Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
02/2012
02/09/2012WO2012017816A1 Novel phenol resin, curable resin composition, cured article thereof, and printed wiring board
02/09/2012WO2012017664A1 Flexible printed wiring substrate and electronic equipment
02/09/2012WO2012017507A1 Circuit board and method for manufacturing same
02/09/2012WO2012017086A1 Thermal overload protection arrangement
02/09/2012WO2012017070A1 Thermal overload protection apparatus
02/09/2012WO2012016760A1 Optoelectronic lighting module and motor vehicle headlight
02/09/2012US20120033395 Printed circuit board assembly sheet and method for manufacturing the same
02/09/2012US20120033388 Mounting apparatus for expansion cards
02/09/2012US20120033370 PCIe BUS EXTENSION SYSTEM, METHOD AND INTERFACES THEREFOR
02/09/2012US20120032337 Flip Chip Substrate Package Assembly and Process for Making Same
02/09/2012US20120031660 Method of manufacturing circuit board and circuit board
02/09/2012US20120031659 Printed Wiring Board And A Method Of Manufacturing A Printed Wiring Board
02/09/2012US20120031658 Printed circuit board and method for manufacturing the same
02/09/2012US20120031657 Electronic device mounting structure and electronic device mounting method
02/09/2012US20120031656 Substrate for printed wiring board, printed wiring board, and methods for producing same
02/09/2012US20120031655 Multi-Layer Circuit Assembly And Process For Preparing The Same
02/09/2012US20120031654 Capacitor structure with raised resonance frequency
02/09/2012US20120031653 Printed Circuit Board made from a Composite Material
02/09/2012US20120031652 Circuit board and manufacturing method thereof
02/09/2012US20120031651 Circuit board
02/09/2012US20120031650 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
02/09/2012US20120031649 Coreless layer buildup structure with lga and joining layer
02/09/2012US20120031648 Wiring circuit board
02/09/2012US20120031647 Conductive pattern and manufacturing method thereof
02/09/2012DE102010039023A1 Method for connecting two printed circuit boards that are utilized in measuring device of process measurement and control equipment, involves soldering circuit boards with one another such that fixed connection is formed between boards
02/09/2012DE102010033662A1 Guard structure for electronic component, has information-storing chip electrically connected with security guard chip that is connected with electric circuit in circuit board, where chip and security guard chip incorporate chip module
02/09/2012DE102007013737B4 Verfahren zur Herstellung eines Substrats mit Substratkern für eine elektronische Baugruppe A method for producing a substrate with substrate core for an electronic assembly
02/09/2012DE10108073B4 Leuchtvorrichtung Lighting device
02/09/2012CA2748697A1 Mobile wireless device with enlarged width portion multi-band loop antenna and related methods
02/09/2012CA2748679A1 Mobile wireless device with multi-band loop antenna and related methods
02/08/2012EP2416631A1 Electrical household appliance comprising means for displaying an item of information
02/08/2012EP2416630A1 Circuit board and manufacturing method thereof
02/08/2012EP2416356A1 Process for producing metallized substrate and metallized substrate
02/08/2012EP2416328A2 Low temperature fireable paste composition for forming an electrode or wiring
02/08/2012EP2415332A2 Conductor structural element and method for producing a conductor structural element
02/08/2012EP2414304A1 Metal/ceramic substrate
02/08/2012EP2042540B1 Polyimide resin
02/08/2012EP1461387B1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s)
02/08/2012EP1275153B2 Carrier substrate for electronic components
02/08/2012CN202143304U 一种无源元件电路板 A passive element circuit board
02/08/2012CN202143303U 具有加固装置的柔性电路板 Reinforcing means having a flexible circuit board
02/08/2012CN202143302U 一种pcb拼板 One kind pcb puzzle
02/08/2012CN202143301U 一种新型柔性印刷电路板 A new type of flexible printed circuit boards
02/08/2012CN202143300U 一种具有防板翘性能的pcb板 Having an anti-warping performance board pcb board
02/08/2012CN202143299U 一种可防漏捞线路板 One kind of fishing can be leakproof board
02/08/2012CN202143298U 一种凸台pcb电路板 Convex sets pcb board
02/08/2012CN202143297U 一种高阻微波射频电路板 One kind of high-impedance microwave RF board
02/08/2012CN202143296U 具有圆倒角的pcb板 Pcb board with a fillet
02/08/2012CN202143295U 一种带定位标志点的pcb板 A tape locating landmarks pcb board
02/08/2012CN202143294U Printed circuit board pulling block
02/08/2012CN202143293U 一种便于模冲的印制线路板 A punch in the printed circuit board to facilitate
02/08/2012CN202143292U 一种测试线路板 A test board
02/08/2012CN202143291U 两层的印刷电路板及移动通信终端 Two layers of the printed circuit board and mobile communication terminal
02/08/2012CN202143290U 一种多层铝基电路板 A multi-layer aluminum circuit board
02/08/2012CN202142531U 一种基于金属基pcb板的led模组 A metal base pcb board led module-based
02/08/2012CN202142530U 一种基于陶瓷基pcb板的led模组 A ceramic matrix pcb board led module based
02/08/2012CN202142418U Interdigital capacitor
02/08/2012CN202142276U 液晶屏温控板 LCD temperature control panel
02/08/2012CN1949500B 配线板、半导体器件及制造配线板和半导体器件的方法 The method of wiring board, a semiconductor device and manufacturing wiring board and a semiconductor device
02/08/2012CN1750927B 聚酰亚胺金属层积体 Polyimide metal laminate
02/08/2012CN102349359A Resin wiring board
02/08/2012CN102349358A Circuit board and electrical device provided with same
02/08/2012CN102348835A Two-layered flexible substrate, and copper electrolyte for producing same
02/08/2012CN102348340A Method for manufacturing multilayered flexible circuit board
02/08/2012CN102348338A Plate-explosion-preventing air vent structure for aligned and laminated six-layer circuit board
02/08/2012CN102348328A Chip embedding method and chip-embedded circuit board
02/08/2012CN102348327A Printed circuit board
02/08/2012CN102348326A Circuit board
02/08/2012CN102348325A Printed circuit board and method of manufacturing the same
02/08/2012CN102348324A Electronic module with feed through conductor between wiring patterns
02/08/2012CN102348323A Circuit board
02/08/2012CN102348322A Printed circuit board
02/08/2012CN102347315A Ceramic electronic component and wiring board
02/08/2012CN102344645A Epoxy resin composite material and manufacturing method thereof
02/08/2012CN102344567A Modified bismaleimide resin, preparation method thereof and composition containing resin
02/08/2012CN101790282B 印刷线路板 Printed circuit boards
02/08/2012CN101653049B 印刷板组件和方法 Printed board assembly and method
02/08/2012CN101643571B 热固性树脂组合物及用其制成的半固化片与印制电路用层压板 The thermosetting resin composition and a prepreg and a printed circuit board which is made by laminating
02/08/2012CN101580626B 一种高导热无卤难燃树脂组合物及其预浸渍体及涂层物 A highly thermally conductive and non-halogen flame-retardant resin composition of the prepreg and the coating composition
02/08/2012CN101491171B 电路板设备、设有该电路板设备的电子设备及gnd连接方法 Circuit board equipment, an electronic device and the circuit board equipment gnd connection method
02/08/2012CN101370352B 一种印刷电路板及其制作方法和球栅阵列焊盘图案 A printed circuit board and its production method and ball grid array landpattern
02/08/2012CN101363948B 用于电气和光学互连的设备 For electrical interconnect devices and optical
02/08/2012CN101321435B 印刷板上连接器的偏置脚垫的改进 Offset printed board connector pads improvements
02/08/2012CN101316478B 微型飞行器 MAV
02/08/2012CN101308799B 布线基板的连接方法及布线基板 Connecting a wiring board and a wiring board
02/08/2012CN101047159B 多层互连基板、半导体装置及阻焊剂 Multilayer interconnect substrate, a semiconductor device and a solder resist
02/07/2012US8112608 Variable-width memory
02/07/2012US8111520 Semiconductor module
02/07/2012US8111155 Detection and control of pests
02/07/2012US8110920 In-package microelectronic apparatus, and methods of using same
02/07/2012US8110918 Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate
02/07/2012US8110917 Package substrate with a conductive connecting pin
02/07/2012US8110909 Semiconductor package including top-surface terminals for mounting another semiconductor package
02/07/2012US8110754 Multi-layer wiring board and method of manufacturing the same
02/07/2012US8110753 Circuit board assembly
02/07/2012US8110752 Wiring substrate and method for manufacturing the same
02/07/2012US8110751 Semiconductor memory module and electronic component socket for coupling with the same
02/07/2012US8110750 Multilayer printed wiring board
02/07/2012US8110749 Printed wiring board
02/07/2012US8110748 Wiring, display device and method of manufacturing the same
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