Patents for H05K 1 - Printed circuits (98,583)
09/2010
09/15/2010CN201585199U Compound circuit board
09/15/2010CN201585198U Single-sided epoxy glass cloth copper foil-clad paperboard
09/15/2010CN201585197U Circuit device for improving telecommunication and preventing interference
09/15/2010CN201585196U Flexible PCB and connection structure employing same
09/15/2010CN201585195U Printing circuit board for sheet
09/15/2010CN201585096U Printed board for shielding embedded in digital microphone
09/15/2010CN201582648U Backlight module and display device using same
09/15/2010CN1968566B Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board
09/15/2010CN1938456B Copper foil and its manufacturing method
09/15/2010CN1826047B High frequency unit
09/15/2010CN1717149B Circuitized substrate
09/15/2010CN1691223B Inductor and transformer
09/15/2010CN101836518A Ceramic multilayer substrate
09/15/2010CN101836513A Printed board unit and socket
09/15/2010CN101836512A Flexible printed circuit board, inlet sheet using the same, RFID media, and method for producing the rfid media
09/15/2010CN101836511A Asymmetric dielectric films
09/15/2010CN101836341A Surge protection circuit for passing DC and RF signals
09/15/2010CN101836264A Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle
09/15/2010CN101835866A Circuit member connecting adhesive and semiconductor device
09/15/2010CN101835859A Circuit connecting material, connection structure and method for producing the same
09/15/2010CN101835347A Printed circuit board assembly and manufacturing method thereof
09/15/2010CN101835343A Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the printed IC board
09/15/2010CN101835342A Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity
09/15/2010CN101835341A Flexible printed circuit board, electric connector provided with flexible printed circuit board and electric connector component
09/15/2010CN101834168A Combined type circuit substrate structure
09/15/2010CN101834050A Coil electric conductor device and manufacture method thereof
09/15/2010CN101831193A Fiber-reinforced composite material, manufacturing method and application therefor
09/15/2010CN101831142A Resin composition, method of its composition, and cured formulation
09/15/2010CN101831139A Epoxy resin compound and film and substrate made from same
09/15/2010CN101483975B Manufacturing method for planar resistor printed board with thick metal plated on circuit surface
09/15/2010CN101287334B Manufacturing method of highly heat conductive circuit base board
09/15/2010CN101271883B Production method of circuit substrates and inductor wire
09/15/2010CN101253824B Electronic circuit connection structure and its manufacturing method
09/15/2010CN101212866B Module
09/15/2010CN101101815B Capacitor and electronic module possessing same
09/15/2010CN101052268B Thermal management of electronic devices
09/14/2010USRE41669 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
09/14/2010USRE41663 Compliant electrical contact assembly
09/14/2010US7796845 Circuit board and method for manufacturing the same
09/14/2010US7796400 Modular integrated circuit chip carrier
09/14/2010US7796399 Thin multi-chip flex module
09/14/2010US7795995 Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications
09/14/2010US7795728 Electronic component
09/14/2010US7795717 Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component
09/14/2010US7795714 Two step molding process secured digital card manufacturing method and apparatus
09/14/2010US7795542 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/14/2010US7794578 Uniform thickness; reacting a nickel compound and sulfamic acid in presence of phosphoric acid
09/14/2010US7793413 Method of mounting electronic components
09/14/2010US7793412 Component-embedded board fabrication method
09/10/2010WO2010101418A2 Composition for conductive paste containing nanometer-thick metal microplates
09/10/2010WO2010100931A1 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
09/10/2010WO2010100893A1 Electrically conductive paste composition and electrically conductive film formed by using the same
09/10/2010WO2010100870A1 Flexible module provided with power generating device, and flexible sensor device provided with power generating device using the flexible module
09/10/2010WO2010100726A1 Printed circuit board module
09/09/2010US20100226110 Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the same
09/09/2010US20100226108 Printed circuit board and method of manufacturing printed circuit board
09/09/2010US20100226103 Electronic apparatus and flexible printed wiring board
09/09/2010US20100226102 Printed circuit board unit
09/09/2010US20100226099 Electronic apparatus
09/09/2010US20100225875 Flexible display Device
09/09/2010US20100225364 Stacked semiconductor devices and signal distribution methods thereof
09/09/2010US20100224398 Mounting structure
09/09/2010US20100224397 Wiring board and method for manufacturing the same
09/09/2010US20100224396 Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component
09/09/2010US20100224395 Multilayer wiring board and its manufacturing method
09/09/2010US20100224394 Module Substrate and Production Method
09/09/2010US20100224393 Display device
09/09/2010US20100224392 Line pattern formation method
09/09/2010US20100224391 Suspension board with circuit and production method thereof
09/09/2010US20100224390 Multilayer structure, electrode for electrical curcuit using the same, and method for producing the same
09/09/2010US20100223786 Method of Compensating for Crosstalk
09/09/2010DE102009036578B3 Thermal fuse for power module of motor vehicle, has contact bridge arranged in area of separating point and fixed in position without contacting strip section, where movement of bridge is made parallel to board
09/09/2010DE102009012255A1 Schaltungsanordnung Circuitry
09/09/2010DE102009011553A1 Isolierpasten Isolierpasten
09/09/2010DE102009011538A1 Producing conductive structures on surface of polymer molded bodies, comprises providing polymer molded body from a polymer phase containing carbon nanotubes and thermally treating a surface of the polymer molded body
09/09/2010DE102005056892B4 Elektronikmodul für eine Systemplatine mit Durchgangslöchern und Verfahren zur Herstellung und Kühlung eines derartigen Elektronikmoduls Electronic module for a system board with through holes and methods for producing and cooling of such electronic module
09/09/2010DE102004052495B4 Leiterplatte zum Aufbau beliebiger Schaltungen mit SMD Bauelementen PCB for mounting any circuits with SMD components
09/08/2010EP2227074A1 Light emitting module and light unit having the same
09/08/2010EP2227073A2 Electronic component with fitted electronic component
09/08/2010EP2227072A2 Printed circuit board with an adaptable connector module
09/08/2010EP2227071A2 Ignition device for a high pressure gas discharge lamp
09/08/2010EP2226747A2 Circuit assembly and method and device for creating a wiring pattern on a substrate
09/08/2010EP2226550A1 LED light with cooling channel
09/08/2010EP2226349A1 Thermosetting resin composition and prepreg and laminate both made with the same
09/08/2010EP2226346A1 Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board
09/08/2010EP2225921A1 Retaining device and safety cap arrangement having brittle cover element
09/08/2010EP2225785A2 Chip assembly, connecting assembly, led and method for producing a chip assembly
09/08/2010EP1405278B1 Identification device comprising a transponder and a discontinuously metallised retroreflective or holographic image field and method of making such a device
09/08/2010CN201577264U Electromagnetic interference-resisting corner structure for shielding device
09/08/2010CN201577236U Multilayer PCB board
09/08/2010CN201577235U Printed circuit board
09/08/2010CN201577234U Multi-layered flexible circuit board in mobile phone
09/08/2010CN201576872U Electric connector assembly
09/08/2010CN201576781U Connector, circuit board with same and circuit board connecting structure
09/08/2010CN201576015U PCB for electric energy meter
09/08/2010CN1976560B Core substrate and multiplayer printed circuit board using paste bump and method of manufacturing thereof
09/08/2010CN1946267B Embedding method for printed circuit board and printed circuit board
09/08/2010CN1636796B Connecting structure between busbar base and printed circuit board
09/08/2010CN101828434A Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body
09/08/2010CN101828310A Connecting terminal, semiconductor package, wiring board, connector and micro contactor