Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
06/2010
06/22/2010US7742313 Stacked microfeature devices
06/22/2010US7741566 Microelectronic substrates with thermally conductive pathways and methods of making same
06/22/2010US7741013 photocurable photosensitive layer; image pattern using actinic radiation; adhesion promoter is oxalic acid catalyzed alkyl t-butyl/amyl phenolic resin; recovering thick film from a used sheet
06/22/2010US7740790 Method of making liquid crystal polymer films
06/22/2010US7740725 Thick film conductor paste composition for LTCC tape in microwave applications
06/17/2010WO2010068469A1 Printed antennas, methods of printing an antenna, and devices including the printed antenna
06/17/2010WO2010067977A2 Method for manufacturing a printed circuit board
06/17/2010WO2010067731A1 Wiring board and method for manufacturing same
06/17/2010WO2010067485A1 Shield film and shielded circuit board
06/17/2010WO2010067283A1 Textile carrier for electrically addressing an electronic component in an electronic textile
06/17/2010WO2010067273A1 Flexible modular assembly
06/17/2010WO2010065973A1 Multi-layer circuit board having power supply surfaces
06/17/2010US20100151707 Electrical connector with separate contact mounting and compensation boards
06/17/2010US20100151703 Edge connector and manufacturing method therefor
06/17/2010US20100151217 Electronic part
06/17/2010US20100150757 Circuit board adapted to fan and fan structure
06/17/2010US20100149823 Lamp unit, circuit board, and method of manufaturing circuit board
06/17/2010US20100149776 Pressure conductive sheet
06/17/2010US20100149775 Tape circuit substrate with reduced size of base film
06/17/2010US20100149774 Semiconductor device
06/17/2010US20100149769 Circuit board device and integrated circuit device
06/17/2010US20100149768 Electronic component built-in substrate and method of manufacturing the same
06/17/2010US20100149766 System And Method For Assembly Of A Processor And Socket On An Information Handling System Printed Circuit Board
06/17/2010US20100149764 Hinge mechanism of foldable device, and foldable device provided with hinge mechanism
06/17/2010US20100149759 Thumbscrew for pluggable modules
06/17/2010US20100149758 Package module for a memory IC chip
06/17/2010US20100149410 Electronic component apparatus
06/17/2010US20100148654 Substrate, fabrication method thereof and a display using the same
06/17/2010US20100148375 Vertically Tapered Transmission Line for Optimal Signal Transition in High-Speed Multi-Layer Ball Grid Array Packages
06/17/2010US20100148352 Grid array packages and assemblies including the same
06/17/2010US20100148339 Process for fabricating a semiconductor component support, support and semiconductor device
06/17/2010US20100147581 Flexible substrate and opening/closing electronic device
06/17/2010US20100147577 Method for producing conductive substrate and conductive substrate
06/17/2010US20100147576 Laminated wiring board and method for manufacturing the same
06/17/2010US20100147575 Printed circuit board and manufacturing method thereof
06/17/2010US20100147573 Circuit substrate, circuit module and method for manufacturing the circuit substrate
06/17/2010US20100147572 Electrical Device, System and Method for Operating with Reduced Acoustic Noise Generation
06/17/2010US20100147571 Component having a metalized ceramic base
06/17/2010US20100147570 Circuit substrate and circuit substrate manufacturing method
06/17/2010US20100147569 Component-embedded printed wiring board
06/17/2010US20100147568 Ceramic multilayer substrate
06/17/2010US20100147567 Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit Board
06/17/2010US20100147566 Composite multilayer wiring board
06/17/2010US20100147564 Asymmetric linear polyimides and their polyimide precursors, and their manufacturing methods
06/17/2010US20100147563 Substrate having electromagnetic shielding member
06/17/2010US20100147562 Fabric Circuits and Method of Manufacturing Fabric Circuits
06/17/2010US20100147561 Wiring board with lead pins and method of producing the same
06/17/2010US20100147560 Wiring board and method of manufacturing the same
06/17/2010US20100147559 Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
06/17/2010US20100147558 Anchor pin lead frame
06/17/2010DE112008002140T5 Struktur zum Befestigen einer flexiblen Leiterplatte A structure for fixing a flexible printed circuit board
06/17/2010DE10228373B4 Verfahren zur Herstellung einer elektrischen Verbindung zwischen Bauelementen einer Chipkarte A method for making an electrical connection between components of a smart card
06/17/2010DE102008062575A1 Multilayer printed circuit board for use in e.g. rotor of linear electric motor, has intermediate storages arranged between top layer and bottom layer, and sensor directly soldered on one of intermediate storages
06/17/2010DE102008054506A1 Arrangement for protecting electrical device i.e. control device, from electrical surge for motor vehicle, has surge arrester running in longitudinal direction between front side and contacts and/or partially running on front side
06/16/2010EP2197252A2 Scalable camera contact block, method for producing the camera contact block and method for installing, in particular a SMD camera in the housing of a mobile telephone
06/16/2010EP2197074A1 Antenna device, display device substrate, liquid crystal display unit, display system, method for manufacturing antenna device and method for manufacturing display device substrate
06/16/2010EP2197073A2 High frequency circuit module with stripline divider
06/16/2010EP2197000A1 Device for assembling electronic structural elements
06/16/2010EP2196514A1 Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device
06/16/2010EP2195693A2 Printed circuit board element and method for the production thereof
06/16/2010EP1485251B1 Silicone resin based composites interleaved for improved toughness
06/16/2010CN201509370U Connecting assembly with plug-in unit
06/16/2010CN201509369U Circuit board provided with open window
06/16/2010CN201509368U Internal layer circuit conducting structure of circuit board
06/16/2010CN201509367U Structure of bonding pad for circuit board
06/16/2010CN201509366U Weld pad conducting structure for circuit board
06/16/2010CN201509365U PCB (printed circuit board) with isolated welding-resistant zone
06/16/2010CN201509364U Flexible printed circuit board
06/16/2010CN201509363U Metal base plate assembled with a printed circuit board
06/16/2010CN201509362U Multipurpose switch circuit board of sewing machine
06/16/2010CN201509361U Printed circuit board
06/16/2010CN201509360U White cover layer for flexible printed circuit board
06/16/2010CN201508548U PCI Express signal expansion interconnection device
06/16/2010CN1957322B Interchangeable graphics card for a computing device
06/16/2010CN1921731B Electronic circuit unit having low transmission loss
06/16/2010CN1914455B Deformable illumination module
06/16/2010CN1897788B Reinforced film for flexible printing circuit board
06/16/2010CN1853451B Method for manufacturing an electronic module
06/16/2010CN1835946B Epoxy compound and cured epoxy resin product
06/16/2010CN1826299B Insulating ceramic composition, insulating ceramic sintered body, and multilayer ceramic electronic component
06/16/2010CN1795238B 环氧树脂组合物 The epoxy resin composition
06/16/2010CN1722315B Circuit protection device
06/16/2010CN1715313B Films
06/16/2010CN1689186B Proton-conducting membrane and use thereof
06/16/2010CN1685508B Electronic module having canopy-type carriers
06/16/2010CN1685360B Adapter, memory card, and memory card module
06/16/2010CN1685098B Glass cloth and film substrate using it
06/16/2010CN1660597B Method for depositing ink jet printable composition on basis material
06/16/2010CN101742826A Method for repairing circuits of embedded circuit board
06/16/2010CN101742824A Method for manufacturing circuit board and copper clad substrate suitable for same
06/16/2010CN101742819A Circuit board composite
06/16/2010CN101742818A Packaging method for combining telescopic screw with printed circuit board
06/16/2010CN101742817A Circuit board and electronic product with same
06/16/2010CN101742816A Combined device of rigid circuit board and flexible circuit board, communication equipment and circuit boards
06/16/2010CN101742815A Connector and flexible circuit board using same
06/16/2010CN101742814A Printed circuit board shielding method and printed circuit board
06/16/2010CN101742813A Mount board and semiconductor module
06/16/2010CN101742812A Printed circuit board and method of manufacturing the same
06/16/2010CN101742811A Printed circuit board and method of manufacturing the same
06/16/2010CN101742810A Multilayered wiring board
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