| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/02/2008 | CN101212862A High heat-conductivity conducting carrier plate |
| 07/02/2008 | CN101212861A Anti-theft circuit and producing method |
| 07/02/2008 | CN101212860A Electromagnetic energy gap structure and multi-layer printed circuit board with the electromagnetic energy gap structure |
| 07/02/2008 | CN101212859A Method for detecting inter-layer displacement of multi-layer flexible printed circuit board |
| 07/02/2008 | CN101212858A Circuit base plate |
| 07/02/2008 | CN101212857A Printed circuit board with identifiable production information |
| 07/02/2008 | CN101211900A Electronic component contained substrate |
| 07/02/2008 | CN101211888A Wiring substrate, manufacturing method thereof, and semiconductor device |
| 07/02/2008 | CN101211882A Printed circuit board and element module packaging structure and encapsulation method |
| 07/02/2008 | CN101211880A Connection device between packaging substrate and chip thereon |
| 07/02/2008 | CN101211693A Capacitor and multi-layer board embedding the capacitor |
| 07/02/2008 | CN101211027A 显示装置 The display device |
| 07/02/2008 | CN101210077A Halogen-free refractory composition |
| 07/02/2008 | CN101209605A Surface processing copper foil |
| 07/02/2008 | CN100399866C Circuit base board |
| 07/02/2008 | CN100399551C Device mounting board |
| 07/02/2008 | CN100398986C Characteristic value calculation for welding detection |
| 07/01/2008 | US7394666 Circuit board cam-action standoff connector |
| 07/01/2008 | US7394665 LSI package provided with interface module and method of mounting the same |
| 07/01/2008 | US7394663 Electronic component built-in module and method of manufacturing the same |
| 07/01/2008 | US7394662 Optimization of the number of power outputs for an integrated circuit |
| 07/01/2008 | US7394341 Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same |
| 07/01/2008 | US7394148 Module having stacked chip scale semiconductor packages |
| 07/01/2008 | US7394027 Multi-layer printed circuit board comprising a through connection for high frequency applications |
| 07/01/2008 | US7394026 Multilayer wiring board |
| 07/01/2008 | US7393904 (Meth)acrylate-terminated polyphenylene ether |
| 07/01/2008 | US7393596 Aluminum/ceramic bonding substrate and method for producing same |
| 07/01/2008 | US7393580 Layered board and electronic apparatus having the layered board |
| 07/01/2008 | US7392584 Methods and apparatus for a flexible circuit interposer |
| 07/01/2008 | US7392582 Socket and/or adapter device, and an apparatus and process for loading a socket and/or adapter device with a corresponding semi-conductor component |
| 06/26/2008 | WO2008076029A1 A dual polarized waveguide feed arrangement |
| 06/26/2008 | WO2008075686A1 Wiring board and method for manufacturing the same |
| 06/26/2008 | WO2008075401A1 Board structure, process for manufacturing circuit board, method of inspecting circuit board and electronic equipment |
| 06/26/2008 | WO2008075135A1 Power amplifier system |
| 06/26/2008 | WO2008074245A1 Blacklight apparatus and manufacturing method of the same |
| 06/26/2008 | WO2007143966A3 Textile layer arrangement, textile layer array and method for producing a textile layer arrangement |
| 06/26/2008 | US20080154006 Photocurable; suitable for electronics requiring a low dielectric constant, a low dielectric loss tangent and high toughness; compatible with thermosetting resin; soluble in methyl ethyl ketone solvent; hydroxy end groups reacted with epichlorohydrin and then acrylic acid |
| 06/26/2008 | US20080153352 Electrical Connector |
| 06/26/2008 | US20080153326 Method for securing a circuit board to a socket |
| 06/26/2008 | US20080153325 Modular power distribution center |
| 06/26/2008 | US20080153320 Space-saving IC card and card slot arrangement |
| 06/26/2008 | US20080153319 Connection structure for printed wiring board |
| 06/26/2008 | US20080151581 Small form factor power supply |
| 06/26/2008 | US20080151522 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 06/26/2008 | US20080151520 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 06/26/2008 | US20080151519 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 06/26/2008 | US20080151518 Circuit board structure with embedded electronic components |
| 06/26/2008 | US20080151517 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 06/26/2008 | US20080151516 Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment |
| 06/26/2008 | US20080151515 Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate |
| 06/26/2008 | US20080151513 High-frequency PCB connections that utilize blocking capacitors between the pins |
| 06/26/2008 | US20080151511 Lateral force countering load mechanism for lga sockets |
| 06/26/2008 | US20080150169 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
| 06/26/2008 | US20080150159 Semiconductor Package with Perforated Substrate |
| 06/26/2008 | US20080149740 Card device |
| 06/26/2008 | US20080149384 Multilayer wiring board and power supply structure to be embedded in multilayer wiring board |
| 06/26/2008 | US20080149383 Wiring substrate and method for manufacturing the same |
| 06/26/2008 | US20080149382 Method of inspecting printed wiring board and printed wiring board |
| 06/26/2008 | US20080149381 Method for manufacturing component incorporating module and component incorporating module |
| 06/26/2008 | US20080149380 Material Board for Producing Hybrid Circuit Board with Metallic Terminal Plate and Method for Producing Hybrid Circuit Board |
| 06/26/2008 | US20080149379 Wiring structure of printed wiring board and method for manufacturing the same |
| 06/26/2008 | US20080149377 Transceiver module and PCB structure thereof |
| 06/26/2008 | US20080149376 Microwave circuit board |
| 06/26/2008 | US20080149375 Wired circuit board and producing method thereof |
| 06/26/2008 | US20080149374 Laminated multi-layer circuit board |
| 06/26/2008 | US20080149373 Printed circuit board, light emitting apparatus having the same and manufacturing method thereof |
| 06/26/2008 | US20080149372 Printed circuit board and semiconductor memory module using the same |
| 06/26/2008 | US20080149371 Flexible circuit |
| 06/26/2008 | US20080149370 Local temperature control fixture applied to reflow process for circuit board |
| 06/26/2008 | US20080149369 Printed wiring board |
| 06/26/2008 | US20080149368 Method of electroplating a plurality of conductive fingers |
| 06/26/2008 | US20080149367 Printed circuit board and light sensing device using the same |
| 06/26/2008 | US20080149366 Interleaved printed circuit board |
| 06/26/2008 | US20080148563 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 06/26/2008 | DE19819088B4 Flexible Leiterplatte Flexible PCB |
| 06/26/2008 | DE10211926B4 Wärmeableitungsanordnung eines integrierten Schaltkreises (ICs) Heat dissipation arrangement of an integrated circuit (IC) |
| 06/26/2008 | DE102007055291A1 Multilayered printed circuit board useful in semiconductor device, comprises an internal magnetic layer, an internal conductive layer, a dielectric layer, a signal layer formed on the dielectric layer, and a cable bushing |
| 06/26/2008 | DE102006061300A1 Electric printed circuit board for protecting microprocessors against electrostatic discharge has protective strip conductors on both sides of the printed circuit board running round on the outer edge of the printed circuit board |
| 06/26/2008 | DE102006060719A1 Chip card module comprises substrate and two sides, where conducting structures are placed on sides of substrate in adhesion free manner, and chip is arranged on sides of substrate |
| 06/26/2008 | DE102006058569A1 Method for processing of printed circuit board of printed circuit board panel, involves providing printed circuit board panel with printed circuit board and printed circuit board is provided with marking position |
| 06/26/2008 | DE102005032422B4 Anordnung aus Träger und supraleitendem Film, Vortexdiode, umfassend eine derartige Anordnung sowie Verwendung von Vortexdioden für Filter Arrangement of carrier and superconducting film, vortex diode comprising such an arrangement and use of vortex diodes for filters |
| 06/25/2008 | EP1937043A1 Method for producing high dielectric sheet |
| 06/25/2008 | EP1937042A2 Connection system for a display module |
| 06/25/2008 | EP1937041A2 Printed circuit board, light emitting apparatus having the same and manufacturing method thereof |
| 06/25/2008 | EP1937040A2 Conductor board with a high frequency component |
| 06/25/2008 | EP1937039A1 Membrane structure with at least one antenna |
| 06/25/2008 | EP1936734A1 Radio frequency circuit module on multi-layer substrate |
| 06/25/2008 | EP1936684A1 Electronic device with a base plate |
| 06/25/2008 | EP1936683A1 Base plate for a heat sink and electronic device with a base plate |
| 06/25/2008 | EP1766467A4 Display device using printed circuit board as substrate of display panel |
| 06/25/2008 | EP1716729B1 Printed circuit board comprising a card reading device |
| 06/25/2008 | EP1552729A4 Method for the manufacture of printed circuit boards with integral plated resistors |
| 06/25/2008 | CN201078874Y Mounting structure of connector surface label soldering |
| 06/25/2008 | CN201078873Y 电子装置 Electronic devices |
| 06/25/2008 | CN201078872Y Circuit board of lamp band with uninterrupted circuitry |
| 06/25/2008 | CN201078593Y Trapezoid LED unit and LED light apparatus lamp wick composed of the same |
| 06/25/2008 | CN101209003A High capacity thin module system and method |
| 06/25/2008 | CN101208835A 电互连系统 Electrical interconnection system |
| 06/25/2008 | CN101208373A Polyamide resin, epoxy resin compositions, and cured articles thereof |
| 06/25/2008 | CN101208195A Fiber-resin composite material, multilayer body, printed wiring board, and method for manufacturing printed wiring board |