Patents for H05K 1 - Printed circuits (98,583)
02/2012
02/28/2012US8124881 Printed board and portable electronic device which uses this printed board
02/28/2012US8124880 Circuit board and method for manufacturing thereof
02/28/2012US8124879 Printed board
02/28/2012US8122599 Method of manufacturing a printed circuit board (PCB)
02/23/2012WO2012024009A1 Light emitting diode assembly and thermal control blanket and methods relating thereto
02/23/2012WO2011149222A3 Hybrid acoustic/electric signal converting device
02/23/2012US20120044659 Compliant printed circuit peripheral lead semiconductor package
02/23/2012US20120044658 Device module and electronic device
02/23/2012US20120044656 Electronic package structure and method for making the same
02/23/2012US20120044655 GPS-Timing Module
02/23/2012US20120044652 Terminal structure, printed wiring board, module substrate, and electronic device
02/23/2012US20120044651 Terminal structure, printed wiring board, module substrate, and electronic device
02/23/2012US20120044432 Pixel array substrate, conductive structure and display panel
02/23/2012US20120043130 Resilient conductive electrical interconnect
02/23/2012US20120043129 Circuit board and method for manufacturing the same
02/23/2012US20120043128 Printed circuit board and method of manufacturing the same
02/23/2012US20120043127 Printed circuit board and method for fabricating the same
02/23/2012US20120043126 Printed circuit board and method of manufacturing the same
02/23/2012US20120043125 Circuit boards, methods of forming the same and semiconductor packages including the same
02/23/2012US20120043124 Electrical device
02/23/2012US20120043123 Printed wiring board and a method of manufacturing a printed wiring board
02/23/2012US20120043122 Board with fine pitch bump and method of manufacturing the same
02/23/2012US20120043121 Printed circuit board and method of manufacturing the same
02/23/2012US20120043120 Dual-Layer Method of Fabricating Ultracapacitor Current Collectors
02/23/2012US20120043119 Composite polymer-metal electrical contacts
02/23/2012US20120043118 Adhesive resin composition, and laminate and flexible printed wiring board using the same
02/23/2012US20120043117 Signal transmission line and circuit board
02/23/2012US20120043116 Interconnection Structure Of Interposer With Low CTE And Packaging Component Having The Same
02/23/2012US20120043115 Flexible circuit structure with stretchability and method of manufacturing the same
02/23/2012US20120043114 Device-embedded flexible printed circuit board and manufacturing method thereof
02/23/2012US20120043113 Printed circuit board
02/23/2012DE10392162B4 Schaltkreiskartenverbindungsstruktur und Herstellungsverfahren hierfür Circuit board connection structure and manufacturing method thereof
02/23/2012DE102011081201A1 In eine Leiterplatte integrierte Sicherheitseinheit und Leiterplatte In a circuit board integrated security unit and PCB
02/23/2012DE102010035169A1 Control device i.e. electrical switch, for e.g. rechargeable battery driller, has heat generating component arranged in opening such that direct heat conducting connection of heat generating component to cooling body is enabled
02/22/2012EP2421342A2 Electronic component and method of manufacturing the same
02/22/2012EP2421341A2 Electronic component and method of manufacturing the same
02/22/2012EP2421340A1 Circuit substrate and manufacturing method thereof
02/22/2012EP2421339A1 Method for embedding electrical components
02/22/2012EP2421338A1 Circuit board
02/22/2012EP2421062A1 Led unit
02/22/2012EP2119329B1 Device and method for constructing optoelectronic assemblies
02/22/2012EP2039716B1 Polyimide resin
02/22/2012EP2025210B1 Circuit carrier
02/22/2012EP1982636B1 In vivo sensing device with a circuit board having rigid sections and flexible sections
02/22/2012EP1800360B1 Electrical circuit with a nanostructure and method for contacting a nanostructure
02/22/2012CN202151029U 一种应用于车载设备的可移动3g模块转换器 One kind of equipment can be used in car mobile 3g module converter
02/22/2012CN202151007U 用于接触式ic卡模块的pcb电子载板 Pcb electronic carrier board for contactless ic card module
02/22/2012CN202151006U 一种印刷电路板在制板 A printed circuit board in the system board
02/22/2012CN202151005U 一种防击穿电梯用线路板 An anti-breakdown elevator board
02/22/2012CN202151004U 软性印刷线路板 Flexible printed circuit board
02/22/2012CN202151003U 防撕裂fpc Ripstop fpc
02/22/2012CN202151002U Flexible print circuit board for arranging touch sensor
02/22/2012CN202151001U Flexible circuit board and electronic device including the flexible circuit board
02/22/2012CN202151000U 电路板 Board
02/22/2012CN202150999U 电路板 Board
02/22/2012CN202150998U Novel circuit board
02/22/2012CN202150997U 电路板 Board
02/22/2012CN202150996U 电路板 Board
02/22/2012CN202150995U Novel circuit board
02/22/2012CN202150994U Novel circuit board
02/22/2012CN202150993U Circuit board
02/22/2012CN202150992U Novel circuit board
02/22/2012CN202150991U Novel circuit board
02/22/2012CN202150990U Novel combined type circuit board
02/22/2012CN202149992U Cof软性电路板结构 Cof flexible circuit board structure
02/22/2012CN1968804B 功能性纺织结构 Functional textile structure
02/22/2012CN102362559A Copper foil for printed wiring board and method for producing same
02/22/2012CN102362558A Printed wiring boards and communication connectors having series inductor-capacitor crosstalk compensation circuits that share a common inductor
02/22/2012CN102361913A Novel polyamic acid, polyimide, photosensitive resin composition comprising same, and dry film produced from the composition
02/22/2012CN102361903A Epoxy resin composition, prepreg, metal foil with resin, resin sheet, laminate and multi-layer board
02/22/2012CN102361535A Flexible circuit board with impending splicing fingers and manufacturing method for flexible circuit board
02/22/2012CN102361534A Multilayer printed wiring board
02/22/2012CN102361533A Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof
02/22/2012CN102361532A Multilayer printed circuit board and manufacturing process thereof
02/22/2012CN102360853A Planar transformer in switching power supply
02/22/2012CN102360852A Heavy-current planar transformer
02/22/2012CN102360808A Coil substrate structure, substrate holding structure, and switching power supply
02/22/2012CN101925255B 埋设有电子元件的电路板及其制造方法 Embedded electronic component manufacturing method of a circuit board and
02/22/2012CN101754579B 城堡式模块及终端设备 Castle-in module and terminal equipment
02/22/2012CN101697663B 线路板以及表面接合元件与线路板的组装方法 Components and method of assembling the circuit board and the circuit board engagement surface
02/22/2012CN101674707B 改进的匹配阻抗表面贴装技术基底面 Improved matching impedance surface mount technology basal plane
02/22/2012CN101652021B 积层印刷电路板 Multilayer printed circuit boards
02/22/2012CN101522744B 聚酰胺酰亚胺树脂、粘接剂、挠性基板材料、挠性层叠板及挠性印刷电路板 Polyamide-imide resins, adhesives, flexible board materials, flexible laminate and the flexible printed circuit board
02/22/2012CN101457046B 导体图案形成用墨水、导体图案以及配线基板 A conductor pattern is formed with ink, the conductor pattern, and the wiring substrate
02/22/2012CN101457043B 导体图案形成用墨水、导体图案以及配线基板 A conductor pattern is formed with ink, the conductor pattern, and the wiring substrate
02/22/2012CN101341804B 电路基板的连接结构、电路基板的连接部及电子设备 A circuit board connection structure, the circuit board connecting portion and the electronic device
02/22/2012CN101296567B 连接器装置及其制造方法以及采用连接器装置的电池包 Connector device and its manufacturing method, and use of the battery pack connector device
02/22/2012CN101257768B 电子电路及其控制方法 Electronic circuit and control method
02/22/2012CN101083895B 可再使用的散热器附着组件 Radiator attachment assembly may be used
02/22/2012CN101022699B 布线电路基板及其制造方法 Wired circuit board and manufacturing method thereof
02/21/2012US8121697 Biocompatible bonding method and electronics package suitable for implantation
02/21/2012US8121447 Integrated transceiver with lightpipe coupler
02/21/2012US8120927 Printed circuit board
02/21/2012US8120926 Interconnection assembly for printed circuit boards
02/21/2012US8120741 Liquid crystal display device
02/21/2012US8120040 Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
02/21/2012US8119932 Wiring board and method of manufacturing the same
02/21/2012US8119931 Differential vertical structure for high density, low layer count packages
02/21/2012US8119930 Wiring board and method for manufacturing the same
02/21/2012US8119929 Wiring board and method for manufacturing the same