| Patents for H05K 1 - Printed circuits (98,583) |
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| 11/30/2011 | CN202059667U 柔性电路板 The flexible circuit board |
| 11/30/2011 | CN202059609U 电磁炉用电路板结构 Cooker circuit board structure |
| 11/30/2011 | CN202059315U 一种中压变流器功率母排结构 A medium voltage converter power busbar structure |
| 11/30/2011 | CN202058879U 电路板结构、电子模块与微型通用串行总线3.0连接器 Board structure, electronic module and Mini Universal Serial Bus 3.0 connector |
| 11/30/2011 | CN202058818U High-interchangeability lithium ion battery |
| 11/30/2011 | CN202056680U 一种新型背光结构 A new backlight structure |
| 11/30/2011 | CN202053618U 挠性线路板用保护膜 Flexible circuit boards with a protective film |
| 11/30/2011 | CN1984524B 柔性电路膜和具有该柔性电路膜的显示面板组件 The flexible circuit film and the display panel assembly having the flexible circuit film |
| 11/30/2011 | CN102265720A 密封构造体 Sealing structure |
| 11/30/2011 | CN102265718A 多层布线基板、及多层布线基板的制造方法 A multilayer wiring board, and manufacturing a multilayer wiring board |
| 11/30/2011 | CN102265711A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil using an electronic circuit and a method which form an electronic circuit |
| 11/30/2011 | CN102265710A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil and the use of electronic circuits forming an electronic circuit are a method |
| 11/30/2011 | CN102265709A 印刷电路板及其制造方法 A printed circuit board and manufacturing method thereof |
| 11/30/2011 | CN102265708A 高数据率连接器系统 High data rate connector system |
| 11/30/2011 | CN102264951A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil using an electronic circuit and a method which form an electronic circuit |
| 11/30/2011 | CN102264793A 树脂组合物、半固化片、树脂片、覆金属层叠板、印刷布线板、多层印刷布线板及半导体装置 The resin composition, a prepreg, a resin sheet, a metal-clad laminated plate, a printed wiring board, a multilayer printed wiring board and a semiconductor device |
| 11/30/2011 | CN102264541A 带载体金属箔 Metal foil with carrier |
| 11/30/2011 | CN102264540A 带载体的金属箔 Metal foil tape carrier |
| 11/30/2011 | CN102264539A 树脂复合铜箔 Resin composite foil |
| 11/30/2011 | CN102264538A 柔性层压板以及使用该层压板形成的柔性电子电路基板 The flexible laminate and the laminate is formed using a flexible electronic circuit substrate |
| 11/30/2011 | CN102264213A 散热模块的结合方法 Cooling module combination method |
| 11/30/2011 | CN102264190A 印刷电路板 A printed circuit board |
| 11/30/2011 | CN102264189A 电子电路用基板 Electronic circuit board |
| 11/30/2011 | CN102264188A 印刷电路板 A printed circuit board |
| 11/30/2011 | CN102262918A 一种印刷电路板用灌孔银浆及其制备方法 A printed circuit board with a silver filling holes and its preparation method |
| 11/30/2011 | CN102262271A 光电复合挠性布线及其制造方法 Optical composite flexible wiring and its manufacturing method |
| 11/30/2011 | CN102260408A 黑色聚酰亚胺薄膜及含所述薄膜的铜箔层合板 Black polyimide film and foil laminates containing the film |
| 11/30/2011 | CN102260402A 环氧树脂组合物及由其制成的预浸材和印刷电路板 Epoxy resin composition and the prepreg made therefrom, and a printed circuit board material |
| 11/30/2011 | CN102260378A 复合材料、用其制作的高频电路基板及其制作方法 Composite materials, with its production of high-frequency circuit board and its production method |
| 11/30/2011 | CN101848599B 软性印刷电路板 Flexible printed circuit board |
| 11/30/2011 | CN101643572B 热固性树脂组合物及用其制成的半固化片与印制电路用层压板 The thermosetting resin composition and a prepreg and printed circuits made from laminates thereof |
| 11/30/2011 | CN101502186B 带有引起振动的电子器件的电路板 With an electronic device caused by vibration of the circuit board |
| 11/30/2011 | CN101394707B 软性电路板 Flexible circuit board |
| 11/30/2011 | CN101313439B 用于高速信号设计的印刷电路板中的同轴通孔 Designed for high-speed signal in the printed circuit board through hole coaxial |
| 11/30/2011 | CN101166401B 用于在高速系统中放置多个负载的方法和系统 The method used to place multiple loads in high-speed systems and systems |
| 11/30/2011 | CN101013686B 互连衬底、半导体器件及其制造方法 Interconnect substrate, a semiconductor device and manufacturing method thereof |
| 11/29/2011 | US8068349 Power supply architecture for structural ASIC |
| 11/29/2011 | US8068347 Printed circuit board having embedded RF module power stage circuit |
| 11/29/2011 | US8068346 Circuit board with high density power semiconductors |
| 11/29/2011 | US8067827 Stacked microelectronic device assemblies |
| 11/29/2011 | US8067700 Via structure of printed circuit board |
| 11/29/2011 | US8067699 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 11/29/2011 | US8067698 Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same |
| 11/29/2011 | US8067697 Flexible printed circuit board for light emitting diode backlight unit and method of fabricating the same |
| 11/29/2011 | US8067696 Printed circuit board and method for manufacturing same |
| 11/29/2011 | US8067695 Wiring board and method of manufacturing the same |
| 11/29/2011 | US8067523 Thermosetting resin composition, laminated body using it, and circuit board |
| 11/29/2011 | US8067484 Latent hardener with improved barrier properties and compatibility |
| 11/29/2011 | US8066891 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 11/29/2011 | US8065797 Fabricating method for printed circuit board |
| 11/29/2011 | CA2504351C Enzyme print humidification in a continuous process for manufacture of electrochemical sensors |
| 11/29/2011 | CA2462252C Electronic circuit comprising conductive bridges and method for making such bridges |
| 11/25/2011 | CA2740253A1 Locking device and method for making the same |
| 11/24/2011 | WO2011145411A1 Conducting layer, and transducer and flexible wiring board using the same |
| 11/24/2011 | WO2011145367A1 Transparent flexible printed wiring board and process for producing same |
| 11/24/2011 | WO2011145336A1 Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards |
| 11/24/2011 | WO2011145294A1 Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit board |
| 11/24/2011 | WO2011114263A3 Light-emitting textile-based architectural element |
| 11/24/2011 | WO2011113762A4 Film system for led applications |
| 11/24/2011 | WO2011056455A3 Dielectric material with non-halogenated curing agent |
| 11/24/2011 | US20110287670 Method for high-frequency tuning an electrical device |
| 11/24/2011 | US20110286194 Connection structure, circuit device, and electronic equipment |
| 11/24/2011 | US20110286193 Assembly of at least two electric boards |
| 11/24/2011 | US20110286192 Printed wiring board and method of suppressing power supply noise thereof |
| 11/24/2011 | US20110286189 Method of fabricating wiring board and method of fabricating semiconductor device |
| 11/24/2011 | US20110286188 Multilayer printed circuit board using flexible interconnect structure, and method of making same |
| 11/24/2011 | US20110286081 Electronically addressable microencapsulated ink and display thereof |
| 11/24/2011 | US20110285788 Liquid discharge head and circuit board |
| 11/24/2011 | US20110284914 Method for manufacturing substrate for light emitting element package, and light emitting element package |
| 11/24/2011 | US20110284282 Wiring board and method for manufacturing the same |
| 11/24/2011 | US20110284281 Laminated high-frequency module |
| 11/24/2011 | US20110284280 Optically transparent wires for secure circuits and methods of making same |
| 11/24/2011 | US20110284279 Printed circuit board |
| 11/24/2011 | US20110284278 Mounting structure |
| 11/24/2011 | US20110284277 Printed wiring board and method for manufacturing printed wiring board |
| 11/24/2011 | US20110284276 Epoxy resin composition, and prepreg and printed circuit board using the same |
| 11/24/2011 | US20110284275 Circuit board having grown metal layer in a flexible zone |
| 11/24/2011 | US20110284274 Wired circuit board and producing method thereof |
| 11/24/2011 | US20110284273 Power core for use in circuitized substrate and method of making same |
| 11/24/2011 | US20110284271 Heat sink |
| 11/24/2011 | US20110284270 Low-temperature sintering ceramic material and ceramic substrate |
| 11/24/2011 | US20110284269 Multilayer wiring substrate |
| 11/24/2011 | US20110284268 Flexible circuit coverfilm adhesion enhancement |
| 11/24/2011 | US20110284267 Circuit board and manufacturing method thereof |
| 11/24/2011 | DE102006027586B4 Integrierte Schaltungen mit Induktionsspulen in mehreren leitenden Schichten und Verfahren zum Herstellen derselben Integrated circuits with a plurality of induction coils in the conductive layers and method for manufacturing the same |
| 11/23/2011 | EP2389052A1 Wiring substrate, method for producing wiring substrate, and via paste |
| 11/23/2011 | EP2389050A1 Assembly of at least two electrical circuit boards |
| 11/23/2011 | EP2389049A1 Multilayer printed circuit board using flexible interconnect structure, and method of making same |
| 11/23/2011 | EP2388861A1 Connector |
| 11/23/2011 | EP2388811A2 Carrier body for compnents or circuits |
| 11/23/2011 | EP2304314B1 Lamp |
| 11/23/2011 | EP1958970B1 Use of resins for thermal imprinting |
| 11/23/2011 | EP1776002B1 Composite electronic component and method for manufacturing the same |
| 11/23/2011 | EP1722613B1 Method for manufacturing a three-dimensional circuit board |
| 11/23/2011 | EP1640350B1 Composition for ceramic substrate, ceramic substrate, process for producing ceramic substrate and glass composition |
| 11/23/2011 | CN202050595U High-pixel heat-dissipation-type light-emitting diode (LED) circuit board |
| 11/23/2011 | CN202050594U Environment-friendly light-emitting diode (LED) lamp strip circuit board |
| 11/23/2011 | CN202050593U Connection structure for circuit boards |
| 11/23/2011 | CN202050592U Antenna feeder pad and printed circuit board with same |
| 11/23/2011 | CN202050591U Double-sided filled aluminium base PCB board |