Patents for H05K 1 - Printed circuits (98,583)
01/2011
01/20/2011US20110011631 Ceramic substrate and method of manufacturing the same
01/20/2011US20110011630 Semiconductor device and method of manufacturing the same
01/20/2011US20110011629 Electrodynamic arrays having nanomaterial electrodes
01/20/2011US20110011627 Parts made of electrostructural composite material
01/20/2011US20110011626 Printed circuit board and method of manufacturing the same
01/20/2011DE202010015726U1 Montagestruktur der stehenden Schaltungsplatte Mounting structure of the stationary circuit board
01/20/2011DE10262143B4 Lichtemittierende Anordnung Light emitting device
01/20/2011DE10221876B4 Verfahren zum Herstellen eines Keramik-Kupfer-Verbundsubstrats A method for manufacturing a ceramic-copper composite substrate
01/20/2011DE102008023714B4 Anordnung mit einem Hauptträger und einer Leiterplatte mit Bauelementen Arrangement with a major carrier and a circuit board with components
01/19/2011EP2276331A1 Cable set and method for manufacturing a cable set
01/19/2011EP2276329A1 Electronic circuit board with a thermal capacitor
01/19/2011EP2275857A1 Display device
01/19/2011EP2275503A2 Conductive inks with metallo-organic modifiers
01/19/2011EP2274798A1 A connector and electrical tracks assembly
01/19/2011EP2274188A2 Protective arrangement for the protection of safety-relevant electronic circuits from malfunction
01/19/2011EP1852004B1 Recycling printed circuit boards
01/19/2011EP1614704B1 Crosslinked polyimide, composition comprising the same and method for producing the same
01/19/2011EP1600011B1 Coaxial module with surge protector
01/19/2011CN201718115U Electrical connection structure of circuit board
01/19/2011CN201718114U Z-direction connecting structure of printed circuit board
01/19/2011CN201718113U Inflaming retarding copper clad glass cloth laminated board
01/19/2011CN201718112U Whole printed circuit board and stamp-hole structure member therein
01/19/2011CN201717773U Power supply module and circuit board
01/19/2011CN201717150U Solder pad structure of key element
01/19/2011CN201717110U Intrinsically safe planar transformer
01/19/2011CN1949420B Laminate electronic components and manufacturing method thereof
01/19/2011CN1812689B Multilayer circuit board and manufacturing method thereof
01/19/2011CN1595567B Capacitor having plates with a pattern void of conductive material and method of making therfor
01/19/2011CN101953026A Opic electroconductive film
01/19/2011CN101952902A Conductive paste, electromagnetic wave-shielding film using same, and electromagnetic wave-shielding flexible printed wiring board
01/19/2011CN101952495A Textile for connection of electronic devices
01/19/2011CN101951733A Insulating layer, printed circuit board with electronic component and producing method thereof
01/19/2011CN101951726A Resistor built-in printing circuit board and manufacturing process thereof
01/19/2011CN101951725A Printed circuit board unit and electronic device
01/19/2011CN101951724A Metallized polyimides film and flexible circuit board using the same
01/19/2011CN101950866A Elastic sheet structure and electronic device applying same
01/19/2011CN101950598A Conductor pulp for printed circuit board and preparation method thereof
01/19/2011CN101626011B Base plate having pad-free type conductive traces and using for encapsulation
01/19/2011CN101594750B Structure and manufacturing method of high-density substrate
01/19/2011CN101576668B Display module assembly and method for fixing circuit wafer thereof
01/19/2011CN101548226B Blacklight apparatus and manufacturing method of the same
01/19/2011CN101528981B Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated c
01/19/2011CN101505575B Flexible circuit based on PDMS biological compatibility
01/19/2011CN101483971B Circuit board and manufacturing method thereof
01/19/2011CN101448363B Double-sided wiring board, manufacturing method of the same, double-sided wiring board for mounting
01/19/2011CN101435933B Method for processing crystal covering thin film
01/19/2011CN101394713B Photoelectric circuit board and manufacturing method thereof
01/19/2011CN101312610B Circuit board preventing electro-static discharge
01/19/2011CN101212865B Organic transistor based printed circuit unit
01/19/2011CN101014890B Optical wiring resin composition and photo-electric composite wiring board
01/18/2011US7873245 Optoelectric composite substrate and method of manufacturing the same
01/18/2011US7872876 Multi-layered printed circuit board
01/18/2011US7872200 Wired circuit board and connection structure between wired circuit boards
01/18/2011US7872081 Melt-processible poly(tetrafluoroethylene)
01/18/2011US7871857 Methods of forming multi-chip semiconductor substrates
01/18/2011US7871756 used for producing a permanent film, capable of forming a resin layer which is good in fluidity upon heat bonding after pattern, formation and also has good adhesion as well as bonding properties and/or sealing properties
01/18/2011US7871698 Adhesive film, flexible metal-clad laminate, and processes for producing these
01/18/2011US7871694 impregnating a resin composition comprising a resin with an imide structure (polyamideimide copolymer, polyamideimidesoloxane) and a thermosetting resin ( epoxy or polyepoxide)into a fiber base material; prepreg having a property that it can be bent; metal foil-clad laminate and printed circuit board
01/18/2011US7871691 polyethylene-2,6-naphthalene dicarboxylate oriented polyester film is excellent in dimensional stability at a high temperature and dimensional stability to temperature change in a working temperature range; excellent in transparency and high flatness; electronics
01/18/2011US7871661 Serpentine and corduroy circuits to enhance the stretchablity of a stretchable electronic device
01/18/2011US7871274 IC adapter for removably mounting integrated circuit
01/13/2011WO2011004710A1 Heat-curable adhesive tape or sheet and flexible printed circuit board
01/13/2011WO2011004681A1 Electronic circuit device
01/13/2011WO2011004559A1 Through-wiring board and method of manufacturing same
01/13/2011WO2011004556A1 Through-wiring board and method of manufacturing same
01/13/2011WO2011004542A1 Electronic component unit and reinforcement adhesive
01/13/2011WO2011003948A2 Electrically conductive adhesives
01/13/2011WO2011003726A1 Optoelectronic component and flat light source
01/13/2011WO2011003647A1 Printed circuit board
01/13/2011WO2011003636A1 Multilayer securing structure and method thereof for the protection of cryptographic keys and code
01/13/2011WO2011003123A1 Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
01/13/2011US20110008056 Connection device and optical device
01/13/2011US20110007490 Resin composition and cured film thereof
01/13/2011US20110007489 Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device
01/13/2011US20110007482 Printed circuit board unit and electronic device
01/13/2011US20110007481 Display device
01/13/2011US20110007478 Electronic circuit device
01/13/2011US20110007470 Cell board interconnection architecture
01/13/2011US20110006861 Liquid Crystalline Polymer and Multilayer Polymer-Based Passive Signal Processing Components for RF/Wireless Multi-Band Applications
01/13/2011US20110005824 Printed circuit board and method of manufacturing the same
01/13/2011US20110005823 Printed circuit board having electro component and manufacturing method thereof
01/13/2011US20110005822 Structure of a package for electronic devices and method for manufacturing the package
01/13/2011US20110005821 Method for manufacturing laminated circuit board
01/13/2011US20110005820 Full perimeter chemical strengthening of substrates
01/13/2011US20110005819 Conductive plate and method for making the same
01/13/2011US20110005818 Projected capacitive touch panel and fabricating method thereof
01/13/2011US20110005817 Capacitor-forming material and printed wiring board provided with capacitor
01/13/2011US20110005816 Method for making a conductive film exhibiting electric anisotropy, conductive plate and method for making the same
01/13/2011US20110005815 Conductive plate and touch panel including the same
01/13/2011US20110005814 Circuit board via structure and method forming the same
01/13/2011US20110005813 Ribbon connecting electrical components
01/13/2011US20110005812 Metal foil laminated polyimide resin substrate
01/13/2011US20110005811 Method of manufacturing rigid-flex circuit board, and the rigid-flex circuit board
01/13/2011US20110005810 Insulating substrate and method for producing the same
01/13/2011DE102008058025B4 Schaltungsträger Circuit board
01/13/2011DE102005005896B4 Verwendung einer Beleuchtungsvorrichtung in einem Bestückautomaten Using a lighting apparatus in a placement
01/13/2011CA2802112A1 Fluidized-bed reactor system
01/13/2011CA2766859A1 Electrically conductive adhesives
01/12/2011EP2273859A2 Use of a control module for a control unit built into an automatic gearbox
01/12/2011EP2273858A1 Printed circuit board unit and electronic device