Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
08/2010
08/17/2010USRE41516 Socketless/boardless test interposer card
08/17/2010US7778042 Memory system having point-to-point (PTP) and point-to-two-point (PTTP) links between devices
08/17/2010US7778041 Interconnection system between CPU and voltage regulator
08/17/2010US7778039 Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise
08/17/2010US7778038 Power core devices and methods of making thereof
08/17/2010US7777856 Flexible electrical display
08/17/2010US7777324 Interposer and semiconductor package with reduced contact area
08/17/2010US7777136 Multi-layered interconnect structure using liquid crystalline polymer dielectric
08/17/2010US7776438 Curing agent to generate free radicals with heating; a radically polymerizable substance; and film-forming polymer, wherein a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m
08/17/2010US7775971 Capsule apparatus with rigid and flexible wiring board sections
08/17/2010CA2390451C Conductive electrical element and antenna with ink additive technology
08/12/2010WO2010089254A1 Electro-optical control or regulation device and method for exchanging control or regulation signals
08/12/2010WO2010065503A3 Conductive formulations for use in electrical, electronic and rf applications
08/12/2010US20100203747 Flexible printed circuit board having embossed contact engaging portion
08/12/2010US20100202126 Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure
08/12/2010US20100202123 Circuit board
08/12/2010US20100202122 Carrier assembly for an integrated circuit
08/12/2010US20100202119 Structure for fixing flexible wiring board
08/12/2010US20100202118 Shifted segment layout for differential signal traces to mitigate bundle weave effect
08/12/2010US20100202115 Circuit board including an embedded component
08/12/2010US20100201838 Electronic apparatus
08/12/2010US20100201802 Resin composition and use thereof
08/12/2010US20100201465 Apparatus and method for electromagnetic mode suppression in microwave and millimeterwave packages
08/12/2010US20100200287 Printed wiring board, and design method for printed wiring board
08/12/2010US20100200286 Transparent electrode
08/12/2010US20100200285 High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof
08/12/2010US20100200284 Substrate manufacturing apparatus, substrate manufacturing method, ball-mounted substrate, and electronic component-mounted substrate
08/12/2010US20100200283 Insulation paste for a metal core substrate and electronic device
08/12/2010US20100200282 Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires
08/12/2010US20100200281 Circuit board structure
08/12/2010US20100200280 Printed circuit board unit and socket
08/12/2010US20100200279 Electronic component mounting substrate and method for manufacturing electronic component mounting substrate
08/12/2010US20100200278 Flexible Pixel Array Substrate and Flexible Display
08/12/2010US20100200277 Multi-layer circuit board, method of manufacturing the same, and communication device
08/12/2010US20100200276 Implementations of twisted differential pairs on a circuit board
08/12/2010DE10335439B4 Verfahren und Vorrichtung für die Bearbeitung von flexiblen Schaltungsträgern Method and device for the processing of flexible circuit supports
08/12/2010CA2692067A1 Organoamine stabilized silver nanoparticles and process for producing same
08/11/2010EP2217050A1 Electronic circuit board, and method and structure for shielding electronic circuit board
08/11/2010EP2217045A1 Wiring substrate and method of manufacturing the same
08/11/2010EP2217043A1 Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module
08/11/2010EP2216062A1 Aerosol aspirator
08/11/2010EP2215900A2 Electrical circuit arrangement having concentrated elements comprising said electrical circuit arrangement in multi-layer substrates
08/11/2010EP2215899A1 Junction box
08/11/2010EP2116114B1 Production process of printed circuits on which electronic components without leading wire are soldered
08/11/2010EP1735737B1 Memory cards having two standard sets of contacts
08/11/2010EP1636209B1 Epoxy compound and cured epoxy resin product
08/11/2010EP1627863B1 Porcelain composition
08/11/2010EP1474867B1 Television tuner and printed circuit board used therein
08/11/2010CN201550399U Shielding device
08/11/2010CN201550391U Circuit board cooling structure
08/11/2010CN201550362U Signal receiving or sending device and remote control receiving head
08/11/2010CN201550361U Multilayer printed circuit board
08/11/2010CN201550360U FPC earthing ear
08/11/2010CN201550359U Circuit board and steel mesh for manufacturing pad
08/11/2010CN201550358U Printed circuit board
08/11/2010CN201550357U Printing circuit board
08/11/2010CN201550356U Circuit board capable of loading large current
08/11/2010CN201550355U Thin film circuit board and keyboard thereof
08/11/2010CN201550354U Circuit board and circuit device
08/11/2010CN201550353U Flexible circuit board
08/11/2010CN201550352U Flexible PCB and LCM employing same
08/11/2010CN201550349U Device for preventing interference caused on system circuit by ESD
08/11/2010CN201548608U Circuit board of power sensor
08/11/2010CN201547554U High power LED lamp panel
08/11/2010CN1952653B Disposable whole blood uric acid testing electrode indicator bar and manufacturing method thereof
08/11/2010CN101803478A Illumination device and method for the production thereof
08/11/2010CN101803477A Electronic component package and method for producing the same
08/11/2010CN101803476A Solid printed wiring board, method for manufacturing solid printed wiring board, and electronic component module
08/11/2010CN101803475A Structure for fixing flexible wiring board
08/11/2010CN101803474A Carrier foil
08/11/2010CN101803473A Multiple micro HF-contact arrangement
08/11/2010CN101803184A High output power amplifier, wireless transmitter, wireless transmitting and receiving device, and high output power amplifier mounting method
08/11/2010CN101803020A Laminated mounting structure and method for manufacturing laminated mounting structure
08/11/2010CN101802785A Fast simulation method for integrated circuits with power management circuitry
08/11/2010CN101802118A Adhesive composition and bonded body
08/11/2010CN101801886A Component having a ceramic base the surface of which is metalized
08/11/2010CN101801156A Method for manufacturing flexible printed circuit board and structure thereof
08/11/2010CN101801155A Flexible printed circuit board and electric connector provided with same
08/11/2010CN101801154A Circuit board
08/11/2010CN101799124A Novel LED lamp tube module group
08/11/2010CN101798463A High-performance polyimide film and preparation method thereof
08/11/2010CN101483969B Reinforcing structure for flexible circuit board
08/11/2010CN101435897B Method for connecting receiving end grounding pin of light transmit-receive device reliably
08/11/2010CN101313635B Apparatus and method for impedance matching in a backplane signal channel
08/11/2010CN101082773B Photo- and thermo-setting solder resist composition and printed wire board using same
08/10/2010US7774557 Storage access system and method for image forming device
08/10/2010US7773390 Power distribution system for integrated circuits
08/10/2010US7773386 Flexible substrate, multilayer flexible substrate
08/10/2010US7773113 Card based image manipulation method for camera
08/10/2010US7772684 Electronic device and production method thereof
08/10/2010US7772501 Flexible printed circuit board
08/10/2010US7771835 Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the same
08/10/2010US7771779 Heating a substrate coated with a curable polymer and a glass transition suppression modifier to greater than the glass transition temperature but less than the curing temperature; and heat curing the layer to form a substrate with percent planarization at 100 micrometers of greater than fifty percent.
08/10/2010US7771627 Silver oxide, carbonate and/or acetate, reducing agent and binder; low temperature heat coating; flexible, thin
08/10/2010US7771213 Solderable electric contact terminal
08/10/2010US7771211 Socket with base shell, cover shell and contact member for mounting element within cavity defined by base shell and cover shell
08/05/2010WO2010088603A1 High speed interconnect cable assembly
08/05/2010WO2010088584A1 Connector with liquid dielectric reservoir
08/05/2010WO2010087691A1 Card for interconnecting electronic components using insulated cable or wire
08/05/2010WO2010087526A1 Resin composition
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