Patents for H05K 1 - Printed circuits (98,583)
07/2010
07/01/2010WO2010074085A1 Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board, and semiconductor device
07/01/2010WO2010074072A1 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
07/01/2010WO2010074061A1 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
07/01/2010WO2010074056A1 Flexible laminate and flexible electronic circuit substrate formed using the same
07/01/2010WO2010074053A1 Rolled copper foil or electrolytic copper foil for electronic circuit and method of forming electronic circuit using same
07/01/2010WO2010073952A1 Copper foil with resin
07/01/2010WO2010073816A1 Method for producing multilayer wiring substrate
07/01/2010WO2010073745A1 Metal foil with carrier
07/01/2010WO2010073744A1 Metal foil with carrier
07/01/2010WO2010071905A1 Method for designing signal lines in a multi-layer printed circuit board and multi-layer printed circuit board produced in this way
07/01/2010WO2010036433A3 A wireless telemetry electronic circuit board for high temperature environments
07/01/2010US20100167597 Electrode junction structure and manufacturing method thereof
07/01/2010US20100165657 Flexible printed circuit board for light emitting diode backlight unit and method of fabricating the same
07/01/2010US20100165590 Electronic device, electronic component, and method of manufacturing electronic device
07/01/2010US20100165586 Display panel apparatus
07/01/2010US20100165584 Detachable network communication device, electronic device and communication device
07/01/2010US20100165582 Power semiconductor module system
07/01/2010US20100165581 Package for micro-electro-mechanical systems of the mems type and corresponding manufacturing process
07/01/2010US20100165185 Circuit board assembly
07/01/2010US20100164362 Metal base circuit board
07/01/2010US20100164089 Non-Conductive Planarization of Substrate Surface for Mold Cap
07/01/2010US20100164085 Multi-die building block for stacked-die package
07/01/2010US20100163425 Ultrahigh-Purity Copper and Process for Producing the Same
07/01/2010US20100163297 Printed wiring board and method for manufacturing the same
07/01/2010US20100163296 Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof
07/01/2010US20100163295 Coaxial plated through holes (pth) for robust electrical performance
07/01/2010US20100163294 Method for forming metal line of semiconductor device
07/01/2010US20100163293 Printed wiring board and method for manufacturing printed wiring board
07/01/2010US20100163291 Substrate embedded with passive device
07/01/2010US20100163290 Printed wiring board and method for manufacturing the same
07/01/2010US20100163289 Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board
07/01/2010US20100163288 Multilayered printed circuit board
07/01/2010US20100163287 Substrate structure and manufacturing method thereof
07/01/2010US20100163286 Circuit Board Structure and Manufacturing Method Thereof and Liquid Crystal Display Containing the Same
07/01/2010US20100163285 Graphene electronics fabrication
07/01/2010US20100163284 Array, substrate, and display device and its manufacturing method
07/01/2010US20100163283 Electronic circuitry integrated in fabrics
07/01/2010US20100163282 Printed wiring board, method for manufacturing printed wiring board, and electric device
07/01/2010US20100163281 Base for circuit board, circuit board, and method of fabricating thereof
07/01/2010DE202009016622U1 Vorrichtung zur Anordnung elektronischer Bauelemente Apparatus for assembly of electronic components
07/01/2010DE102008062516A1 Leiterplatte mit aufgewachsener Metallschicht in einer biegbaren Zone PCB with metal layer grew up in a flexible zone
06/2010
06/30/2010EP2203034A1 Attachment device and electronic apparatus
06/30/2010EP2202877A2 Electric power tools
06/30/2010EP2202755A1 Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle
06/30/2010EP2201830A1 Module for integrated control electronics having simplified design
06/30/2010EP2201826A2 Printed circuit board coil
06/30/2010EP2201825A2 Arcuate coil winding for edm
06/30/2010EP2201643A1 Method for producing a vehicle antenna device
06/30/2010EP2201163A1 Multi-layer woven fabric display
06/30/2010EP1723654B1 Interchangeable connection arrays for double-sided dimm placement
06/30/2010CN201518557U Circuit layout structure compatible with various USB power supply protection circuits
06/30/2010CN201518556U Circuit layout structure compatible with two standby circuits
06/30/2010CN101765295A Wiring board and method for manufacturing the same
06/30/2010CN101765294A Connecting structure of flexile printed circuit board and method for manufacturing same
06/30/2010CN101765293A Main framework of wireless network access device
06/30/2010CN101765292A 电路板结构 Circuit board structure
06/30/2010CN101764009A Electrode junction structure and manufacturing method thereof
06/30/2010CN101763942A Capacitor, circuit board and method for manufacturing circuit board
06/30/2010CN101763927A Slide potentiometer and circuit board and potentiometer main body thereof
06/30/2010CN101761788A Luminous module
06/30/2010CN101760731A Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof
06/30/2010CN101759857A Biomass-derived epoxy compound and manufacturing method thereof
06/30/2010CN101026923B Printed wiring board and connection configuration of the same
06/29/2010US7747341 Method and device for the production of a three-dimensional multi-material component by means of ink-jet-type printing
06/29/2010US7746659 Electro-optical device and electronic apparatus
06/29/2010US7746648 Modular heat-radiation structure and controller including the structure
06/29/2010US7745926 Composite multi-layer substrate and module using the substrate
06/29/2010US7745737 Printed circuit board having vias
06/29/2010US7745736 Interconnecting substrate and semiconductor device
06/29/2010US7745735 Cross-over of conductive interconnects and a method of crossing conductive interconnects
06/29/2010US7745734 Ceramic multilayer substrate
06/29/2010US7745733 Generic patterned conductor for customizable electronic devices
06/29/2010US7744382 Electrical connector with improved contact arrangement
06/29/2010US7744380 Overmolded electrical contact array
06/29/2010US7744378 Plug for connection strips and method for the production thereof
06/29/2010CA2608179C White prepreg, white laminates, and metal foil-cladded white laminates
06/29/2010CA2426110C A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article
06/29/2010CA2367036C Inverted microstrip transmisson line integrated in a multilayer structure
06/29/2010CA2357686C Electronic unit
06/24/2010WO2010071629A1 A system for placing electronic devices in a restricted space of a printed circuit board
06/24/2010WO2010071574A1 Stretchable high-frequency electronics
06/24/2010WO2010071426A1 Flexible electronic product and method for manufacturing the same
06/24/2010WO2010070964A1 Circuit module and method for managing same
06/24/2010WO2010070890A1 Prepreg, process for production thereof, and printed wiring board using same
06/24/2010WO2010070779A1 Anisotropic conductive resin, substrate connecting structure and electronic device
06/24/2010WO2010070771A1 Multilayer printed board and method for manufacturing the same
06/24/2010WO2010070017A1 Apparatus and methods
06/24/2010WO2010069786A1 Surface-mounted shielded multicomponent assembly
06/24/2010US20100159755 Compact Device Housing and Assembly Techniques Therefor
06/24/2010US20100157612 Heat radiating member, circuit board using the heat radiating member, electronic component module, and method of manufacturing the electronic component module
06/24/2010US20100157560 Wired circuit board and connection structure between wired circuit boards
06/24/2010US20100157549 Image sensor module
06/24/2010US20100157548 Foldable electrical devices
06/24/2010US20100157492 Electronic device and associated method
06/24/2010US20100156196 Electrically conductive element, system, and method of manufacturing
06/24/2010US20100155966 Grid array packages
06/24/2010US20100155952 Copper interconnection structures and semiconductor devices
06/24/2010US20100155939 Circuit board and fabrication method thereof and chip package structure
06/24/2010US20100155933 Package for semiconductor devices
06/24/2010US20100155930 Stackable semiconductor device assemblies