Patents for H05K 1 - Printed circuits (98,583) |
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11/24/2010 | CN201657500U Inner-layer buried-hole structure of multi-layer high-density interconnected printed circuit board |
11/24/2010 | CN201657499U Pad through hole structure of printed circuit board |
11/24/2010 | CN201657498U Welding pad and circuit board therewith |
11/24/2010 | CN201657497U Metal-based circuit board and electronic equipment |
11/24/2010 | CN201657496U Aluminum substrate for manufacturing printed circuit boards |
11/24/2010 | CN201657495U Metal base board |
11/24/2010 | CN201657494U Copper-clad plate for manufacturing printed circuit boards |
11/24/2010 | CN201657493U Circuit board |
11/24/2010 | CN201657492U Printed circuit board |
11/24/2010 | CN201657491U Circuit board |
11/24/2010 | CN201657490U FPC for mobile phone camera |
11/24/2010 | CN201657489U FPC for mobile phone camera |
11/24/2010 | CN201657488U Inner layer board edge structure of multi-layer printed circuit board |
11/24/2010 | CN201657487U Circuit board radiating structure |
11/24/2010 | CN201657486U Heat-conducting substrate |
11/24/2010 | CN201657485U Al-based circuit board |
11/24/2010 | CN201657484U Bend-resistant flexible circuit board |
11/24/2010 | CN201657483U Reinforcement plate for printed circuit board |
11/24/2010 | CN201657482U Printed circuit board |
11/24/2010 | CN201657481U Module board and splice board formed by splicing module board |
11/24/2010 | CN201657480U Mobile phone key module FPC |
11/24/2010 | CN201657479U Circuit board |
11/24/2010 | CN201651843U Light source of LED lamp |
11/24/2010 | CN1934659B Inorganic dielectric powder for composite dielectric material and composite dielectric material |
11/24/2010 | CN1812693B Dual bus interface circuit board components and assemble method thereof |
11/24/2010 | CN1784114B Printed wiring board |
11/24/2010 | CN1780524B Multi-layer printed circuit board |
11/24/2010 | CN1739218B 移动通信终端 The mobile communication terminal |
11/24/2010 | CN101897245A Circuit connecting material and structure for connecting circuit member |
11/24/2010 | CN101897244A Improved insulating layer for rigid printed circuit boards |
11/24/2010 | CN101897243A Circuit board, circuit board manufacturing method, and cover ray film |
11/24/2010 | CN101897242A Parts made of electrostructural composite material |
11/24/2010 | CN101896341A Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit board |
11/24/2010 | CN101896058A Electromagnetic shielding method and electromagnetic shielding film |
11/24/2010 | CN101896038A Circuit board structure and manufacture method thereof |
11/24/2010 | CN101896037A Rigid-flex wiring board and method for producing same |
11/24/2010 | CN101896036A Multilayer substrate and manufacturing method thereof |
11/24/2010 | CN101895163A Micro-motor |
11/24/2010 | CN101894823A Composite material structure, circuit board structure comprising same and forming method thereof |
11/24/2010 | CN101894772A Method for enhancing reliability of chip welding spot, printed circuit board and electronic device |
11/24/2010 | CN101894762A Metal heat-conducting substrate and manufacturing method thereof |
11/24/2010 | CN101893182A Device and method for generating visually luminous effect on non-planar face |
11/24/2010 | CN101892027A Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same |
11/24/2010 | CN101315899B Production method of label type integration circuit soft plate and structure thereof |
11/24/2010 | CN101198671B Adhesive and adhesive sheet |
11/24/2010 | CN101157788B Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition |
11/24/2010 | CN101146933B Electrolytic copper foil and process for producing electrolytic copper foil, surface treated electrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed ci |
11/23/2010 | US7840201 Communication module having tuner units that are separated and isolated from each other, and method of manufacturing the same |
11/23/2010 | US7839657 Position adjustable printed circuit board |
11/23/2010 | US7839654 Method for ultimate noise isolation in high-speed digital systems on packages and printed circuit boards (PCBS) |
11/23/2010 | US7839652 Semiconductor device and printed circuit board |
11/23/2010 | US7839651 Multilayer ceramic electronic component |
11/23/2010 | US7839650 Circuit board structure having embedded capacitor and fabrication method thereof |
11/23/2010 | US7839649 Circuit board structure having embedded semiconductor element and fabrication method thereof |
11/23/2010 | US7839647 A new printed circuit board capable of providing electromagnetic shielding ability without employing additional to increase thickness and decrease density; layer includes a number of carbon nanotube films parallel to and between first and second polymer layer and positioned at specific angle |
11/23/2010 | US7838994 Semiconductor device and radiation detector employing it |
11/23/2010 | US7838779 Wiring board, method for manufacturing same, and semiconductor package |
11/23/2010 | US7838778 Circuit board layout |
11/23/2010 | US7838777 Signal transmission structure, package structure and bonding method thereof |
11/23/2010 | US7838776 Circuitized substrates utilizing smooth-sided conductive layers as part thereof |
11/23/2010 | US7838576 Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
11/23/2010 | US7838114 Thermosetting resin composition and use thereof |
11/23/2010 | US7837817 Fabrics with high thermal conductivity coatings |
11/23/2010 | US7837497 Electronic device and flexible printed wiring board |
11/23/2010 | US7837475 Connector with reinforced mounting structure |
11/23/2010 | US7837115 Camera unit configured to distort captured images |
11/23/2010 | US7836567 Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor |
11/18/2010 | WO2010131523A1 Signal line and circuit board |
11/18/2010 | WO2010130735A1 Light band and method for producing a light band |
11/18/2010 | WO2010099172A3 Electrical connector |
11/18/2010 | US20100291795 Method of improving isolation between circuits on a printed circuit board |
11/18/2010 | US20100290331 Wiring structure and optical disk apparatus |
11/18/2010 | US20100290227 Circuit layout of circuit substrate, light source module and circuit substrate |
11/18/2010 | US20100290204 Motor controller assembly with capacitor thermal isolation |
11/18/2010 | US20100290191 System-in packages |
11/18/2010 | US20100289596 Impedance matched circuit board |
11/18/2010 | US20100289522 Signal transmitting device suited to fast signal transmission |
11/18/2010 | US20100289500 Substrate structure |
11/18/2010 | US20100289157 Circuit board having bypass pad |
11/18/2010 | US20100289132 Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and package |
11/18/2010 | US20100289130 Method and Apparatus for Vertical Stacking of Integrated Circuit Chips |
11/18/2010 | US20100288550 ELEMENT MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME, CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME, AND MOBILE APPLIANCE ( as amended |
11/18/2010 | US20100288549 Coreless packaging substrate and method for manufacturing the same |
11/18/2010 | US20100288548 Circuit layout method and circuit board fabricated by the same |
11/18/2010 | US20100288547 Holding Member, Mounting Structure Having The Holding Member Mounted In Electric Circuit Board, and Electronic Part Having the Holding Member |
11/18/2010 | US20100288546 Holding Member, Mounting Structure Having The Holding Member Mounted In Electric Circuit Board, and Electronic Part Having the Holding Member |
11/18/2010 | US20100288545 Printed wiring board and electronic-component package |
11/18/2010 | US20100288544 Multilayer printed wiring board |
11/18/2010 | US20100288543 Conducting lines, nanoparticles, inks, and patterning |
11/18/2010 | US20100288542 Embedded Substrate Having Circuit Layer Element With Oblique Side Surface and Method for Making the Same |
11/18/2010 | US20100288541 Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package |
11/18/2010 | US20100288540 Three-dimensional wiring board |
11/18/2010 | US20100288539 Printed wiring board and manufacturing method of the same |
11/18/2010 | US20100288538 Flakes Made of Materials Such as Glass |
11/18/2010 | US20100288536 Ceramic circuit board and method of making the same |
11/18/2010 | US20100288535 Electronic component-embedded printed circuit board comprising cooling member and method of manufacturing the same |
11/18/2010 | US20100288534 Printable composition with nanostructures of first and second types |
11/18/2010 | US20100288527 Device for electric field control |
11/18/2010 | US20100288331 Flexible electrical substrate |
11/17/2010 | EP2250509A2 Current measuring device using a magnetically sensitive sensor for a power electronics system |