Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
06/2010
06/03/2010US20100132995 Wiring board and method of producing the same
06/03/2010US20100132994 Apparatus and method for reducing pitch in an integrated circuit
06/03/2010US20100132993 Wiring board and electronic component device
06/03/2010US20100132992 Device mounting board and semiconductor module
06/03/2010US20100132991 Electronic device, printed circuit board, and electronic component
06/03/2010US20100132990 Device Built By Joining A Plurality Of Layers
06/03/2010US20100132989 Novel polyimide precursor composition and use thereof
06/03/2010US20100132988 Highly electrically conductive transparent layer with a metal grid having optimized electrochemical resistance
06/03/2010US20100132987 Method for producing an electrically conductive path on a plastic component
06/03/2010US20100132986 Method for preparing a conductive feature on a substrate
06/03/2010US20100132985 Printed circuit board having metal bump and method of manufacring the same
06/03/2010US20100132984 Multilayer printed circuit board
06/03/2010US20100132983 Rigid printed circuit board, pcb assembly, and pcb module having same
06/03/2010US20100132982 Package substrate including solder resist layer having pattern parts and method of fabricating the same
06/03/2010US20100132981 Printed wiring board and electronic apparatus
06/03/2010US20100132980 Wiring board and fabrication method therefor
06/02/2010EP2192824A1 Printed circuit board with an electromagnetic wave shield layer
06/02/2010EP2192614A2 Electronic component mounting module and electrical apparatus
06/02/2010EP2192598A1 Paste composition for forming heat-resistant conductive patterns on substrate
06/02/2010EP2191536A1 Method of manufacturing an approach sensor sealed against the external environment, approach sensor sealed against the external environment and associated handle
06/02/2010EP2191043A1 Voltage switchable dielectric material incorporating modified high aspect ratio particles
06/02/2010EP1795058B1 Flexible cable for high-speed interconnect
06/02/2010EP1670596B1 Method of pattern coating
06/02/2010EP1650253B1 Fiber-reinforced composite material, process for producing the same and use thereof
06/02/2010DE19859119B4 Leiterplatte mit sehr guter Wärmeabstrahlung, Verfahren zu ihrer Herstellung und ihre Verwendung Printed circuit board having excellent heat radiation, process for their preparation and their use
06/02/2010DE102008060008A1 Electrical connecting device for connecting electrical element with printed circuit board, has holder providing free space for soldering pins and providing strain and pressure relief and break and rotation protection between cable and pins
06/02/2010DE102008059452A1 Electronic component i.e. power semiconductor component, cooling arrangement, has conductor plates arranged at mounting body, where to-be-cooled electronic components electrically contact contacting connector or component of plates
06/02/2010DE10136082C5 Verfahren zum Vercrimpen und Anschlussklemmencrimpvorrichtung Method for crimping and Anschlussklemmencrimpvorrichtung
06/02/2010DE10081175B4 Verfahren zur Herstellung einer dreidimensionalen Leiterplatte A process for producing a three-dimensional printed circuit board
06/02/2010CN201499413U radiating module
06/02/2010CN201499377U Winding based on printed circuit boards
06/02/2010CN201499376U Interlayer conducting structure of PCB
06/02/2010CN201499375U Flexible printed circuit board for connection
06/02/2010CN201499374U Double-side copper foil baseplate structure
06/02/2010CN201499373U PCB board capable of preventing V-CUT operation deviation
06/02/2010CN201499372U Pcb
06/02/2010CN201499371U Circuit board structure
06/02/2010CN201499370U Metal-based circuit board for etched metal heat dissipating surface
06/02/2010CN201499369U Flexible printed circuit board
06/02/2010CN201499368U Flexible printing circuit board especial for digital camera
06/02/2010CN201499367U Flexible printed substrate
06/02/2010CN201499080U Power module fastener with high vibration resistance
06/02/2010CN201498676U Electrical connector component
06/02/2010CN201494384U Novel controller of electric motor car
06/02/2010CN201494071U Polyimide composite film for printed circuit board
06/02/2010CN1930219B Prepreg and metal foil-clad laminate and printed circuit board obtained by using the same
06/02/2010CN1898299B Polyamide acid resin having unsaturated group, photosensitive resin composition using same, and cured product thereof
06/02/2010CN1551710B Copper foil for fine pattern printed circuits and method of production of same
06/02/2010CN1543292B Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
06/02/2010CN101720183A Heat radiating method for circuit board
06/02/2010CN101720175A Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board
06/02/2010CN101720170A Flexible print wiring plate and its manufacturing method
06/02/2010CN101720168A Method for routing vacant sites for prepregs of circuit board and multi-layer circuit board
06/02/2010CN101720166A Flexible printed circuit board
06/02/2010CN101720165A Component built-in wiring substrate and manufacturing method thereof
06/02/2010CN101716854A Circuit board and liquid supplying unit
06/02/2010CN101488486B Circuit substrate capable of opening slots
06/02/2010CN101460008B Circuit board having improved support fabric structure
06/02/2010CN101400210B Printed circuit board equipped with LED
06/02/2010CN101389181B Semiconductor substrate for transmission differential pair
06/02/2010CN101375647B Layered structure with printed elements
06/02/2010CN101351081B Illumination application circuit board with pins type LED
06/02/2010CN101346047B Multi-layer circuit board production method and inner layer substrates for producing the same
06/02/2010CN101346037B Multi-layer substrate and manufacturing method thereof
06/02/2010CN101346035B Flexible circuit board
06/02/2010CN101336040B General solder pad construction
06/02/2010CN101312638B Heat radiating module and electronic combination applying the same
06/02/2010CN101296582B Method for replacing and mending bad circuit area on multi-layer printed circuit board
06/02/2010CN101296563B Circuit board, electronic component and circuit board assembly
06/02/2010CN101257771B Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same
06/02/2010CN101256962B Electronic part and method for manufacturing the same
06/02/2010CN101252808B Soldering circuit plate and soldering method thereof
06/02/2010CN101232783B Printed circuit board productttion mthod
06/02/2010CN101226914B Chip carrier substrate capacitor and method for fabrication thereof
06/02/2010CN101193498B Printed circuit board, printed circuit board assembly manufacturing method, warpage correcting method
06/02/2010CN101175365B Printed circuit boards and method for resisting signal distortion
06/02/2010CN101146408B Wiring forming system and wiring forming method for forming wiring on wiring board
06/02/2010CN101105628B Light solidifying/heat solidifying one-part welding resistant agent composition
06/02/2010CN101098583B Flexiable printing wiring board
06/02/2010CN101094560B PC board and its manufacturing method
06/01/2010US7729129 Mounting device for high frequency microwave devices
06/01/2010US7728710 Electronic parts board and method of producing the same
06/01/2010US7728234 Coreless thin substrate with embedded circuits in dielectric layers and method for manufacturing the same
06/01/2010US7728233 Connection structure of flexible substrate
06/01/2010US7728232 Printed circuit board assembly having adhesive layer
06/01/2010US7728102 Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board
06/01/2010US7727630 nickel powder batches include particles having a small particle size, narrow size distribution and a spherical morphology, encapulated by a metal oxide selected from ZrO2, SiO2, b2O3, TiO2, Cu2O, CuO, Bi2o3, V2O5 and Al2O3
06/01/2010US7726553 Stamping device for generally flat articles
06/01/2010US7726018 Method of compensating for crosstalk
06/01/2010US7726013 Method of manufacturing circuit board including transfer chip having a plurality of first pad electrodes connected to wiring
05/2010
05/27/2010WO2010058778A1 Method for producing substrate having patterned conductive polymer film and substrate having patterned conductive polymer film
05/27/2010WO2010058763A1 Multi-piece substrate and method for manufacturing same
05/27/2010WO2010058734A1 Aromatic polyamide resin containing phenolic hydroxy group, and use thereof
05/27/2010WO2010058715A1 Resin composition for filling discharge gap, and electrostatic discharge protector
05/27/2010WO2010058643A1 Anisotropic conductive film
05/27/2010WO2010058622A1 Flexible substrate and display device provided with same
05/27/2010WO2010058443A1 Wiring board and method for producing wiring board
05/27/2010WO2010058360A1 Textile electronic arrangement
05/27/2010US20100129687 Circuit board for secondary battery and secondary battery with the circuit board
05/27/2010US20100128452 Stud, circuit board device using the stud, and method of mounting the circuit board device
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