Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2010
11/03/2010CN101878544A Chip assembly, connecting assembly, led and method for producing a chip assembly
11/03/2010CN101877945A Method for removing via stub and PCB designed by using the method
11/03/2010CN101877944A Full implanting board of printed circuit board and connecting method thereof
11/03/2010CN101877938A Manufacturing method of sheet printed circuit board and sheet printed circuit board
11/03/2010CN101877937A Printed circuit board and magnetic head driving device including the same
11/03/2010CN101877936A Flexible printed circuit board
11/03/2010CN101877935A Mainboard wiring method and mainboard for wiring by using same
11/03/2010CN101877934A Circuit board interconnecting device
11/03/2010CN101877933A Flexible circuit board
11/03/2010CN101877932A Double-sided inserted backplane and slot position connector
11/03/2010CN101876759A Display module and fixing mechanism thereof
11/03/2010CN101875825A Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same
11/03/2010CN101461701B Minitype sensor and method for producing the same
11/03/2010CN101427613B Substrate joining member and three-dimensional structure using the same
11/03/2010CN101309550B Circuit board and electronic device applying the same
11/03/2010CN101296561B Flexible printing patchboard and sliding lid type mobile phone terminal using the same
11/03/2010CN101185379B Generic patterned conductor for customizable electronic devices
11/03/2010CN101155469B Circuit board and method for manufacturing semiconductor modules and circuit boards
11/02/2010US7825809 Marking system for a flex circuit or printed cable
11/02/2010US7825555 Surface mount-type vibration motor and fixation structure for surface mount-type vibration motor
11/02/2010US7825537 Inductive power transfer system and method
11/02/2010US7825340 Double-sided wiring board, manufacturing method of double-sided wiring board, and mounting double-sided wiring board
11/02/2010US7825198 Thermosetting resin composition and multilayer printed wiring board using the same
11/02/2010US7824187 High density connector
11/02/2010US7823793 IC card and an adapter for the same
11/02/2010US7823281 Method for compensating for crosstalk
11/02/2010US7823276 Parts mounting method
11/01/2010CA2702717A1 Light emitting diode arrangement for high safety requirements
11/01/2010CA2702704A1 Electronic apparatus for lighting applications
10/2010
10/28/2010WO2010122918A1 Substrate for printed wiring board, printed wiring board, and methods for producing same
10/28/2010WO2010122757A1 Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein
10/28/2010WO2010121801A1 Circuit board base material for high frequency applications, circuit board for high frequency applications and housing
10/28/2010WO2009112241A8 Condenser microphone
10/28/2010WO2008128016A9 Metal core circuit boards for light emitting diode applications and methods of manufacture thereof
10/28/2010US20100273348 Flat signal transmission cable with bundling structure
10/28/2010US20100271793 Printed circuit board with optimized mounting holes and alignment pins
10/28/2010US20100271788 Circuit module and electronic equipment using the circuit module
10/28/2010US20100271113 Integrated circuit with multiple independent power supply zones
10/28/2010US20100270923 Printed Circuit Board
10/28/2010US20100270067 Printed circuit board and method of manufacturing the same
10/28/2010US20100270065 Resin Composition For Printed Circuit Board and Printed Circuit Board Using The Same
10/28/2010US20100270064 Resin composition for printed circuit board and printed circuit board using the same
10/28/2010US20100270063 Ultrathin copper foil with carrier and printed circuit board using same
10/28/2010US20100270062 Method and Apparatus for an Improved Filled Via
10/28/2010US20100270061 Floating Metal Elements in a Package Substrate
10/28/2010US20100270060 Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method
10/28/2010US20100270059 Printed wiring board
10/28/2010US20100270058 Methods for making electronic devices
10/28/2010US20100270057 Circuit board and method for manufacturing the same
10/28/2010DE102009018541A1 Contacting unit for electronic component, is porous metallic layered structure, and contact surface of electronic component and layered structure geometrically fit to each other, where thickness of layer is ten micrometers
10/28/2010DE102006033269B4 Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper A method for producing an assembly comprising a flexible circuit carrier, a base plate and a sealing body
10/27/2010EP2244541A1 Surface mount circuit board, method for manufacturing a surface mount circuit board, and method for mounting surface mount electronc devices
10/27/2010EP2244539A2 Flat component assembly and method for its production
10/27/2010EP1726191B1 Flexible circuit board assembly
10/27/2010CN201616955U 柔性印刷线路板 Flexible printed circuit boards
10/27/2010CN201616954U 电路板 Board
10/27/2010CN201616953U 导热覆盖膜 Thermal cover film
10/27/2010CN201616952U 双面线路板 Double-sided circuit boards
10/27/2010CN201616928U 一种led一体化家装筒灯线路板 One kind of led downlight integrated circuit board decoration
10/27/2010CN201616778U 电力转换电路板 The power conversion circuit board
10/27/2010CN201616759U 电力架构 Power Architecture
10/27/2010CN101874336A Circuit configuration for eliminating emc interference
10/27/2010CN101873767A Sodium-sprayed circuit board
10/27/2010CN101873763A Printed circuit board
10/27/2010CN101873762A 印刷电路板 A printed circuit board
10/27/2010CN101873761A Circuit board having optical readable mark code and manufacturing method thereof
10/27/2010CN101872833A LED signal lamp, PCB (Printed Circuit Board) substrate structure thereof and light source assembly
10/27/2010CN101872124A Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method
10/27/2010CN101870832A Method for preparing nano silver conductive ink
10/27/2010CN101870763A Resin composition for printed circuit board and printed circuit board using the same
10/27/2010CN101351080B Printed circuit board
10/27/2010CN101300911B Circuit module and method for manufacturing circuit module
10/27/2010CN101167414B Heat conductor method and system
10/27/2010CN101151946B Multi-layer laminate and flexible copper-clad laminated substrate production method
10/27/2010CN101072470B Glass circuit board and its manufacturing method
10/27/2010CN101019474B Structured surface using ablatable radiation sensitive material
10/26/2010US7822302 Circuit board and method for manufacturing the same
10/26/2010US7821796 Reference plane voids with strip segment for improving transmission line integrity over vias
10/26/2010US7821795 Multilayer wiring board
10/26/2010US7821794 Layered label structure with timer
10/26/2010US7821792 Cell board interconnection architecture
10/26/2010US7821136 layer of metal composite is applied on substrate, comprising metal flakes, nanometer metal spheres, and metal precursors; precursors comprise mixture of inorganic salts and organic acidic salts; layer of metal composite is cured to induce exothermic reaction, forming a conductive layer at low temperature
10/26/2010US7821127 Semiconductor device package having buffered memory module and method thereof
10/26/2010US7821122 Method and system for increasing circuitry interconnection and component capacity in a multi-component package
10/26/2010US7820994 System to test electronic part and method of controlling the same
10/26/2010US7820917 Circuit board
10/26/2010US7820916 Composite ceramic substrate
10/26/2010US7820490 Method for LTCC circuitry
10/26/2010US7818855 Method of making thin-film capacitors on metal foil using thick top electrodes
10/26/2010CA2502679C Porous membrane of poly(metaphenylene isophthalamide) and process for producing the same
10/26/2010CA2341280C Mo-cu composite powder
10/21/2010WO2010121230A1 Cooling device, electronic substrate and electronic device
10/21/2010WO2010119787A1 Composition for forming conductor layer, conductor substrate, and method for producing conductor substrate
10/21/2010US20100265685 Wiring-connecting material and wiring-connected board production process using the same
10/21/2010US20100265671 Package structure of printed circuit board and package method thereof
10/21/2010US20100265668 Flexible display screen
10/21/2010US20100264950 Electronic device including electronic part and wiring substrate
10/21/2010US20100264947 Closed-grid bus architecture for wafer interconnect structure
10/21/2010US20100264552 Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module
10/21/2010US20100264540 IC Package Reducing Wiring Layers on Substrate and Its Carrier
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