Patents for H05K 1 - Printed circuits (98,583)
06/2010
06/16/2010CN101741150A 电源供应组件 Power supply components
06/16/2010CN101740919A Printed wiring board connector pin having an acircular profile
06/16/2010CN101740896A 高频电路模块 High-frequency circuit module
06/16/2010CN101740538A Printed circuit board having flow preventing dam and manufacturing method thereof
06/16/2010CN101740041A Suspension board with circuit and producing method thereof
06/16/2010CN101740040A Suspension board with circuit
06/16/2010CN101738684A Opto-electric hybrid board and manufacturing method thereof
06/16/2010CN101735575A Resin composition and method for preparing FPC coverlay by using same
06/16/2010CN101735456A High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby
06/16/2010CN101466205B Circuit board preparation method
06/16/2010CN101409982B Method for manufacturing circuit board
06/16/2010CN101356864B Copper clad laminate for pasting chip on flexible plate
06/16/2010CN101345297B Button battery electrical connection structure and its manufacture process
06/16/2010CN101232773B Flexible printed circuit board
06/16/2010CN101203089B Multilayer printed circuit board
06/16/2010CN101194540B Connection method of conductive articles, and electric or electronic component with parts connected by the connection method
06/16/2010CN101188909B A flexible circuit board and its copper plating method
06/16/2010CN101155468B Printed wiring board reliably achieving electric connection with electronic component
06/16/2010CN101150121B Flexible circuits having improved reliability and thermal dissipation
06/16/2010CN101112134B Packaging installation module
06/16/2010CN101106125B Composite assembly that incorporates multiple devices that use different wavelengths of light and method for making the composite assembly
06/16/2010CN101101093B Light emitting module and lighting device for vehicle
06/16/2010CN101095381B Printed circuit board for high-speed electrical connectors
06/15/2010US7738261 Functional device fabrication apparatus and functional device fabricated with the same
06/15/2010US7738259 Shared via decoupling for area arrays components
06/15/2010US7738258 Semiconductor mounting board
06/15/2010US7738257 Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same
06/15/2010US7738256 Multilayer substrate including components therein
06/15/2010US7738253 Power supply assembly
06/15/2010US7737796 Constant temperature type crystal oscillator
06/15/2010US7737368 Circuit board and method of manufacturing circuit board
06/15/2010US7737367 Multilayer circuit board and manufacturing method thereof
06/15/2010US7737366 Multilayer printed wiring board with filled viahole structure
06/15/2010US7737365 Wired circuit board
06/15/2010US7737207 Synthetic resin having a melting temperature of 300 degrees C. or above and a platy inorganic filler such as flaky titanates, mica, sericite, illite, talc, kaolinite, montmorillonite, or boehmite; excellent in mechanical strength and heat resistance, low in linear expansion coefficient and anisotropy
06/15/2010US7737198 Wholly aromatic liquid crystal polyester resin molded product
06/15/2010US7737065 Process for producing aluminum nitride sintered compacts
06/15/2010US7737025 Via including multiple electrical paths
06/15/2010US7736997 Production method of flexible electronic device
06/15/2010US7736749 Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board
06/15/2010US7736693 applying an emulsion onto a surface of substrate, drying to remove the liquid carrier containing water and solvent such as methanol, metal alloy (Al leached alloy) nano-particles, sintering at low temperature to form a transparent and electroconductive coating in the form of a network-like pattern
06/15/2010US7736544 Electrically conductive composition for via-holes
06/15/2010US7735741 Method for production of a card with a double interface and microcircuit card obtained thus
06/10/2010WO2010065596A1 Electrical interconnection system
06/10/2010WO2010065542A1 Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
06/10/2010WO2010065503A2 Conductive formulations for use in electrical, electronic and rf applications
06/10/2010WO2010064677A1 Capacitance sensor
06/10/2010WO2010064606A1 Sheet for reinforcing flexible printed-wiring board, and flexible printed-wiring board formed using same
06/10/2010WO2010064570A1 Component mounting method and device manufactured using the same
06/10/2010WO2010064560A1 Connecting film, joined body, and manufacturing method therefor
06/10/2010WO2010064364A1 Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object
06/10/2010WO2010063194A1 Multilayer mixed-compressing printed circuit board and its manufacture method and manufacture device
06/10/2010WO2010044670A3 Method and device for a controllable coil and/or capacitor and/or circuit
06/10/2010US20100143718 Polymer-wrapped single-wall carbon nanotubes
06/10/2010US20100143665 Patterned fine particle film structures
06/10/2010US20100142170 Chip embedded printed circuit board and manufacturing method thereof
06/10/2010US20100142169 Electronic device and process for manufacturing electronic device
06/10/2010US20100142161 Portable Electronic Device with USB Connector
06/10/2010US20100142118 Copper-clad laminate with capacitor, printed circuit board having the same, and semiconductor package having the printed circuit board
06/10/2010US20100142097 Suspension substrate, suspension, head suspension and hard disk drive
06/10/2010US20100141549 Circuit substrate supporting structure and antenna apparatus
06/10/2010US20100140807 Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof
06/10/2010US20100140803 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
06/10/2010US20100140797 Device mounting board and method of manufacturing the board, semiconductor module and method of manufacturing the module
06/10/2010US20100139969 Printed circuit board comprising metal bump and method of manufacturing the same
06/10/2010US20100139968 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
06/10/2010US20100139966 Inner substrate for manufacturing multilayer printed circuit boards
06/10/2010US20100139965 Embedded circuit substrate and manufacturing method thereof
06/10/2010US20100139964 Printed circuit board comprising metal bump and method of manufacturing the same
06/10/2010US20100139963 Interconnect substrate, method of manufacturing interconnect substrate and semiconductor device
06/10/2010US20100139962 Wiring board and method of manufacturing the same
06/10/2010US20100139961 Composition for producing a board and printed circuit board using the same
06/10/2010US20100139960 Printed circuit board having plating pattern buried in via and method of manufacturing the same
06/10/2010US20100139959 Method for manufacturing a printed circuit board and a printed circuit board obtained by the manufacturing method
06/10/2010US20100139958 STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS IN LEAD-FREE BGAs ASSEMBLED WITH LEAD-BEARING SOLDERS
06/10/2010US20100139957 Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer
06/10/2010US20100139956 Device applications for voltage switchable dielectric material having high aspect ratio particles
06/10/2010US20100139955 Capacitive touch panel having dual resistive layer
06/10/2010US20100139954 Self-Assembled Electrical Contacts
06/10/2010US20100139953 Display device and manufacturing method thereof
06/10/2010US20100139952 Flux formulations
06/10/2010DE102008060487A1 Electronic device e.g. microphone, has printed circuit board including sections with electrical and/or electronic unit and electronic and/or electrical unit, where one of sections is partially enclosed by milled edge of circuit board
06/10/2010DE102008054385A1 Elektrische Schaltungsanordnung, Steuergerät und Verfahren zum Herstellen einer elektrischen Schaltungsanordnung An electrical circuit arrangement, control unit and method for manufacturing an electrical circuit assembly
06/09/2010EP2194766A1 Ceramic multilayer substrate
06/09/2010EP2194576A1 Laminated mounting structure and method for manufacturing laminated mounting structure
06/09/2010EP2194572A1 Electronic component part device
06/09/2010EP2194098A1 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
06/09/2010EP2193698A1 Multilayer circuit board and use of a multilayer circuit board
06/09/2010EP2193697A2 Method for the production of an electronic assembly, and electronic assembly
06/09/2010EP2193696A1 High thermal performance packaging for optoelectronics devices
06/09/2010EP2193695A2 Electronic component and method for integrating a communication unit
06/09/2010EP2193539A1 Carrier chip with cavity
06/09/2010EP2047715B1 Resistor assembly and method for producing said assembly
06/09/2010EP1750946B1 Flexible printhead circuit
06/09/2010EP1731007B1 Multilayer printed circuit board and method for the production thereof
06/09/2010CN201504386U Electronic component shielding device and circuit board module provided therewith
06/09/2010CN201504364U Circuit composing structure compatible with various power amplifier chips
06/09/2010CN201504363U Circuit board of contact image sensor
06/09/2010CN201504362U Ceramic matrix circuit assembly
06/09/2010CN201504361U Structure for connecting front face and back face of double-faced circuit