Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
12/2010
12/15/2010CN1909769B Retaining and connecting device for opto-electronic element
12/15/2010CN1898298B Aromatic polyamic acid and polyimide
12/15/2010CN1875322B Chemically amplified positive photosensitive thermosetting resin composition, method of forming cured article, and method of producing functional device
12/15/2010CN1717167B Compact design for handheld computing device having LCD display
12/15/2010CN101919320A Method for producing wiring board and wiring board
12/15/2010CN101919319A Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board
12/15/2010CN101917825A Connecting method and connecting device of photoelectric component and main printed circuit board
12/15/2010CN101917822A Light emitting module, combined type circuit board device used by same and assembly method thereof
12/15/2010CN101917821A High-density circuit board registration hole and manufacturing method thereof
12/15/2010CN101917820A Golden finger
12/15/2010CN101917819A Printed wiring board
12/15/2010CN101917818A Pad structure of circuit board and manufacturing method thereof
12/15/2010CN101917817A Solder pad conduction structure of circuit board
12/15/2010CN101917816A Anti-interference wiring method of circuit design of wireless sensing node equipment
12/15/2010CN101916752A 多层印刷线路板 Multilayer printed circuit boards
12/15/2010CN101916746A Submount and method for manufacturing same
12/15/2010CN101532852B Intelligent increment or absolute-value encoder circuit board and work method thereof
12/15/2010CN101442886B Printed circuit board and manufacturing method of the same
12/15/2010CN101442878B Flexible wiring board, method of producing the same and imaging device
12/15/2010CN101426334B Soldering pad construction for printed circuit board
12/15/2010CN101421886B Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method
12/15/2010CN101421648B Optoelectric hybrid film and electronic apparatus receiving the same
12/15/2010CN101369542B Wiring board and manufacturing method therefor, and semiconductor device and manufacturing method therefor
12/15/2010CN101280093B Halogen-free flame-retardant epoxy resin composition, flexible copper clad laminate made therefrom and preparation of the flexible copper clad laminate
12/15/2010CN101266037B Fluorescent lamp set, backlight module group and display apparatus
12/15/2010CN101212864B Inter-connecting structure between multi-layer base board and producing method
12/15/2010CN101203102B Conjunction
12/15/2010CN101198212B Multilayer soft printed wiring board and production method thereof
12/15/2010CN101127343B Structure for integrating IC integration base board and carrier board, its manufacturing method and manufacturing method of electronic device
12/15/2010CN101000903B Printed circuit board and method of manufacturing semiconductor package using the same
12/14/2010US7852637 Bi-positional expansion card retainer
12/14/2010US7852635 Multi-connection via
12/14/2010US7852634 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
12/14/2010US7852169 High speed interconnection system having a dielectric system with polygonal arrays of holes therein
12/14/2010US7851816 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
12/14/2010US7851811 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
12/14/2010US7851709 Multi-layer circuit board having ground shielding walls
12/14/2010US7851708 Composite substrate and method for manufacturing composite substrate
12/14/2010US7851707 Circuit board and method for manufacturing the same
12/14/2010US7851706 Flexible printed circuit and manufacturing method thereof
12/14/2010US7851344 Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface
12/14/2010US7851128 Mixture of polyimide and acid generator; forming relief images
12/14/2010US7851124 Composition for forming wiring protective film and uses thereof
12/14/2010US7851053 a copper clad laminate coated with copper foils of different thicknesses on both sides, a first copper foil on one side of the laminate is not recrystallizable by hot pressing and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil; reduce warping
12/14/2010US7850462 Spring tab of an electric junction box
12/14/2010US7849591 Method of manufacturing a printed wiring board
12/14/2010CA2640647C Flexible wearable computer system
12/14/2010CA2445604C Substrate adhesion enhancement to film
12/09/2010WO2010140674A1 Epoxy resin composition, prepreg and cured products thereof
12/09/2010WO2010140638A1 Metal-clad laminate and method for producing metal-clad laminate
12/09/2010WO2010140489A1 Circuit board, circuit board connecting structure, and display panel assembly
12/09/2010WO2010140469A1 Connection method, connection structure, and electronic device
12/09/2010WO2010140432A1 Laminate of ceramic insulating layer and metal layer, and method for producing same
12/09/2010WO2010140270A1 Method for manufacturing multi-piece substrate, and multi-piece substrate
12/09/2010WO2010140224A1 Method for manufacturing semiconductor device, printed circuit board, and method for manufacturing the printed circuit board
12/09/2010WO2010139549A1 Printed board arrangement
12/09/2010WO2010138983A1 Method for contacting an electronic component and a heat-conducting element and for producing a printed circuit board
12/09/2010WO2010106359A3 Liquid coverlays for flexible printed circuit boards
12/09/2010WO2010101418A3 Composition for conductive paste containing nanometer-thick metal microplates
12/09/2010US20100310849 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards
12/09/2010US20100309642 Signal conversion device with dual chip
12/09/2010US20100309641 Interposer substrate, lsi chip and information terminal device using the interposer substrate, manufacturing method of interposer substrate, and manufacturing method of lsi chip
12/09/2010US20100309640 Surface mount electronic device packaging assembly
12/09/2010US20100309602 Printed circuit board and electrostatic discharge protection method for the same
12/09/2010US20100308942 Rf system concept for vehicular radar having several beams
12/09/2010US20100308471 Electronic device and method for manufacturing the same
12/09/2010US20100308460 Method of Ball Grid Array Package Construction with Raised Solder Ball Pads
12/09/2010US20100308451 Wiring substrate and method of manufacturing the same
12/09/2010US20100307810 Energy conditioning circuit arrangement for integrated circuit
12/09/2010US20100307809 Printed wiring board and method for manufacturing the same
12/09/2010US20100307808 Wiring board
12/09/2010US20100307807 Double-sided circuit board and manufacturing method thereof
12/09/2010US20100307806 Printed circuit board
12/09/2010US20100307805 Circuit connecting material, connection structure and method for producing the same
12/09/2010US20100307804 Method for connecting a precious metal surface to a polymer
12/09/2010US20100307803 Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
12/09/2010US20100307802 Wiring Member, Method of Manufacturing the Wiring Member and Electronic Element
12/09/2010US20100307801 Multilayer ceramic substrate and manufacturing method thereof
12/09/2010US20100307800 Anodised Aluminum, Dielectric, and Method
12/09/2010US20100307799 Carrier Structure for Electronic Components and Fabrication Method of the same
12/09/2010US20100307798 Unified scalable high speed interconnects technologies
12/09/2010US20100307797 Flexible printed circuit and method of manufacturing same
12/09/2010US20100307796 Method for Selective Adsorption of Noble Metal Onto Surface of Polymer
12/09/2010US20100307795 Circuit board
12/09/2010DE102009026445A1 Contact connector for electrically contacting housing and/or printed circuit board with cable harness of motor vehicle, has printed circuit board including contact areas, which cooperate with counter contacts in mating plug
12/09/2010DE102004025609B4 Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul Assembly screw in pressure contact with a power semiconductor module
12/08/2010EP2259312A1 Inversely alternate stacked structure of integrated circuit modules
12/08/2010EP2259134A1 Active matrix board, liquid crystal panel, liquid crystal display device, liquid crystal display unit and television receiver
12/08/2010EP2258773A1 Epoxy resin
12/08/2010EP2258151A1 Large area thin film capacitors on metal foils and methods of manufacturing same
12/08/2010EP2258022A1 Substrate integrated waveguide
12/08/2010EP2143309B1 Method for making a supply module based on magnetic material
12/08/2010EP2101551B1 Piezoelectric Oscillator and a method of manufacturing the same
12/08/2010EP1609968B1 Electric parts attaching structure and attaching method for throttle body, and throttle body
12/08/2010CN201667760U Circuit board
12/08/2010CN201667759U Printed circuit board
12/08/2010CN1969448B Motor controller
12/08/2010CN1940145B Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil
12/08/2010CN1938799B Embedded capacitors using conductor filled vias
12/08/2010CN1937884B Embedded capacitor device having a common coupling area
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