Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2010
11/10/2010CN1863436B Method of manufacturing a wiring board and the wiring board
11/10/2010CN1802882B Arrangement for authentication of a person
11/10/2010CN1764344B Wired circuit board
11/10/2010CN1731915B 多层电路板装置 Multi-layer circuit board apparatus
11/10/2010CN1423678B Flame retardant phosphorus element-containing epoxy resin compositions
11/10/2010CN101883473A Double-faced electricity conductive composite board and manufacture method thereof
11/10/2010CN101883472A PCB encapsulation of surface patch capacitor, method thereof, PCB and equipment
11/10/2010CN101883470A Prepreg for printed board and laminated plate adhered with metal foil
11/10/2010CN101882717A Midplane especially applicable to an orthogonal architecture electronic system
11/10/2010CN101882191A Information security protecting device
11/10/2010CN101880361A Composition for forming substrate, and prepreg and substrate using the same
11/10/2010CN101478858B Circuit board construction, manufacturing method and liquid crystal display
11/10/2010CN101378624B Module structure integrating perimeter circuit and manufacturing method thereof
11/10/2010CN101339304B Liquid crystal display and manufacturing method thereof
11/10/2010CN101321430B Circuit board assembly and manufacturing method thereof
11/10/2010CN101310570B Mounted substrate and electronic equipment
11/10/2010CN101296564B Light source module group with excellent heat dispersion performance
11/10/2010CN101165886B Semiconductor packaging member for semiconductor device stacking and its manufacture method
11/10/2010CN101159036B RFID label technique
11/10/2010CN101102642B 多层印刷电路板 Multilayer printed circuit board
11/10/2010CN101101899B Laminose board, manufacturing method thereof, electronic element and device with the laminose board
11/10/2010CN101069456B Mounting structure for electronic component
11/09/2010USRE41914 Thermal management in electronic displays
11/09/2010US7830669 Contact bank
11/09/2010US7830667 Flexible wiring substrate and method for producing the same
11/09/2010US7830489 Flexible circuit board, display unit having the same and display device having the same
11/09/2010US7829976 Microelectronic devices and methods for forming interconnects in microelectronic devices
11/09/2010US7829799 Method for manufacturing a miniaturized three-dimensional electric component
11/09/2010US7829795 Electrophoretic display sheet, electrophoretic display device, and electronic apparatus
11/09/2010US7829794 chemically-etchable poly(amide)imide adhesive layer on patterned conductive layer
11/09/2010US7829793 Additive disk drive suspension manufacturing using tie layers for vias and product thereof
11/09/2010US7829480 printed circuit board (PCB) supporting woven fabric and a PCB having the same; PCB includes a supporting woven fabric, a filling resin body enveloping the supporting woven fabric and at least one signal trace arranged on the surface of the filling resin body
11/09/2010CA2432263C Substrate enhancement for improved signal characteristics on a discontinous transmission line
11/04/2010WO2010127245A2 Passive electrical article
11/04/2010WO2010127073A1 Rf signal combiner/splitter and related methods
11/04/2010WO2010126989A1 Thin-film capacitor structures embedded in semiconductor packages and methods of making
11/04/2010WO2010126966A1 Thin-film capacitor structures embedded in semiconductor packages and methods of making
11/04/2010WO2010126957A1 Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers
11/04/2010WO2010126410A1 Assembly for carrying electronic components
11/04/2010WO2010126159A1 Connecting unit
11/04/2010WO2010126047A1 Multilayered polyimide film
11/04/2010WO2010125965A1 Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
11/04/2010WO2010125880A1 Adhesive resin composition, laminate using same, and flexible printed wiring board
11/04/2010WO2010125879A1 Adhesive resin composition, laminate using same, and flexible printed wiring board
11/04/2010WO2010125858A1 Multilayered resin circuit board, and manufacturing method of multilayered resin circuit board
11/04/2010WO2010125814A1 Device mounting structure and device mounting method
11/04/2010WO2010125784A1 Structural body, printed board, antenna, transmission line waveguide converter, array antenna, and electronic device
11/04/2010WO2010125426A1 Bus bar arrangement
11/04/2010WO2010125294A1 Led lighting device including improved means for promoting heat dissipation
11/04/2010WO2010124825A1 Method for producing a circuit board having leds and printed reflector surfaces, and circuit board produced according to the method
11/04/2010WO2009117007A3 Methods for forming composite nanoparticle-metal metallization contacts on a substrate
11/04/2010US20100277921 Electronic Apparatus
11/04/2010US20100277885 Circuit connecting material and structure for connecting circuit member
11/04/2010US20100277884 Circuit-connecting material and circuit terminal connection structure
11/04/2010US20100277883 Downward-facing optical component module
11/04/2010US20100277882 Motherboard and motherboard layout method
11/04/2010US20100277881 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
11/04/2010US20100277835 Printed circuit board and magnetic head driving device including the same
11/04/2010US20100277531 Printer having processor for high volume printing
11/04/2010US20100276796 Reworkable electronic device assembly and method
11/04/2010US20100276794 System and method for multi-chip module die extraction and replacement
11/04/2010US20100276497 Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires and a device thereby obtained
11/04/2010US20100276192 Method for removing a stub of a via hole and a printed circuit board designed based on the method
11/04/2010US20100276191 Method of producing wire-connection structure, and wire-connection structure
11/04/2010US20100276190 Electronic component and method of mounting the same
11/04/2010US20100276189 Semiconductor package including power ball matrix and power ring having improved power integrity
11/04/2010US20100276188 Method and apparatus for improving power gain and loss for interconect configurations
11/04/2010US20100276187 Multilayer printed wiring board and mounting body using the same
11/04/2010US20100276186 Photosensitive insulating resin composition, hardening product thereof, and circuit board equipped therewith
11/04/2010US20100276185 Barrier layer for fine-pitch mask-based substrate bumping
11/04/2010US20100276184 Multilayer printed board and method for manufacturing the same
11/04/2010US20100276183 Flexible printed circuit board
11/04/2010US20100276182 Method for hot embossing at least one conductor track onto a substrate and substrate having at least one conductor track
11/04/2010US20100275971 Scalable Dense PV Solar Receiver for High Concentration
11/04/2010DE10306618B4 Planare Kontaktstruktur mit Kontaktzungen für eine variable Steckposition Planar contact structure with reeds for a variable slot position
11/04/2010DE102009018447A1 Leiterplatte Circuit board
11/04/2010DE102009017985A1 Leiterplattengrundmaterial, Leiterplatte sowie Gehäuse Circuit board base material, PCB and housing
11/03/2010EP2247171A1 Metal-clad substrate, and method for production thereof
11/03/2010EP2246866A1 Electric component and circuit arrangement
11/03/2010EP2246837A1 Display device
11/03/2010EP2246184A1 Composite material for electrical/electronic component, electrical/electronic component, and method for producing composite material for electrical/electronic component
11/03/2010EP2245913A1 Method for arranging cooling for a component and a cooling element
11/03/2010EP1796213B1 Multilayer antenna device with increased gain
11/03/2010EP1432053B1 Battery pack and thermostat used for it
11/03/2010EP1399269B1 Waveform generator for microdeposition control system
11/03/2010EP1399267B1 Microdeposition apparatus
11/03/2010CN201623944U Heat radiation structure of SMD element
11/03/2010CN201623920U Positioning nail for vertically pulling and plugging circuit board
11/03/2010CN201623919U Blind hole structure of printed circuit board
11/03/2010CN201623918U Circuit heat dissipation structure
11/03/2010CN201623917U Circuit jointed board
11/03/2010CN201623275U Connector
11/03/2010CN201621636U Gold and silver plate bracket for LED lamp
11/03/2010CN201621530U SMD single-color soft neon lamp
11/03/2010CN1870883B Method of mounting radio tag chips and method of writing management information onto radio tag chips
11/03/2010CN1809974B Capacitor-related systems for addressing package/motherboard resonance
11/03/2010CN1809787B Aqueous developable photoimageable thick film compositions
11/03/2010CN1729730B PCB method and apparatus for producing landless interconnects
11/03/2010CN1720766B Method for manufacturing flexible wiring circuit board
11/03/2010CN1551708B Multi-layer wiring board
1 ... 242 243 244 245 246 247 248 249 250 251 252 253 254 255 256 257 258 259 260 261 262 ... 986