Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2010
10/21/2010US20100264537 Semiconductor Arrangement
10/21/2010US20100263923 Wiring substrate having columnar protruding part
10/21/2010US20100263922 Surface mounting chip carrier module
10/21/2010US20100263921 Circuit board and method of manufacturing the same
10/21/2010US20100263920 Electrical device and method of manufacturing thereof
10/21/2010US20100263919 Substrates for Electronic Circuitry Type Applications
10/21/2010US20100263918 Layout method and circuit board
10/21/2010US20100263917 Preparing Method for Printed Circuit Boards by Directing Printing and Printed Circuit Boards Prepared by the Method
10/21/2010US20100263916 Circuit board assembly
10/21/2010US20100263915 Circuit board structure having measures against heat
10/21/2010US20100263914 Floating Metal Elements in a Package Substrate
10/21/2010US20100263913 Metal wiring structures for uniform current density in c4 balls
10/21/2010US20100263462 Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder
10/21/2010DE10242366B4 Lichthärtgerät zum Aushärten von lichthärtbaren Materialien Light curing device for curing light-curable materials
10/20/2010EP2242340A2 Device for providing electrical energy to a consumer
10/20/2010EP2242067A1 A transformer
10/20/2010EP2241589A2 Composite material and high-frequency circuit substrate made therefrom
10/20/2010EP2241436A1 Adhesive-free flexible laminate
10/20/2010EP2241168A1 Intrinsically safe compliant circuit element spacing
10/20/2010EP2241167A1 Reduction of jitter in a semiconductor device by controlling printed circuit board or package substrate stackup
10/20/2010EP2240318A1 Method for making a heating element by depositing thin layers onto an insulating substrate, and resulting element
10/20/2010EP2127505B1 Method for producing an electrical resistor on a substrate
10/20/2010CN201611980U 元件直接插接的电路板 Member of the board direct plug
10/20/2010CN201611979U 共用一个供电电路的电路板 Share a power supply circuit board
10/20/2010CN201611978U 一种挠性印制电路板铜箔基板 A flexible printed circuit board copper foil substrate
10/20/2010CN201611606U 新型磁环变压器 The new magnetic transformer
10/20/2010CN1975950B Sheet capacitor manufacturing method
10/20/2010CN1832985B Fiber-reinforced composite material, manufacturing method therefor, and uses
10/20/2010CN101869006A Bendable circuit structure for led mounting and interconnection
10/20/2010CN101868747A Printed circuit board element and method for the production thereof
10/20/2010CN101868124A Circuit board stack structure for enhancing side soldering effect
10/20/2010CN101868123A Printed circuit board and design method thereof
10/20/2010CN101868122A PCB manufacturing process and hole plugging process thereof
10/20/2010CN101868121A Circuit board and method for forming connection part thereof
10/20/2010CN101868120A Printed wiring board and its manufacturing method
10/20/2010CN101868119A Flexible printed circuit board connecting structure body and manufacturing method thereof
10/20/2010CN101868118A High-frequency circuit substrate and production method thereof
10/20/2010CN101868117A Serial advanced technology attachment device
10/20/2010CN101868116A Circuit board and manufacturing method thereof
10/20/2010CN101868115A Solder mask structure of heavy copper circuit board
10/20/2010CN101867384A Wireless terminal for reducing specific absorption rate peak and realization method thereof
10/20/2010CN101866248A Two-layer circuit board structure for capacitive touch pad and manufacturing method thereof
10/20/2010CN101866108A Photosetting and thermosetting solder resist composition, and printed wiring board using the same
10/20/2010CN101864669A Surface treating agent for electronic-grade glass cloth and electronic-grade glass cloth surface produced by using the same
10/20/2010CN101864151A Flame retardant resin composition for highly peel-strenghthened printed circuit board, printed circuit board using the same and manufacturing method thereof
10/20/2010CN101864146A Epoxy resin composition for printed circuit copper-clad plate
10/20/2010CN101355850B Assembly substrate and method of manufacturing the same
10/20/2010CN101068893B Resin cured film for flexible printed wiring board and production process thereof
10/19/2010US7817441 Circuit board
10/19/2010US7817440 Multilayer printed wiring board
10/19/2010US7817439 System and apparatus for power distribution for a semiconductor device
10/19/2010US7817438 Transceiver module and PCB structure thereof
10/19/2010US7817434 Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board
10/19/2010US7816754 Ball grid array package construction with raised solder ball pads
10/19/2010US7816611 Circuit board
10/19/2010US7816610 Layout circuit
10/19/2010US7816609 Wired circuit board
10/19/2010US7816608 CTS and inspecting method thereof
10/19/2010US7816430 a polycyanurate comprising a cyanatophenyl group and a phenol group, and an epoxy resin having a biphenyl structure in the molecule; printed-wiring boards for wireless communications, electronics
10/19/2010US7816247 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations
10/19/2010US7816176 Method of manufacturing electronic component package
10/19/2010US7816171 Component packaging apparatus, systems, and methods
10/19/2010US7815441 Rigid-flexible board and method for manufacturing the same
10/19/2010CA2550887C Microphone coupler for a communication device
10/14/2010WO2010117383A1 Bonded hermetic feed through for an active implantable medical device
10/14/2010WO2010117023A1 Metal-based circuit board and method for producing same
10/14/2010WO2010116980A1 Wiring board and connection structure
10/14/2010WO2010116851A1 Charged powder
10/14/2010WO2010116746A1 ELECTRONIC COMPONENT PROVIDED WITH Cu-Al-Co-BASED ALLOY ELECTRODE OR WIRING
10/14/2010WO2010116469A1 Differential path replacement component, printed board, and electronic device
10/14/2010WO2010116301A1 Oled luminary with improved mounting means
10/14/2010US20100259930 Package for multiple light emitting diodes
10/14/2010US20100259912 Electronic device
10/14/2010US20100259911 Magnetic microinductors for integrated circuit packaging
10/14/2010US20100259910 Circuit Board and Mounting Structure
10/14/2010US20100259904 Signal Conversion Device
10/14/2010US20100258954 Electrode structure and its manufacturing method, and semiconductor module
10/14/2010US20100258953 Substrate and semiconductor device
10/14/2010US20100258938 Substrate and semiconductor device
10/14/2010US20100258838 Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device
10/14/2010US20100258342 Bonded hermetic feed through for an active implantable medical device
10/14/2010US20100258341 Mounting board and method of producing the same
10/14/2010US20100258340 Composite material and high-frequency circuit substrate made therefrom
10/14/2010US20100258339 Varnish and Prepreg, and Substrates Thereof
10/14/2010US20100258338 Flexible printed circuit board
10/14/2010US20100258337 Flexible printed circuit board
10/14/2010US20100258336 Positive photosensitive resin composition, method for forming pattern, electronic component
10/14/2010DE102009016112A1 Device for wire bonding, has electrical components and electrical cable for electrical connection of electrical contact of one component with another component
10/14/2010DE102009002196A1 Optoelectronic device for e.g. mobile phone, has free space emission units for emission of light beams in different space directions arranged on optical conductor plate and optically coupled with light conductors of conductor plate
10/13/2010EP2239743A1 Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for manufacturing light-emitting device
10/13/2010EP2239619A1 Optical device, sealing board and method for manufacturing optical device
10/13/2010EP2239604A1 Opto-electric hybrid board and electronic device
10/13/2010EP2239142A1 Method for silk screen printing onto a conductor made of two superposed layers
10/13/2010EP1210848B1 Bidirectional interface tool for pwb development and method for customizing such a tool
10/13/2010CN201608975U 一种主板及终端 One kind of motherboard and terminal
10/13/2010CN201608974U 机械钻孔板 Mechanical drilling plate
10/13/2010CN201608973U 一种厚铜pcb板件 Of thick copper pcb board member
10/13/2010CN201608972U 一种加强型挠性印制电路板 Of an Enhanced flexible printed circuit board
10/13/2010CN201608971U 电路板 Board
10/13/2010CN201608970U 电路板组合 Circuit board assembly
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