Patents for H05K 1 - Printed circuits (98,583)
01/2012
01/04/2012EP2401897A1 Multi-layer circuit carrier and method for the production thereof
01/04/2012EP2086297B1 Printed circuit board and method of manufacturing the same
01/04/2012EP1953818B1 Electronic component mounting board
01/04/2012CN202104006U Electronic connector with insulating varnish
01/04/2012CN202103952U Circuit board with driving control chip
01/04/2012CN202103951U Circuit board capable of fast radiating heat
01/04/2012CN202103950U Space connection structure for circuit board
01/04/2012CN202103949U Guide rail type connecting board for double-layer printed circuit board (PCB) machine disc
01/04/2012CN202103948U Groove PCB (Printed Circuit Board) circuit board
01/04/2012CN202103947U Flexible circuit board applied to an XFP transceiver module
01/04/2012CN202103946U Metal circuit base board
01/04/2012CN202103945U Circuit board for assembling LED (light-emitting diode)
01/04/2012CN202103944U Metal-base printed circuit board
01/04/2012CN202103943U Printed circuit board with metal micro-radiator
01/04/2012CN202103942U Circuit board
01/04/2012CN202103941U Circuit board
01/04/2012CN202103940U Circuit board
01/04/2012CN202103939U Circuit board
01/04/2012CN202103938U Novel combined type circuit board
01/04/2012CN202103937U Circuit board
01/04/2012CN202103936U Vehicle-mounted circuit board
01/04/2012CN202103935U Circuit board component
01/04/2012CN202102870U Planar transformer in switching power supply
01/04/2012CN202102394U Flexible circuit-board connecting structure for touch-control panel
01/04/2012CN202102203U Liquid crystal display screen with flexible circuit board
01/04/2012CN1947480B Packaging method of electronic component
01/04/2012CN1943286B Preferential asymmetric through-hole positoning for printed circuit boards
01/04/2012CN1893779B Housing of circuit boards
01/04/2012CN102308330A Connection terminal and display device with the connection terminal
01/04/2012CN102307825A Sintered body of low temperature cofired ceramic and multilayer ceramic substrate
01/04/2012CN102307430A Circuit board with realization of electric connection between right side and reverse side through binding post and welding method thereof
01/04/2012CN102307429A Embedded high-thermal conductive PCB and manufacturing method thereof
01/04/2012CN102307428A Anti-electromagnetic interference piezoelectric interlayer
01/04/2012CN102307427A Multi-layer printed circuit board (PCB)
01/04/2012CN102305880A Switching plate for preventing puncture in printed circuit board electroplate soft metal electric property test
01/04/2012CN102304273A Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same
01/04/2012CN102304264A High-frequency copper foil substrate and composite material used thereby
01/04/2012CN101937737B Low-temperature curing conductive slurry and preparation method thereof
01/04/2012CN101848598B Soft and hard printing circuit board module and manufacturing method and processing method thereof
01/04/2012CN101699942B Multi-bin shielding mode with compact structure
01/04/2012CN101695216B Printed circuit board and manufacturing method thereof
01/04/2012CN101690426B Connector, manufacture method for connector and anisotropic conductive film to be used therein
01/04/2012CN101594730B Circuit board with conductive structure
01/04/2012CN101593592B Ferrite insert panel and core structure for passive substrate of switch power supply module
01/04/2012CN101315917B Wiring board and its fabricating method
01/04/2012CN101304635B Wiring circuit board
01/04/2012CN101174718B Grouped element transmission channel link with pedestal aspects
01/04/2012CN101174611B Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shielding
01/03/2012US8089775 Multileveled printed circuit board unit including substrate interposed between stacked bumps
01/03/2012US8089770 Tool-less multi-stage insertion and securing mechanism for electronic mezzanine assemblies
01/03/2012US8089205 Wiring board with groove in which wiring can move, image display apparatus, and image reproducing apparatus
01/03/2012US8089138 Surface-hydrophobicized film, material for formation of surface-hydrophobicized film, wiring layer, semiconductor device and process for producing semiconductor device
01/03/2012US8089007 Printed circuit board
01/03/2012US8089006 High performance resonant element
01/03/2012US8089005 Wiring structure of a substrate
01/03/2012US8089004 Semiconductor device including wiring excellent in impedance matching, and method for designing the same
01/03/2012US8089003 Printed circuit board assembly
01/03/2012US8088495 Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
01/03/2012US8087943 Power semiconductor module including a contact element
01/03/2012CA2475644C Light emitting diode carrier
01/03/2012CA2433735C Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same
01/03/2012CA2431623C Inner component board assembly for an electric utility meter
01/03/2012CA2428723C Lamp on sheet and manufacturing method thereof
12/2011
12/29/2011WO2011163256A1 External contact plug connector
12/29/2011WO2011162171A1 Distribution board device
12/29/2011WO2011162137A1 Bonded material, and process for production thereof
12/29/2011WO2011162005A1 Printed circuit board
12/29/2011WO2011161996A1 Liquid crystal display device
12/29/2011WO2011161902A1 Resin composition used to form resin layer of metal base substrate, metal base substrate, and method for producing metal base substrate
12/29/2011WO2011161115A1 Film or plate
12/29/2011WO2011160782A1 Multilayered film element
12/29/2011US20110318853 Method for forming nozzle chamber of inkjet printhead
12/29/2011US20110317388 Electronic device having a wiring substrate
12/29/2011US20110317386 Connecting structure, circuit device and electronic apparatus
12/29/2011US20110317384 Printed board and semiconductor integrated circuit
12/29/2011US20110317383 Mold compounds in improved embedded-die coreless substrates, and processes of forming same
12/29/2011US20110317382 Insulating resin composition and printed circuit substrate using the same
12/29/2011US20110317381 Embedded chip-on-chip package and package-on-package comprising same
12/29/2011US20110317375 Alignment pin for retaining a module on a circuit board
12/29/2011US20110317373 Method and Apparatus for Interconnecting Circuit Boards
12/29/2011US20110317356 Memory system, memory module, and module socket
12/29/2011US20110317326 Discharge gap filling composition and electrostatic discharge protector
12/29/2011US20110317318 Circuit elements comprising ferroic materials
12/29/2011US20110316167 Electrical interconnect for an integrated circuit package and method of making same
12/29/2011US20110316148 Wiring substrate
12/29/2011US20110316057 Wiring board, semiconductor device, and manufacturing methods thereof
12/29/2011US20110315440 Electromagnetic bandgap structure and printed circuit board
12/29/2011US20110315439 Multiple Patterning Wiring Board, Wiring Board Wiring Board and Electronic Apparatus
12/29/2011US20110315438 Method for producing laminated base material, laminated base material and printed wiring board
12/29/2011US20110315437 Printed circuit board with reinforced thermoplastic resin layer
12/29/2011US20110315436 Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink composition
12/29/2011US20110315435 Acid anhydride curable thermosetting resin composition
12/29/2011US20110315434 Fine aluminum hydroxide powder for filling in resin and method for producing the same
12/29/2011US20110315433 Meth0d and system for connecting a plurality of printed circuit boards to at least one frame or carrier element and printed circuit board and frame or carrier element
12/29/2011US20110315432 Method for manufacturing transparent electrode pattern and method for manufacturing electro-optic device having the transparent electrode pattern
12/29/2011US20110315214 Transparent electrically conductive substrate carrying thereon a surface electrode, a manufacturing method therefor, a thin-film solar cell and a manufacturing method therefor
12/29/2011DE102011078133A1 Struktur und verfahren zur befestigung einer leiterplatte mit eingebetteten elektronischen bauteilen an einem kühler Structure and process for mounting a circuit board with embedded electronic com- ponents cool on a
12/29/2011DE102010030525A1 Elektronische Steuerbaugruppe Electronic control module
12/29/2011DE102010025591A1 Sensorträger sowie Sensormodul insbesondere zum Einsatz in einem Kraftfahrzeugvorortsteuergerät Sensor carrier and sensor module in particular for use in a motor vehicle suburb controller
12/29/2011DE102010025315A1 Elektronisches Bauelement Electronic component