| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 11/17/2010 | EP2179632B1 Substrate comprising a highly conductive layer |
| 11/17/2010 | EP1639870B1 Microelectronic substrates with thermally conductive pathways and methods of making same |
| 11/17/2010 | EP1308072B1 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors |
| 11/17/2010 | CN201639857U Circuit board |
| 11/17/2010 | CN201639856U Double-sided circuit board with element |
| 11/17/2010 | CN201639855U Radiating printed circuit board structure |
| 11/17/2010 | CN201639854U Multilayer printed circuit board structure for testing impedance value of high-speed signal line |
| 11/17/2010 | CN201639853U Printed circuit board for attaching insulating film after SMT placing components |
| 11/17/2010 | CN201639852U Bowl hole type double-side printed-wiring board |
| 11/17/2010 | CN201636683U Novel advertising lamp structure |
| 11/17/2010 | CN1974207B Photogravure roller |
| 11/17/2010 | CN101888748A Manufacturing method of circuit board |
| 11/17/2010 | CN101888747A Printed-circuit board, and method for manufacturing the same |
| 11/17/2010 | CN101888743A Fixing device combination |
| 11/17/2010 | CN101888742A Printed wiring board and process for producing the same |
| 11/17/2010 | CN101888741A Printed circuit board and notebook computer |
| 11/17/2010 | CN101888740A Convex metal printed circuit board and manufacturing method thereof |
| 11/17/2010 | CN101888739A Method of improving isolation between circuits on a printed circuit board |
| 11/17/2010 | CN101888738A Embedded substrate provided with side-inclined plane line layer assembly and manufacturing method thereof |
| 11/17/2010 | CN101887891A Electronic apparatus, high-voltage power source and printed circuit board |
| 11/17/2010 | CN101887880A Multilayer printed wiring board |
| 11/17/2010 | CN101517831B Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles |
| 11/17/2010 | CN101426959B Electrolytic copper foil, surface treated copper foil using the electrolytic copper foil, copper-clad laminated plate using the surface treated copper foil, and method for manufacturing the electrolyt |
| 11/17/2010 | CN101356862B Electronic circuit arrangement and method for producing an electronic circuit arrangement |
| 11/17/2010 | CN101355845B Substrate with conductive projection and technique thereof |
| 11/17/2010 | CN101351091B Line connection technique and structure thereof |
| 11/17/2010 | CN101194045B Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer |
| 11/17/2010 | CN101115354B Moulding circuit board and manufacturing method therefor |
| 11/16/2010 | US7835160 Electronic circuit connection structure and its manufacturing method |
| 11/16/2010 | US7835159 Method of making assembly module and board module and electronic apparatus |
| 11/16/2010 | US7835158 Connection verification technique |
| 11/16/2010 | US7835157 System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules |
| 11/16/2010 | US7834277 Printed circuit board manufacturing method and printed circuit board |
| 11/16/2010 | US7834275 Secure electronic entity such as a passport |
| 11/16/2010 | US7834274 Multi-layer printed circuit board and method for fabricating the same |
| 11/16/2010 | US7833910 Film substrate, fabrication method thereof, and image display substrate |
| 11/16/2010 | US7833832 Method of fabricating semiconductor components with through interconnects |
| 11/16/2010 | US7833567 Method for forming electrical circuit by jetting molten metal |
| 11/16/2010 | US7833021 Burn-in socket with adapter for loading IC package |
| 11/16/2010 | US7832098 Method of manufacturing a multilayered printed circuit board |
| 11/16/2010 | US7832092 Method of manufacturing a printed wiring board lead frame package |
| 11/11/2010 | WO2010129002A1 Method and apparatus for improving power and loss for interconect configurations |
| 11/11/2010 | WO2010128978A1 Pcb quick heater |
| 11/11/2010 | WO2010127949A1 Miniature microwave component for surface-mounting |
| 11/11/2010 | WO2010127724A1 High impedance trace |
| 11/11/2010 | WO2010127496A1 Back drilling method of through via, circuit board and manufacturing method of circuit board |
| 11/11/2010 | US20100285676 Connection terminal and transmission line |
| 11/11/2010 | US20100284161 Stacked mounting structure |
| 11/11/2010 | US20100284158 Packaging techniques and configurations |
| 11/11/2010 | US20100284152 Card guide and heatsink assemblies for pluggable electro-optic modules |
| 11/11/2010 | US20100284140 Electronic device assemblies including conductive vias having two or more conductive elements |
| 11/11/2010 | US20100284134 Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise |
| 11/11/2010 | US20100283475 Separate test electronics and blower modules in an apparatus for testing an integrated circuit |
| 11/11/2010 | US20100282730 PCB Quick Heater |
| 11/11/2010 | US20100282505 Method for producing conductive film and light-sensitive material for conductive film production |
| 11/11/2010 | US20100282504 High impedance trace |
| 11/11/2010 | US20100282503 Multi-layer substrate |
| 11/11/2010 | US20100282502 Multilayer printed wiring board |
| 11/11/2010 | US20100282501 Printed wiring board, method for forming the printed wiring board, and board interconnection structure |
| 11/11/2010 | US20100282500 Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same |
| 11/11/2010 | US20100282499 Printed wiring board, method for forming the printed wiring board, and board interconnection structure |
| 11/11/2010 | US20100282498 Method for integration of circuit components into the build-up layers of a printed wiring board |
| 11/11/2010 | US20100282497 Circuit board |
| 11/11/2010 | DE19980206B4 Grundplatte für eine Leiterplatte unter Verwendung einer wärmebeständigen Isolationsschicht, deren Herstellverfahren und Verfahren zur Herstellung der Leiterplatte Base plate for a printed circuit board using a heat-resistant insulating layer, the production method and methods for producing the printed circuit board |
| 11/11/2010 | DE102009018184A1 Flachbaugruppe und Verfahren zu deren Herstellung Printed circuit board assembly and process for their preparation |
| 11/11/2010 | DE102008017569B4 Verfahren zur Herstellung eines organischen Substrats mit eingebetteten Aktivchips A process for producing an organic substrate with embedded active chips |
| 11/10/2010 | EP2249631A1 Multilayer circuit board, and motor-driving circuit board |
| 11/10/2010 | EP2249630A1 Circuit board |
| 11/10/2010 | EP2248921A1 Copper alloy material for electric/electronic component and method for manufacturing the copper alloy material |
| 11/10/2010 | EP2248843A1 Polyimide precursor composition, polyimide film and transparent flexible film |
| 11/10/2010 | EP2248400A2 Method of connection of flexible printed circuit board and electronic device obtained thereby |
| 11/10/2010 | EP2248399A1 Printed electronics |
| 11/10/2010 | EP2248398A2 System and method for integrated waveguide packaging |
| 11/10/2010 | EP2248190A2 Miniature housing and support arrangement having at least one miniature housing |
| 11/10/2010 | EP2247338A1 Printed circuit board communication coil for use in an implantable medical device system |
| 11/10/2010 | CN201629913U 柔性电路结构装置 Flexible circuit structure of the device |
| 11/10/2010 | CN201629912U Circuit structure of high-power uninterrupted power system |
| 11/10/2010 | CN201629911U LED circuit board capable of electrically connecting on multi-direction |
| 11/10/2010 | CN201629910U 阻抗模块结构 Impedance module structure |
| 11/10/2010 | CN201629909U Circuit board for ink-jet printer |
| 11/10/2010 | CN201629908U Card slot circuit board structure |
| 11/10/2010 | CN201629907U Substrate of flexible circuit board |
| 11/10/2010 | CN201629906U Flexible printed circuit board |
| 11/10/2010 | CN201629905U 电路板 Board |
| 11/10/2010 | CN201629904U Ultra-long circuit board |
| 11/10/2010 | CN201629903U Static discharging protection device and circuit board device |
| 11/10/2010 | CN201629902U Novel PCB board |
| 11/10/2010 | CN201629901U Stamp hole structure of circuit board |
| 11/10/2010 | CN201629900U Circuit board with different solder mask colors |
| 11/10/2010 | CN201629899U Novel circuit board |
| 11/10/2010 | CN201629420U Circuit board connector, connecting wire and circuit board |
| 11/10/2010 | CN201629411U Coaxial-cable welding device and printed circuit board |
| 11/10/2010 | CN201628112U White light planar light source LED module |
| 11/10/2010 | CN1993501B Composite copper foil and method for production thereof |
| 11/10/2010 | CN1960595B Flexible circuit board with structure for shielding electromagnetic wave |
| 11/10/2010 | CN1937887B Structure and method for reducing warp of substrate |
| 11/10/2010 | CN1921047B Key sheet module |
| 11/10/2010 | CN1909764B Multi-layer printed circuit board |
| 11/10/2010 | CN1909763B Multi-layer printed circuit board |
| 11/10/2010 | CN1886033B Circuit pattern forming method, circuit pattern forming device and printed circuit board |