pad from short circuit |
| 03/26/2008 | CN100377626C Printed circuit board and its wiring method |
| 03/26/2008 | CN100377625C 布线电路衬底及其制造方法 The wiring circuit substrate and a manufacturing method |
| 03/26/2008 | CN100377436C 信号传输模块 Signal transmission module |
| 03/26/2008 | CN100377361C Structure of image sensor module and wafer level package and its forming method |
| 03/26/2008 | CN100377325C Film carrier tape for mounting electronic component |
| 03/26/2008 | CN100377293C Component mounting method, component mounting apparatus, and ultrasonic bonding head |
| 03/26/2008 | CN100376731C Multi-component fibers having reversible thermal properties |
| 03/26/2008 | CN100376622C Polyimide film and process for producing the same |
| 03/26/2008 | CN100376386C Polyimide-metal layered products and polyamideimide-metal layered product |
| 03/25/2008 | US7350009 Electronic device with card interface |
| 03/25/2008 | US7349724 Radio frequency arrangement and production method and also use |
| 03/25/2008 | US7349224 Semiconductor device and printed circuit board |
| 03/25/2008 | US7349215 Aerogel/PTFE composite insulating material |
| 03/25/2008 | US7349208 Shielding box having a first wiring board and a second wiring board |
| 03/25/2008 | US7349054 Method of mounting flexible circuit boards, and display device |
| 03/25/2008 | US7348677 Method of providing printed circuit board with conductive holes and board resulting therefrom |
| 03/25/2008 | US7348674 Low capacitance wiring layout |
| 03/25/2008 | US7348662 Composite multi-layer substrate and module using the substrate |
| 03/25/2008 | US7348498 Partially voided anti-pads |
| 03/25/2008 | US7348497 Mounting structure for electronic components |
| 03/25/2008 | US7348496 Circuit board with organic dielectric layer |
| 03/25/2008 | US7348495 Uniform force hydrostatic bolster plate |
| 03/25/2008 | US7348494 Signal layer interconnects |
| 03/25/2008 | US7348493 Metal-ceramic circuit board |
| 03/25/2008 | US7348492 Flexible wiring board and electrical device using the same |
| 03/25/2008 | US7348373 For electronic screen printable pastes |
| 03/25/2008 | US7348215 Methods for assembly and packaging of flip chip configured dice with interposer |
| 03/25/2008 | US7348213 Method for forming component mounting hole in semiconductor substrate |
| 03/25/2008 | US7348080 polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit |
| 03/25/2008 | US7348069 Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate |
| 03/25/2008 | US7348064 Binders comprising condensation polymers used for lamination of flexible circuits and packaging electronics |
| 03/25/2008 | US7348057 Acrylic adhesive sheet |
| 03/25/2008 | US7348045 A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. |
| 03/25/2008 | US7347952 Method of fabricating an ink jet printhead |
| 03/25/2008 | US7347702 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 03/25/2008 | US7347701 Differential I/O spline for inexpensive breakout and excellent signal quality |
| 03/20/2008 | WO2008032770A1 Metal composite laminate for manufacturing flexible wiring board abd flexible wiring board |
| 03/20/2008 | WO2008032383A1 Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board |
| 03/20/2008 | WO2008012512A3 The formation of conductive metal regions on substrates |
| 03/20/2008 | US20080070429 Surface mounted electronic component |
| 03/20/2008 | US20080070428 Electrical connector |
| 03/20/2008 | US20080070427 Memory card adapter |
| 03/20/2008 | US20080070424 Pivoting apparatus for mating a power supply with a riser card and method for doing the same |
| 03/20/2008 | US20080068900 Memory module decoder |
| 03/20/2008 | US20080068817 Printed circuit board unit and electronic apparatus |
| 03/20/2008 | US20080068812 Printed board including a joining portion and a bore |
| 03/20/2008 | US20080068780 Capacitor, manufacturing method of the same, and electronic substrate including the same |
| 03/20/2008 | US20080068424 Ink jet printhead integrated circuit with surface-processed thermal actuators |
| 03/20/2008 | US20080068272 Connecting Part of Conductor Pattern and Conductor Patterns-Connected Structure |
| 03/20/2008 | US20080067662 Modularized Die Stacking System and Method |
| 03/20/2008 | US20080066955 Surface mounting structure for a surface mounting electronic component |