Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2010
10/06/2010CN201601889U 电路板组合 Circuit board assembly
10/06/2010CN201601888U Pcb支撑板 Pcb support plate
10/06/2010CN201601887U 一种多层盲孔pcb板件 A multilayer blind hole pcb board member
10/06/2010CN201601224U 一种ipex天线连接器双频pcb结构 One kind ipex dual antenna connector pcb structure
10/06/2010CN1960597B Hybrid multilayer circuit board and manufacture method thereof
10/06/2010CN1853113B A method of manufacturing an electronic device
10/06/2010CN1788111B Low surface roughness electrolytic copper foil and process for producing the same
10/06/2010CN1779568B Hardenable resin composition, hardened body thereof, and printed wiring board
10/06/2010CN1725933B Wired circuit forming board, wired circuit board, and thin metal layer forming method
10/06/2010CN1717322B Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby
10/06/2010CN1700360B Spherical silver powder and method for producing same
10/06/2010CN1671273B Device with through-hole interconnection and method for manufacturing the same
10/06/2010CN101855953A Electronic circuit board, and method and structure for shielding electronic circuit board
10/06/2010CN101854786A Waterproof and moistureproof sealing method of circuit board
10/06/2010CN101854776A Wiring structure and optical disk apparatus
10/06/2010CN101854775A Printed circuit board
10/06/2010CN101854774A Printed circuit board assembly, enclosure of information technology equipment, and information technology equipment
10/06/2010CN101854773A Gold finger protecting device
10/06/2010CN101854772A Circuit board structure capable of self-illumination
10/06/2010CN101854771A Printed wiring board
10/06/2010CN101854411A Mobile communication terminal
10/06/2010CN101852412A Power supply transmission line, light source module and panel display module
10/06/2010CN101851769A Electrolytic copper foil, surface-treated electrolytic copper foil obtained by using the electrolytic copper foil, copper-clad laminate using the surface-treated electrolytic copper foil, and printed circuit board
10/06/2010CN101851411A Curable resin composition
10/06/2010CN101851389A Thermosetting resin composition with high heat resistance and copper-clad laminate made of same
10/06/2010CN101448362B Ultra-thin shielding film and circuit board capable of changing circuit impedance, and method for preparing same
10/06/2010CN101414205B Double-layer computer host
10/06/2010CN101360386B Circuit board binding glue layer and circuit board comprising the glue layer
10/06/2010CN101267711B Printing circuit substrate and exhausting method thereof
10/06/2010CN101247699B Circuit boards and adjustable resistors embeddesd in circuit board and its manufacture method
10/06/2010CN101043111B Electrical connectors
10/06/2010CN101009263B Printed circuit board for semiconductor package and method of manufacturing the same
10/05/2010US7809942 Conditional access method and apparatus of a receiver system for controlling digital TV program start time
10/05/2010US7808799 Wiring board
10/05/2010US7808798 Versatile Si-based packaging with integrated passive components for mmWave applications
10/05/2010US7808797 Microelectronic substrate including embedded components and spacer layer and method of forming same
10/05/2010US7808597 Display module
10/05/2010US7807932 Printed circuit board and method for manufacturing the same
10/05/2010US7807931 Electrical component on a substrate and method for production thereof
10/05/2010US7807334 Substrate having fine line, electron source and image display apparatus
10/05/2010US7807073 Wiring parts are formed by utilizing such a conductor formulation, ensure the conductivity at the same level as an Ag bulk by a low temperature treatment
10/05/2010US7805834 Method for fabricating three-dimensional all organic interconnect structures
09/2010
09/30/2010WO2010111379A2 High data rate connector system
09/30/2010WO2010110909A1 Components having voltage switchable dielectric materials
09/30/2010WO2010110433A1 Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
09/30/2010WO2010110259A1 Two-layered flexible substrate, and copper electrolyte for producing same
09/30/2010WO2010110094A1 Adhesive material reel
09/30/2010WO2010110092A1 Copper foil for printed wiring board and method for producing same
09/30/2010WO2010110062A1 Flexible substrate and process for production thereof
09/30/2010WO2010110061A1 Metal foil with electric resistance film and production method therefor
09/30/2010WO2010109960A1 Aluminum nitride substrate, aluminum nitride circuit board, semiconductor device, and method for manufacturing aluminum nitride substrate
09/30/2010WO2010109948A1 Epoxy resin composition, prepreg, metal foil with resin, resin sheet, laminate and multi-layer board
09/30/2010WO2010109844A1 Attachable power generating module
09/30/2010WO2010109842A1 Film with attached metal layer for electronic components, production method thereof, and applications thereof
09/30/2010WO2010109721A1 Glass composition for glass fiber, glass fiber, and sheet-shaped material of glass fiber
09/30/2010WO2010109465A1 Process for sintering nanoparticles at low temperatures
09/30/2010WO2010108774A1 Assembly of optoelectronic components
09/30/2010WO2010108751A1 Light module, zero force connection element and power supply for a luminous strip
09/30/2010WO2010108362A1 Heat dissipating structure with heat conducting and heat dissipating ink layer
09/30/2010WO2010108361A1 Pcb including heat radiating structure with heat conducting and heat radiating ink
09/30/2010US20100247381 Processes and applications of carbon nanotube dispersions
09/30/2010US20100246153 Flip-chip fet cell
09/30/2010US20100246151 Electronic component module
09/30/2010US20100246150 Interconnect Structure And A Method Of Fabricating The Same
09/30/2010US20100246145 Electronic device and dummy connector thereof
09/30/2010US20100246140 Circuit Board and Method for Manufacturing Semiconductor Modules and Circuit Boards
09/30/2010US20100244996 Signal transmission device with single output configuration and related motherboard
09/30/2010US20100244681 El device, light-sensitive material for forming conductive film, and conductive film
09/30/2010US20100244281 Flexible printed wiring board and semiconductor device employing the same
09/30/2010US20100244275 Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structure
09/30/2010US20100244274 Wiring board
09/30/2010US20100244266 Metallic bonding structure for copper and solder
09/30/2010US20100244259 Substrate and manufacturing method therefor
09/30/2010US20100244258 Substrate and manufacturing method therefor
09/30/2010US20100244166 Multilayer wiring substrate, stack structure sensor package, and method of manufacturing stack structure sensor package
09/30/2010US20100243310 Printed circuit board
09/30/2010US20100243309 Connecting structure for circuit board and connecting method using the same
09/30/2010US20100243308 Semiconductor memory module and electronic component socket for coupling with the same
09/30/2010US20100243307 Leaded multi-layer ceramic capacitor with low esl and low esr
09/30/2010US20100243306 High rate selective polymer growth on a substrate
09/30/2010US20100243305 Substrate with metal film and method for manufacturing the same
09/30/2010US20100243304 Solder resist, dry film thereof, cured product, and printed wiring board
09/30/2010US20100243303 Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member
09/30/2010US20100243302 Components having voltage switchable dielectric materials
09/30/2010US20100243301 Organic polymer coating for protection against creep corrosion
09/30/2010US20100243300 Soldering Method and Related Device for Improved Resistance to Brittle Fracture
09/30/2010US20100243299 Multilayer printed wiring board
09/30/2010US20100243298 Carbon nanotube based interposer
09/30/2010US20100243297 Printed circuit board and method of manufacturing the same
09/30/2010US20100243296 Dielectric ceramic composition and electronic component using the same
09/30/2010US20100243295 Nanowire-based transparent conductors and applications thereof
09/30/2010US20100243028 Element interconnection member, photoelectric conversion element and a series of photoelectric conversion elements including the same, and photoelectric conversion module
09/30/2010US20100242270 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
09/29/2010EP2234466A1 Mounted board and method for manufacturing the same
09/29/2010EP2234464A2 Portable electric machine with a PCB module
09/29/2010EP2234151A1 Semiconductor device
09/29/2010EP2233613A1 Copper electrolysis solution containing compound having specific skeleton as additive, and electrolytic copper foil produced therefrom
09/29/2010EP2232965A2 Circuit board having an electrodeposited coating on a conductive core within a via and method of making same
09/29/2010EP2232963A1 Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained
09/29/2010EP2232641A1 Antenna feed module
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