| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/03/2008 | US7381903 Printed circuit board and inspection method therefor |
| 06/03/2008 | US7381902 Wiring board and method of manufacturing the same |
| 06/03/2008 | US7381901 Hinge board and method for producing the same |
| 06/03/2008 | US7381591 Flip-chip adaptor package for bare die |
| 06/03/2008 | US7381468 Mixture containign organic solvent and ceramic powder; controlling particle sizes; forming dielectrics |
| 06/03/2008 | US7381283 Applying a constraining layer with windows on it that does not need to be removed after firing; simplifies procedures to lower production cost; high quality multilayer ceramics |
| 06/03/2008 | US7381064 Flexible flat cable termination structure for a clockspring |
| 06/03/2008 | US7380961 Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
| 06/03/2008 | CA2422677C Technique for reducing the number of layers in a multilayer circuit board |
| 05/30/2008 | CA2606057A1 Printed circuit board |
| 05/29/2008 | WO2008062496A1 Ceramic member, method of forming groove in ceramic member, and substrate for electronic part |
| 05/29/2008 | US20080125531 Cycloolefin monomer, metathesis polymerization catalyst, a chain transfer agent, a radical crosslinking agent, and a retarder for crosslinking comprising an hydrocarbyloxyphenol or catechol structure; storage stability and fluidity in heat lamination; copper-clad laminate with interlayer adhesion |
| 05/29/2008 | US20080124953 Circuit protecting structure of electronic device |
| 05/29/2008 | US20080124528 Printed electronic device and methods of determining the electrical value thereof |
| 05/29/2008 | US20080124025 Optically connectable circuit board with optical component(s) mounted thereon |
| 05/29/2008 | US20080123310 High density integrated circuit apparatus, test probe and methods of use thereof |
| 05/29/2008 | US20080123309 Slim design main board |
| 05/29/2008 | US20080123307 Printed circuit board, printed circuit board assembly, electronic device, manufacturing method of printed circuit board, and warpage correcting method of printed circuit board |
| 05/29/2008 | US20080123305 Multi-channel memory modules for computing devices |
| 05/29/2008 | US20080123299 Circuit Device and Manufacturing Method of the Same |
| 05/29/2008 | US20080122547 Constant temperature type crystal oscillator |
| 05/29/2008 | US20080122389 Electro-optic device and electronic apparatus |
| 05/29/2008 | US20080121422 Multilayered printed-wiring board and inter-layer connecting method thereof |
| 05/29/2008 | US20080121421 Printed circuit board |
| 05/29/2008 | US20080121420 Printed circuit board having closed vias |
| 05/29/2008 | US20080121419 Assembly for a microstimulator |
| 05/29/2008 | US20080121418 Wiring board with built-in capacitor |
| 05/29/2008 | US20080121417 Package substrate having embedded capacitor |
| 05/29/2008 | US20080121416 Multilayer Printed Wiring Board And Manufacturing Method For Same |
| 05/29/2008 | US20080121415 Method for manufacturing flexible display device and flexible display device |
| 05/29/2008 | US20080121414 Printed circuit board and method for manufacturing thereof |
| 05/29/2008 | US20080121413 Method for manufacturing printed circuit boards |
| 05/29/2008 | US20080121412 Wiring pattern forming method, device and electronic apparatus |
| 05/29/2008 | DE19704930B4 An der Oberfläche zu befestigende Verbinder, die die Kapillarwirkung fördern On the surface to be attached connector, which promote the capillary action |
| 05/29/2008 | DE102006056171A1 Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung Device for determining and / or monitoring a process variable and method for contacting |
| 05/29/2008 | DE102006055576A1 Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger A method for producing a stretchable circuit carrier and stretchable circuit carrier |
| 05/29/2008 | DE102006054085A1 Bauelement-Anordnung Component placement |
| 05/29/2008 | DE102006053922A1 Modul mit Trägerelement Module with support element |
| 05/29/2008 | DE102006053792A1 Printed circuit board contacting device for motor vehicle, has zones lying on top of one another in boards, which are fixed together in mounting position and are arranged on top of each other, where zones are connected using contact unit |
| 05/29/2008 | DE102006053697A1 Leiterplatte mit additiven und integrierten und mittels Ultraschall kontaktierten Kupferelementen und Herstellverfahren und Anwendung PCB and integrated with additive and contacted by ultrasound copper elements and production methods and application |
| 05/28/2008 | EP1926355A2 Method for manufacturing an extendable circuit support and extendable circuit support |
| 05/28/2008 | EP1926354A1 Thermally conductive bus, in particular for a calculation unit with a microprocessor |
| 05/28/2008 | EP1741111A4 Compliant electrical contact assembly |
| 05/28/2008 | EP1547100B1 Electronic transformer/inductor devices and methods for making same |
| 05/28/2008 | EP1382048A4 Electrolytic capacitors and method for making them |
| 05/28/2008 | CN201066958Y Printed circuit board |
| 05/28/2008 | CN201066957Y A printed circuit board and meter mounting welding tray |
| 05/28/2008 | CN201066956Y A flexible line board terminal |
| 05/28/2008 | CN201066955Y A flexible printed line board |
| 05/28/2008 | CN201066953Y Anti-static module and circuit board with this anti-static module |
| 05/28/2008 | CN201066727Y High-intensity pluggable soft line connector |
| 05/28/2008 | CN201066416Y Separated dual-side LCD |
| 05/28/2008 | CN101189928A A method of supporting electronic components and an electronic device with elestic support for an electronic component |
| 05/28/2008 | CN101189924A Mold for wiring substrate formation and process for producing the same, wiring substrate and process for producing the same, process for producing multilayered laminated wiring substrate and method fo |
| 05/28/2008 | CN101189922A Printed wiring board with a pin for mounting a component and an electronic device using it |
| 05/28/2008 | CN101189921A Circuit base plate and its making method and electronic component using the same |
| 05/28/2008 | CN101189769A Laser drive circuit |
| 05/28/2008 | CN101189738A Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment |
| 05/28/2008 | CN101188915A Method of manufacturing a component-embedded printed circuit board |
| 05/28/2008 | CN101188909A A flexible circuit board and its copper plating method |
| 05/28/2008 | CN101188905A Method of producing printed circuit board incorporating resistance element |
| 05/28/2008 | CN101188904A Circuit board assembly |
| 05/28/2008 | CN101188903A Multilayer printing circuit board |
| 05/28/2008 | CN101188902A Printed circuit board |
| 05/28/2008 | CN101188334A Completely integrated Ethernet connector |
| 05/28/2008 | CN101188332A Connection method of direct insertion wiring terminal and main circuit board and connection device |
| 05/28/2008 | CN101188161A Method of making thin-film capacitors on metal foil using thick top electrodes |
| 05/28/2008 | CN101186495A Microwave dielectric composition and microwave dielectric resonator |
| 05/28/2008 | CN100391319C Single board able to realize live-wire insertion and its realizing method |
| 05/28/2008 | CN100391318C Electronic device with switching structure and its switching method |
| 05/28/2008 | CN100391317C Electric connecting part |
| 05/28/2008 | CN100390989C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 05/28/2008 | CN100390982C Semiconductor device and method of manufacturing semiconductor device |
| 05/28/2008 | CN100390980C Signal line circuit device |
| 05/28/2008 | CN100390972C Method and device for producing multi-layer ceramic substrate |
| 05/28/2008 | CN100390971C Electronic substrate, power module, and motor driver |
| 05/28/2008 | CN100390969C Semiconductor device |
| 05/28/2008 | CN100390318C Method for repairing fine pattern and apparatus for repairing fine pattern |
| 05/28/2008 | CN100390233C Hardener composition for epoxy resins |
| 05/28/2008 | CN100389889C Hot melt conductor paste composition |
| 05/27/2008 | US7380179 High reliability memory module with a fault tolerant address and command bus |
| 05/27/2008 | US7379712 Wearable device |
| 05/27/2008 | US7379306 Multilayer substrate including components therein |
| 05/27/2008 | US7378685 Flat display device |
| 05/27/2008 | US7378602 Multilayer core board and manufacturing method thereof |
| 05/27/2008 | US7378600 Electronic circuit prototyping composite support |
| 05/27/2008 | US7378599 Printed circuit board, radio wave receiving converter, and antenna device |
| 05/27/2008 | US7378598 Printed circuit board substrate and method for constructing same |
| 05/27/2008 | US7378596 Rigid-flex wiring board |
| 05/27/2008 | US7378345 Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof |
| 05/27/2008 | US7378228 using a multilayer insulating coating of an epoxy resin having two or more epoxy groups in one molecule, a modified phenolic resin having a triazine ring, a basic curing agent such as imidazole compound, a photosensitive acid generator, heat curing; fireproofing; dilution wtih MEK or other solvents |
| 05/27/2008 | US7378163 Higher melting substrate is an oxide or nitride of aluminum, titanium or zirconium; layer is silica powder, glass powder, glaze powder, copper oxide, lead oxide, hafnium oxide, or boron oxide and has embedded nanostructure stalagmites or columns extending towards the substrate; no polishing required |
| 05/27/2008 | US7378160 Finely patterned, excellent elongation and tensile strength at normal and high temperatures; amine is a glycerol derivative with terminal tertiary amine groups and pendant hydroxy groups or an endcapped polyethylene glycol or poly(1,2-propylene glycol); bis(alkylenesulfonic or phosphonic acid) disulfides |
| 05/27/2008 | US7378049 Method for producing ceramic substrate and electronic component module using ceramic substrate |
| 05/27/2008 | US7377990 Process for securing a microwave module to a support |
| 05/27/2008 | US7377795 Electrical contacts having solder stops |
| 05/27/2008 | US7377792 LGA socket connector having housing with upward protective protrusion adjacent contact terminal |
| 05/27/2008 | US7377034 Method for flexible circuits |
| 05/27/2008 | US7377032 Process for producing a printed wiring board for mounting electronic components |
| 05/27/2008 | US7377030 Wiring board manufacturing method |