| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/21/2012 | US8119928 Multi-layered wiring substrate and method of manufacturing the same |
| 02/21/2012 | US8119927 Wiring board, method for manufacturing the same, and semiconductor package |
| 02/21/2012 | US8119926 Terminal assembly with regions of differing solderability |
| 02/21/2012 | US8119925 Core substrate and printed wiring board |
| 02/21/2012 | US8119924 Wiring board, packaging board and electronic device |
| 02/21/2012 | US8119923 Circuit board |
| 02/21/2012 | US8119922 Dual cavity, high-heat dissipating printed wiring board assembly |
| 02/21/2012 | US8119921 Impedance tuning for circuit board signal path surface pad structures |
| 02/21/2012 | US8119920 Multilayer printed wiring board |
| 02/21/2012 | US8119919 Printed wiring board, method for manufacturing printed wiring board, and electric device |
| 02/21/2012 | US8119918 Printed circuit board and semiconductor package |
| 02/21/2012 | US8119737 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 02/21/2012 | US8119304 Fuel cell with fuel passage layer having a wiring pattern |
| 02/21/2012 | US8119206 Negative coefficient of thermal expansion particles |
| 02/21/2012 | US8117745 Method of using a foldable card as a USB contact |
| 02/21/2012 | US8117743 Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
| 02/21/2012 | CA2516977C Method for high-frequency tuning an electrical device, and a printed circuit board therefor |
| 02/21/2012 | CA2504307C Manufacture of electrochemical sensors by moveable flat screen printing |
| 02/16/2012 | WO2012020818A1 Metal-clad laminated plate |
| 02/16/2012 | WO2012020677A1 Flexible circuit board for repeated bending use, and electronic device and cellular phone using same |
| 02/16/2012 | WO2012020640A1 Metal foil laminate, substrate for mounting led, and light source device |
| 02/16/2012 | US20120039056 Component arrangement and method for production thereof |
| 02/16/2012 | US20120039053 System and method for coupling a battery within an embedded system |
| 02/16/2012 | US20120039050 Electronic device having transmission line pattern embedded in case and method for manufacturing the same |
| 02/16/2012 | US20120038038 Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate |
| 02/16/2012 | US20120037420 Electronic device protection |
| 02/16/2012 | US20120037414 Multilayer printed wiring board and method of manufacturing the same |
| 02/16/2012 | US20120037413 Printed wiring board fabrication method, printed wiring board, multilayer printed wiring board, and semiconductor package |
| 02/16/2012 | US20120037412 Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough |
| 02/16/2012 | US20120037411 Packaging substrate having embedded passive component and fabrication method thereof |
| 02/16/2012 | US20120037410 Thermoplastic resin composition, adhesive film and wiring film using the same |
| 02/16/2012 | US20120037409 Method of manufacturing multilayer printed wiring board and multilayer wiring board obtained thereby |
| 02/16/2012 | US20120037408 Method of repairing probe board and probe board using the same |
| 02/16/2012 | US20120037407 Electronic Apparatus and Method of Manufacturing the Same |
| 02/16/2012 | US20120037406 Method and apparatus for using flex circuit technology to create an electrode |
| 02/16/2012 | US20120037405 Flexible circuit board and method for manufacturing same |
| 02/16/2012 | US20120037404 Packaging substrate having a passive element embedded therein and method of fabricating the same |
| 02/16/2012 | US20120037403 Method for Electrically Conductively Connecting Conductor Tracks in Conductor Carriers and System Comprising such Conductor Carriers |
| 02/16/2012 | DE102010039277A1 Printed circuit board for use in measuring electronic device, has slot in which separate region of plate body is disconnected from region of plate body, where slot facilitates deflexion of separate region concerning region |
| 02/16/2012 | DE102010034156A1 Folienelement Film element |
| 02/16/2012 | DE102010034143A1 Carrier for fastening electrical and electronic components i.e. power LEDs, has second metal film contacted at bottom of recess, where lateral dimension of recess is large than thickness of insulation layer |
| 02/15/2012 | EP2418924A1 Method of manufacturing antenna using sintering of metal and antenna manufactured by the same |
| 02/15/2012 | EP2418923A1 Thermal expansion suppressing member and anti-thermally-expansive member |
| 02/15/2012 | EP2418922A1 Printed circuit board assembly for pots splitters of a VDSL telecommunication system |
| 02/15/2012 | EP2418750A2 Structure of battery disconnection unit for electric vehicle |
| 02/15/2012 | EP2305013B1 Electronic assembly and method for the production thereof |
| 02/15/2012 | EP1875786B1 Method and system of heat conductor |
| 02/15/2012 | CN202145706U 一种连片pcb板 One kind of contiguous pcb board |
| 02/15/2012 | CN202145705U Board fixing mechanism for fixing board on circuit board and electronic device thereof |
| 02/15/2012 | CN202145704U 刚挠结合印制电路板 Rigid-flex printed circuit board |
| 02/15/2012 | CN202145703U 一种柔性线路板 A flexible circuit board |
| 02/15/2012 | CN202145702U 可挠曲电路板 Flexible circuit boards |
| 02/15/2012 | CN202145701U 一种抗变形的pcb电路板 An anti-deformation pcb board |
| 02/15/2012 | CN202145700U 一种带邮票孔的pcb拼装板 Pcb assembled board a hole with a stamp |
| 02/15/2012 | CN202145699U 防静电led铝基板 Antistatic led aluminum plate |
| 02/15/2012 | CN202145665U 切换板 Switch plates |
| 02/15/2012 | CN202144992U 可多方向弯曲的fpc发光装置 Fpc multi-directional light emitting device can be bent |
| 02/15/2012 | CN102356703A Circuit board and mother laminated body |
| 02/15/2012 | CN102356701A Connecting structure, circuit device and electronic apparatus |
| 02/15/2012 | CN102356088A Process for production of phosphorus-atom-containing phenol, novel phosphorus-atom-containing phenol, curable resin composition, cured product thereof, printed circuit board, and semiconductor sealing material |
| 02/15/2012 | CN102355794A Double-layer flexible circuit board |
| 02/15/2012 | CN102355793A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device |
| 02/15/2012 | CN102350825A Process for preparing fluorine-containing high polymer high frequency circuit board material by hydrothermal method |
| 02/15/2012 | CN101965102B 电路板模块 Circuit board module |
| 02/15/2012 | CN101864146B 印刷电路覆铜板用环氧树脂组合物 Printed circuit CCL epoxy resin composition |
| 02/15/2012 | CN101501151B 粘接剂组合物和电路部件的连接结构 Connection structure adhesive composition and the circuit member |
| 02/15/2012 | CN101457045B 导体图案形成用墨水、导体图案以及配线基板 A conductor pattern is formed with ink, the conductor pattern, and the wiring substrate |
| 02/15/2012 | CN101449630B 一种制造印刷电路板的方法及具有堆积微孔的印刷电路板 A method of manufacturing a printed circuit board and having a printed circuit board stacked micropores |
| 02/15/2012 | CN101347052B 印刷配线板的连接方法及连接装置 The connection method of the printed wiring board and the connecting means |
| 02/15/2012 | CN101309874B 无铅和无镉的导电铜厚膜膏 Lead-free and cadmium-free conductive copper thick paste |
| 02/15/2012 | CN101066001B 布线基板及其制造方法以及半导体器件 Wiring board and its manufacturing method and a semiconductor device |
| 02/15/2012 | CN101060757B 用于形成无残余印刷电路板的工艺及其形成的印刷电路板 No residue for forming a printed circuit board and the formation process of a printed circuit board |
| 02/14/2012 | US8116100 Semiconductor device |
| 02/14/2012 | US8116099 Circuit board device, electronic device provided with the same, and GND connecting method |
| 02/14/2012 | US8116098 Base element, base system and method for manufacturing another base system |
| 02/14/2012 | US8116097 Apparatus for electrically coupling a semiconductor package to a printed circuit board |
| 02/14/2012 | US8116093 Printed circuit board and semiconductor module having the same |
| 02/14/2012 | US8116091 Printed circuit board |
| 02/14/2012 | US8116090 Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology |
| 02/14/2012 | US8116088 Semiconductor package and method of forming the same, and printed circuit board |
| 02/14/2012 | US8116084 Method for manufacturing power module substrate, power module substrate, and power module |
| 02/14/2012 | US8116083 Lipstick-type USB device with tubular housing |
| 02/14/2012 | US8115114 Ceramic substrate manufacturing method and ceramic substrate |
| 02/14/2012 | US8115113 Multilayer printed wiring board with a built-in capacitor |
| 02/14/2012 | US8115112 Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates |
| 02/14/2012 | US8115111 Multilayer printed wiring board with filled viahole structure |
| 02/14/2012 | US8115110 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor |
| 02/14/2012 | US8115109 Circuit board and method for jointing circuit board |
| 02/14/2012 | US8115108 Flexible printed circuit board and manufacturing method for the same |
| 02/14/2012 | US8115106 Surface mount device |
| 02/14/2012 | US8115105 Prepreg and its application products for low thermal expansion and low dielectric tangent |
| 02/14/2012 | US8115104 Circuit board with buried conductive trace formed thereon and method for manufacturing the same |
| 02/14/2012 | US8115103 Flexible printed board, electronic apparatus mounted with this, and folding method for flexible printed board |
| 02/14/2012 | US8114714 Electronic device and production method thereof |
| 02/14/2012 | US8113854 Automotive electromechanic relay base with parallel terminals, for use in multiple pins boxes, with fast electric central clamping system |
| 02/14/2012 | CA2470373C Method for making a multilayer module with high-density printed circuits |
| 02/14/2012 | CA2470229C Method for making a non-detachable microcircuit card |
| 02/09/2012 | WO2012018091A1 Liquid composition, and resistor film, resistor element and circuit board using same |
| 02/09/2012 | WO2012017967A1 Metal foil coated with filled resin layer and process for producing metal foil coated with filled resin layer |
| 02/09/2012 | WO2012017909A1 Method for producing printed wiring board, and printed wiring board |