Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2010
10/13/2010CN201608969U 一种阶梯槽底部图形化线路板 One kind of groove at the bottom of the ladder graphic board
10/13/2010CN201608968U 双面胶联片的挠性印制电路板 Double-sided adhesive sheet associated flexible printed circuit board
10/13/2010CN201608967U 串扰补偿组件、印刷电路板、模块插口和插座端子 Crosstalk compensation components, printed circuit boards, modular jacks and socket terminals
10/13/2010CN201608966U 一种塑模互联无线收发模块 One kind of molded interconnect wireless transceiver module
10/13/2010CN201608965U 全印刷印制电路板 Fully printed printed circuit board
10/13/2010CN1939102B Carrier substrate with a thermochromatic coating
10/13/2010CN1910972B Nozzle arrangement and method for processing a material for processing with a processing medium
10/13/2010CN1899005B Ceramic substrate with chip type electronic component mounted thereon and process for manufacturing the same
10/13/2010CN1842248B Off-grid decoupling device and method of ball grid array (BGA)
10/13/2010CN1791310B Method for manufacturing a laminated board
10/13/2010CN1750734B Circuit board and method of manufacturing the same
10/13/2010CN1640155B Telecommunications patch panel
10/13/2010CN1608298B Use of conductor compositions in electronic circuits
10/13/2010CN1525492B Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
10/13/2010CN101861088A Electromagnetic noise suppression device and related electronic device thereof
10/13/2010CN101861059A Method for manufacturing laminated ceramic electronic component
10/13/2010CN101861053A Component switching device
10/13/2010CN101861052A Circuit board
10/13/2010CN101861051A Flexible printed circuit board
10/13/2010CN101861050A Flexible printed circuit board
10/13/2010CN101861049A Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof
10/13/2010CN101859945A Electric connector and circuit board assembly and display device applying same
10/13/2010CN101859744A Exposed die pad package with power ring
10/13/2010CN101858511A Deformable illumination module
10/13/2010CN101857735A Silicon dioxide eutectic filling material and preparation method of laminate
10/13/2010CN101857609A Phosphorus-containing compound as well as preparation method and application thereof
10/13/2010CN101856900A Preparation method of low-loss high-frequency copper-clad plate
10/13/2010CN101494953B Preparation method of double-layer method flexibility two-side coated copper plate for multilayer flexibility printed circuit
10/13/2010CN101360388B Electricity connection terminal construction of circuit board and preparation thereof
10/13/2010CN101351084B Circuit board and metal surface treatment technique thereof
10/13/2010CN101338877B Luminous diode array and backlight module group
10/13/2010CN101267715B Multilayer build-up wiring board
10/13/2010CN101252091B Forming method of sliver hole on substrate and substrate structure
10/13/2010CN101176390B Reduced-size VCO/PLL module
10/13/2010CN101115347B Printing distributing board and method for manufacturing same
10/13/2010CN101112133B 表面安装连接器 Surface mount connector
10/13/2010CN101048031B Printing plate, printing board, and printing method for printed board
10/13/2010CN101047063B Capacitor structure
10/12/2010US7813796 Biocompatible bonding method and electronics package suitable for implantation
10/12/2010US7813141 Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
10/12/2010US7813140 Methods and systems for filtering signals
10/12/2010US7813138 Electronic device
10/12/2010US7813136 Server enclosure
10/12/2010US7812913 Display device
10/12/2010US7812262 Multilayer printed circuit board
10/12/2010US7812261 Multilayer printed wiring board and test body for printed wiring board
10/12/2010US7811098 Connecting box of a solar panel with a cooling structure
10/12/2010CA2417172C Plant cultivating method, cultivating device, and its lighting device
10/07/2010WO2010115157A2 Spacer-connector and circuit board assembly
10/07/2010WO2010114839A1 Hot swappable computer card carrier
10/07/2010WO2010114238A2 Circuit board, and method for manufacturing same
10/07/2010WO2010114222A2 Flexible copper clad laminate having a buffer layer, and method for manufacturing same
10/07/2010WO2010114166A1 Flame-retardant phosphorus-containing epoxy resin composition and cured product thereof
10/07/2010WO2010113968A1 Optical and electrical circuit board and optical module
10/07/2010WO2010113892A1 Process for producing metallized substrate and metallized substrate
10/07/2010WO2010113287A1 Photosensitive electrically conductive paste and electrode pattern
10/07/2010WO2010112000A1 Metal/ceramic substrate
10/07/2010US20100254109 Mount assembly and method for manufacturing mount assembly
10/07/2010US20100254108 Display device and method of driving the same
10/07/2010US20100254099 Silicon-ceramic composite substrate
10/07/2010US20100254098 Circuit Board, Mounting Structure, and Method for Manufacturing Circuit Board
10/07/2010US20100254096 Hot Swappable Computer Card Carrier
10/07/2010US20100254095 Microelectronic security coatings
10/07/2010US20100252318 Multilayer printed wiring board
10/07/2010US20100252317 Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
10/07/2010US20100252316 Electronic component
10/07/2010US20100252315 Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas
10/07/2010US20100252314 Coin type electric double-layered capacitor, and capacitor-packaged element
10/07/2010US20100252313 Connection Terminal, Package Using the Same, and Electronic Apparatus
10/07/2010US20100252312 Assembly and production of an assembly
10/07/2010US20100252311 Terminal assembly with regions of differing solderability
10/07/2010US20100252310 Composite for multilayer circuit board
10/07/2010US20100252309 Polyimide film and wiring board
10/07/2010US20100252308 Printed wiring board and manufacturing method thereof
10/07/2010US20100252307 Flexible printed circuit board
10/07/2010US20100252306 Interconnect substrates, methods and systems thereof
10/07/2010US20100252305 Circuit board module and method of manufacturing the same
10/07/2010US20100252304 Wiring board and method of manufacturing the same
10/07/2010US20100252303 Circuit board and manufacturing method thereof
10/07/2010US20100252302 Circuit board for multi-type heat dissipating devices
10/07/2010DE112008003405T5 Leiterplatte und Verfahren zum Aufbringen einer elektronischen Komponente auf einer Platine Printed circuit board and method for applying an electronic component on a circuit board
10/07/2010DE102009015520A1 Metall-Keramik-Substrat A metal-ceramic substrate
10/07/2010DE102009014378A1 Electrically conductive ink composition, useful e.g. in mass printing method, comprises electrically non-conductive polymer, polymerizable material, siccative, carbon component comprising graphite and/or carbon black and optionally solvent
10/07/2010DE10037183B4 Verfahren zum Verbinden von Leiterplatten und Verbindungsaufbau A method for connecting printed circuit boards and connection set-up
10/06/2010EP2237650A1 Circuit connecting adhesive film and circuit connecting structure
10/06/2010EP2237649A2 Filter, in particular for filtering electromagnetic interference
10/06/2010EP2236565A1 Low polarity nano silver gels
10/06/2010EP2236017A1 Stacked foil sheet device
10/06/2010EP2235768A2 Battery pack containing pcm employed with safety member
10/06/2010EP2235741A1 Processing of electric and/or electronic elements on cellulosic material substrates
10/06/2010EP1908339B1 Mounting electrical components
10/06/2010EP1647051B1 Semiconductor power module with strip conductors which are detached from a substrate as external connections
10/06/2010EP1050888B1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
10/06/2010CN201601938U 一种散热装置及其电路板 A heat sink device and circuit boards
10/06/2010CN201601895U 一种扩展pcb板 An extension pcb board
10/06/2010CN201601894U 电感式印制电路板 Inductive printed circuit board
10/06/2010CN201601893U 一种带金手指的pcb板件 A tape Goldfinger pcb board member
10/06/2010CN201601892U 在铝基板或铝基散热板上直接制备的电路板 Cooling the aluminum plate or an aluminum plate prepared directly circuit board
10/06/2010CN201601891U 一种印刷电路板 A printed circuit board
10/06/2010CN201601890U 覆盖膜 Cover film
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