Patents for H05K 1 - Printed circuits (98,583)
08/2010
08/25/2010CN101378620B Heat-resisting structure
08/25/2010CN101376734B Epoxide-resin glue liquid, laminated board for printed circuit board manufactured by using the same and manufacturing method thereof
08/25/2010CN101309552B Conducting construction of circuit board and manufacturing method therefor
08/25/2010CN101307889B Lamp electrode printed circuit board and backlight unit including the same
08/25/2010CN101267716B Multilayer build-up wiring board
08/25/2010CN101174737B Electric signal connecting structure
08/25/2010CN101146401B Multilayer wiring plate
08/25/2010CN101089635B Device for current overload prealarm prompt on PCB circuit board
08/25/2010CN101017733B Ic socket
08/24/2010USRE41578 Micro electrochemical energy storage cells
08/24/2010US7783792 Enclosure slot identification by modules
08/24/2010US7782629 Embedding an electronic component between surfaces of a printed circuit board
08/24/2010US7781681 Multilayer printed wiring board
08/24/2010US7781680 Flexible printed circuit board
08/24/2010US7781679 Disk drive suspension via formation using a tie layer and product
08/24/2010US7781328 Multilayer substrate
08/24/2010US7781051 Perforated functional textile structures
08/24/2010US7780876 Fine metal particles dispersed in liquid solvent; heat treating to maintain black color in pigment
08/24/2010US7780477 Adapter system for use with an expresscard slot
08/24/2010US7780365 Camera module and method of manufacturing the same
08/24/2010US7780361 Card guide and heatsink assemblies for pluggable electro-optic modules
08/19/2010WO2010093064A1 Fire-resistant phosphorus-containing epoxy resin composition and hardened substance obtained thereby
08/19/2010WO2010093009A1 Metal foil, method for producing same, insulating substrate, and wiring board
08/19/2010WO2010092970A1 Sintered body of low temperature cofired ceramic and multilayer ceramic substrate
08/19/2010WO2010092969A1 Low temperature cofired ceramic material and ceramic substrate
08/19/2010WO2010092905A1 Insulating circuit board, inverter device and power semiconductor device
08/19/2010WO2010092725A1 Connection terminal and display device with the connection terminal
08/19/2010US20100210045 Opto-electronic device package with a semiconductor-based sub-mount having smd metal contacts
08/19/2010US20100209682 Planar laminate substrate and method for fabricating organic laminate substrate pcbs, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways
08/19/2010US20100208445 Multi-layer woven fabric display
08/19/2010US20100208444 Circuit connection material, circuit member connecting structure and method of connecting circuit member
08/19/2010US20100208441 Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same
08/19/2010US20100208440 Passive electrical article
08/19/2010US20100208439 Wiring board, method of manufacturing same, tuner module, and electronic device
08/19/2010US20100208437 Multilayer wiring substrate and method for manufacturing the same
08/19/2010US20100208436 Multilayer Circuit Board and Use of a Multilayer Circuit Board
08/19/2010US20100207855 Circuit board and display panel assembly having the same
08/19/2010US20100207275 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
08/19/2010US20100207244 Semiconductor apparatus with decoupling capacitor
08/19/2010US20100207229 Non-planar microcircuit structure and method of fabricating same
08/19/2010US20100207016 Channel Cell System
08/19/2010US20100206863 Electrically conductive, flexible web material
08/19/2010US20100206626 Printed circuit board unit
08/19/2010US20100206625 Composite Circuit Board
08/19/2010US20100206624 Electric Multilayer Component
08/19/2010US20100206623 Nonconductive adhesive composition and film and methods of making
08/19/2010US20100206622 Substrate structure and package structure using the same
08/19/2010US20100206621 Wiring board with built-in component and method for manufacturing wiring board with built-in component
08/19/2010US20100206620 Printed Board, Image Pickup Apparatus and Camera
08/19/2010US20100206619 Package substrate strucutre with cavity and method for making the same
08/19/2010US20100206618 Coreless Substrate and Method for Making the Same
08/19/2010US20100206617 Electrical isolating structure for conductors in a substrate
08/19/2010DE102009008087A1 Elektrooptisches Steuer-oder Regelgerät und Verfahren zum Austausch von Steuer-und Regelsignalen Electro-optical control or regulating device and method for exchanging control and control signals
08/19/2010DE102009007204A1 Printed circuit board for use as LED module utilized for lighting purpose, has contact bridge arranged on connection point, connected with track at point and soldered with line at another connection point that is spaced apart from point
08/19/2010DE102009006757B3 Lötstopplack-Beschichtung für starrbiegsame Leiterplatten Solder mask coating for printed circuit boards starrbiegsame
08/19/2010DE10033352B4 Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe A process for preparing an electronic assembly and electronic assembly
08/18/2010EP2219425A2 Circuit module, in particular control module for a driving dynamics regulating system
08/18/2010EP2219424A1 Voltage switchable dielectric material incorporating modified high aspect ratio particles
08/18/2010EP2219067A1 A backlight unit comprising a light emitting diode on a module substrate, a device comprising said unit
08/18/2010EP2218311A2 Process for placing, securing and interconnecting electronic components
08/18/2010EP1598863B1 Semiconductor device and radiation detector employing it
08/18/2010CN201557365U Shielding frame and portable electronic equipment
08/18/2010CN201557364U Shielding case and overlaid circuit boards
08/18/2010CN201557354U Mounting structure for vehicle-mounted sound equipment IC (Integrated Chip) and radiating fins
08/18/2010CN201557325U Mounting device
08/18/2010CN201557324U Flexible printed circuit board convenient for installation
08/18/2010CN201557323U Structure for heating devices on PCB
08/18/2010CN201557322U Flexible circuit board
08/18/2010CN201557321U Circuit board and electrical apparatus
08/18/2010CN201557320U Radiating circuit board
08/18/2010CN201555171U LED lighting element
08/18/2010CN201555098U LED hurdle lamp of glass fibre board
08/18/2010CN1997261B Electronic carrier board and its packaging structure
08/18/2010CN1976556B Wired circuit board
08/18/2010CN1758830B High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same
08/18/2010CN1680067B Laser machining apparatus for sheet-like workpiece
08/18/2010CN1638604B Method and device for contactless treatment of flat objects in through type treatment equipment
08/18/2010CN1604722B Optical disc device
08/18/2010CN1551712B Electronic circuit connection structure and its connection method
08/18/2010CN101810062A Printed circuit board coil
08/18/2010CN101810061A Printed board unit and electronic device
08/18/2010CN101808791A Polyimide film and wiring board
08/18/2010CN101808492A Electronic circuit device for compressor
08/18/2010CN101808479A Technique for reducing the number of layers in multilayer circuit board
08/18/2010CN101808466A Manufacturing method of copper-clad plate and glue solution for copper-clad plate
08/18/2010CN101808461A Circuit board
08/18/2010CN101808460A Routing method for PCB and PCB
08/18/2010CN101807751A Radio communication terminal with printing substrate
08/18/2010CN101807563A Electrostatic protection element and electronic device
08/18/2010CN101807554A Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
08/18/2010CN101805573A Double-coated pressure sensitive adhesive sheet
08/18/2010CN101805538A Lower-temperature sintered conductive ink
08/18/2010CN101557676B Printed circuit board
08/18/2010CN101442879B Circuit board and conductivity through-hole structure thereof
08/18/2010CN101354497B Backlight unit and liquid crystal display device having the same
08/18/2010CN101315500B Device for continuously supplying and collecting anisotropic electroconductive film, and bonding equipment using the same
08/18/2010CN101267710B Printed circuit board unit and printed wiring board
08/18/2010CN101233655B Anisotropic conductive film and method for producing same
08/18/2010CN101065843B Method for manufacturing an electronics module
08/18/2010CN101052266B Printed circuit board and manufacturing method thereof