| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/25/2008 | CN101207977A Method for making flexible circuit board with break difference structure |
| 06/25/2008 | CN101207972A Circuit board and photosensitive device using the same |
| 06/25/2008 | CN101207971A Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board |
| 06/25/2008 | CN101207970A Electronic component built-in substrate and method of manufacturing electronic component built-in substrate |
| 06/25/2008 | CN101207969A Electronic component built-in substrate and method for manufacturing the same |
| 06/25/2008 | CN101207968A Circuit board |
| 06/25/2008 | CN101207967A Circuit board structure capable of shielding interference of electromagnetic wave |
| 06/25/2008 | CN101207106A 电路板及其制造方法 The circuit board and its manufacturing method |
| 06/25/2008 | CN101207104A Flush type capacitance ultra-low inductance design |
| 06/25/2008 | CN101206326A Display device containing touch screen panel |
| 06/25/2008 | CN101206287A Photoelectricity substrate and manufacturing method therefor |
| 06/25/2008 | CN101206282A Optical circuit board |
| 06/25/2008 | CN101205364A Nano thin-layer protective agent for electronic substrate |
| 06/25/2008 | CN100397964C Positioning device for use in process for manufacturing multi-layer printed circuit board and its using method |
| 06/25/2008 | CN100397963C Electronic circuit device and its manufacturing method |
| 06/25/2008 | CN100397962C Semiconductor component package and its packaging method |
| 06/25/2008 | CN100397961C Ball grid array jumper |
| 06/25/2008 | CN100397960C Printed circuit board structure and method for manufacturing same |
| 06/25/2008 | CN100397959C Metal plated laminate |
| 06/25/2008 | CN100397957C Method for eliminating statics on main board |
| 06/25/2008 | CN100397788C Signal reception device, signal reception circuit, and reception device |
| 06/25/2008 | CN100397702C Parallel flat platc line-type element and circuit substrate |
| 06/25/2008 | CN100397641C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/25/2008 | CN100397640C Circuit component built-in module and method for manufacturing the same |
| 06/25/2008 | CN100397635C Wiring pad with edge reinforcing structure for integrated circuit |
| 06/25/2008 | CN100397632C Modular heat sink decoupling capacitor array and printed circuit board assembly |
| 06/25/2008 | CN100397627C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/25/2008 | CN100397625C 半导体装置 Semiconductor device |
| 06/25/2008 | CN100397624C Wiring circuit board |
| 06/25/2008 | CN100397543C Electrode base plate used for plasma display screen and its manufacturing method |
| 06/25/2008 | CN100397525C Wired circuit board |
| 06/25/2008 | CN100397294C Electronic apparatus including printed wiring board provided with heat generating component |
| 06/25/2008 | CN100396747C Acrylic adhesive sheet |
| 06/25/2008 | CN100396730C Conductive composition, conductive film, and process for the formation of the film |
| 06/25/2008 | CN100396367C Use of dispersions in making electronic devices |
| 06/24/2008 | US7392071 Rotary module with digital camera module |
| 06/24/2008 | US7391622 Composite structural member having an integrated electrical circuit |
| 06/24/2008 | US7391620 System for improving power distribution current measurement on printed circuit boards |
| 06/24/2008 | US7391137 Circuit arrangement for EMC interference suppression for a direct current motor and a switching module |
| 06/24/2008 | US7390973 Memory module and signal line arrangement method thereof |
| 06/24/2008 | US7390692 Semiconductor device and method for manufacturing the same |
| 06/24/2008 | US7390571 mixing epoxy resins, dicyandiamide, a curing agents having imidazole rings and fillers, then heating the mixture in solvents to enhance compatibility and form a uniform dispersion; electrical insulation and fireproofing |
| 06/24/2008 | US7390544 Contains an acrylic polymer and a phenol resin; stability; free of silicone based material; for flexible printing circuit boards |
| 06/24/2008 | US7390440 Process for producing metal-containing particles having their surface coated with at least two dispersants different in vaporization temperature |
| 06/24/2008 | US7390197 Electronic device with integral connectors |
| 06/24/2008 | US7389929 Long range optical reader |
| 06/24/2008 | US7389580 Method and apparatus for thin-film battery having ultra-thin electrolyte |
| 06/19/2008 | WO2008073675A1 Method and system for extracting heat from electrical components |
| 06/19/2008 | WO2008073585A1 Low dielectric glass and fiber glass for electronic applications |
| 06/19/2008 | WO2008073409A2 Composite organic encapsulants |
| 06/19/2008 | WO2008072630A1 Polyamide resin, epoxy resin composition using the same, and use of the composition |
| 06/19/2008 | WO2008072495A1 Polyamide-imide resin, colorless transparent flexible metal laminate made of the same, and wiring board |
| 06/19/2008 | WO2008072302A1 Drive circuit board device |
| 06/19/2008 | WO2008040307A3 Method for producing an arrangement of optoelectronic components, and arrangement of optoelectronic components |
| 06/19/2008 | WO2008024845A3 Semiconductive device having improved copper density for package-on-package applications |
| 06/19/2008 | WO2007126534A3 Electrical connector with segmented housing |
| 06/19/2008 | WO2007121412A3 Conductive polymer electronic devices with surface mountable configuration and methods for manufacturing same |
| 06/19/2008 | US20080148227 Method of partitioning an algorithm between hardware and software |
| 06/19/2008 | US20080146052 Micro-machined structure production using encapsulation |
| 06/19/2008 | US20080146016 Method for Forming a Structure |
| 06/19/2008 | US20080145689 comprising epoxy resin, acrylonitrile butadiene rubber, and a phenol novolak resin on a copper foil; using on a semiconductor chip mounted board and a semiconductor packaged board; good peeling strength |
| 06/19/2008 | US20080144316 Led lighting array for a portable task lamp |
| 06/19/2008 | US20080144301 Connecting terminal for receiving lead terminal in printed wiring board |
| 06/19/2008 | US20080144299 Systems for and methods of circuit construction |
| 06/19/2008 | US20080144298 Printed circuit board and method of manufacturing printed circuit board |
| 06/19/2008 | US20080144295 Flexible printed circuit board |
| 06/19/2008 | US20080144287 Mounting device for high frequency microwave devices |
| 06/19/2008 | US20080144238 Controller system for pool and/or spa |
| 06/19/2008 | US20080143948 Method of mounting flexible circuit boards, and display device |
| 06/19/2008 | US20080143906 Nanowire-based transparent conductors and applications thereof |
| 06/19/2008 | US20080142370 a mixture of acids, water soluble sulfur compounds, carbocyclic halogen compounds and polymers, used for electrodeposition of copper onto metal or plastic surfaces; printed circuits |
| 06/19/2008 | US20080142258 High speed interposer |
| 06/19/2008 | US20080142257 Ceramic substrate grid structure for the creation of virtual coax arrangement |
| 06/19/2008 | US20080142256 Wiring board manufacturing method |
| 06/19/2008 | US20080142255 Printed circuit board and method of manufacturing printed circuit board |
| 06/19/2008 | US20080142254 Carrier and manufacturing process thereof |
| 06/19/2008 | US20080142253 Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same |
| 06/19/2008 | US20080142252 Solid via with a contact pad for mating with an interposer of an ATE tester |
| 06/19/2008 | US20080142251 Chip component |
| 06/19/2008 | US20080142250 Electronic component connection support structures including air as a dielectric |
| 06/19/2008 | US20080142249 Selective surface roughness for high speed signaling |
| 06/19/2008 | US20080142248 Printed circuit board having coplanar lc balance |
| 06/19/2008 | US20080142238 Large area circuitry using appliques |
| 06/19/2008 | US20080142154 Rfid label technique |
| 06/19/2008 | DE202006020411U1 Vorrichtung zur elektrischen Kontaktierung von Leiterplatinen Device for electrical contacting of circuit boards |
| 06/19/2008 | DE10304867B4 Verfahren und Vorrichtung zur Herstellung einer Leiterplattenanordnung Method and apparatus for producing a circuit board assembly |
| 06/19/2008 | DE102007058555A1 Mehrschichtiges Substrat und Verfahren zur Herstellung desselben A multilayer substrate and process for producing same |
| 06/19/2008 | DE102007056258A1 Chipantenne sowie mobiles Telekommunikationsendgerät, welches diese aufweist Chip antenna and mobile telecommunication terminal having this |
| 06/19/2008 | DE102007006162B3 Method for manufacturing of three-dimensional circuit carrier, involves forming circuit carrier by flat, plate-shaped base body, which is made of thermoplastic material by thermal deformation process |
| 06/19/2008 | DE102006061386B3 Integrierte Anordnung, ihre Verwendung und Verfahren zu ihrer Herstellung Integrated arrangement, their use and processes for their preparation |
| 06/19/2008 | DE102006058000A1 Blank assembly, particularly for microwave filter, has auxiliary blank, where auxiliary blank with its front side lies on front side of main blank such that each stripline contact is connected on front side of auxiliary blank |
| 06/19/2008 | DE102006057738A1 Preparing versatile circuit board for marking, assembly or testing, drills marker holes and covers them in predetermined, detectable pattern to determine selection of processing operations |
| 06/19/2008 | DE102006053312A1 Elektronische Schaltungsanordnung mit mindestens einer flexiblen gedruckten Schaltung und Verfahren zu deren Verbindung mit einer zweiten Schaltung Electronic circuit arrangement having at least one flexible printed circuit, and process for their connection to a second circuit |
| 06/18/2008 | EP1933376A2 Transfer material, method for producing the same and wiring substrate produced by using the same |
| 06/18/2008 | EP1932401A1 Method for fixing a light-emitting diode to a metallic heat-radiating element |
| 06/18/2008 | EP1932400A1 Apparatus for detecting fault currents in an electronic device |
| 06/18/2008 | EP1276358B1 Production method of a copper foil excellent in laser beam drilling performance |
| 06/18/2008 | EP1275695B1 Curable composition and multilayered circuit substrate |
| 06/18/2008 | EP1222725B1 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 06/18/2008 | EP1019986B1 Wiring board constructions and methods of making same |