H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
11/2011
11/16/2011	CN202042637U Connector and circuit board using same
11/16/2011	CN202042636U Card connector and circuit board using same
11/16/2011	CN202042374U Electrochemical device, circuit base plate and containing disc
11/16/2011	CN1741706B 布线板 Wiring board
11/16/2011	CN1731907B Flexible lamp strip embedded with serial drive control chip
11/16/2011	CN102246608A Wiring board and method for manufacturing same
11/16/2011	CN102246606A Flexible modular assembly
11/16/2011	CN102246605A Circuit module and method for managing same
11/16/2011	CN102246218A Display panel module and display device
11/16/2011	CN102245827A Fabric, device having fabric and production method for fabric
11/16/2011	CN102244980A Manufacturing method of metal substrate
11/16/2011	CN102244978A Electronic device, power converter, and method for manufacturing electronic device
11/16/2011	CN102244977A Circuit board fixing member
11/16/2011	CN102244976A Bismaleimide and triazine (BT) circuit board alloy plating layer suitable for gold wire bonding
11/16/2011	CN102244975A Printed wiring board and device including printed wiring board
11/16/2011	CN102244974A Hollowed-out FPCB (flexible printed circuit board) and manufacturing method thereof
11/16/2011	CN102244973A Printed circuit board with blind hole structure and manufacturing method thereof
11/16/2011	CN102244972A Circuit board and application thereof
11/16/2011	CN101823151B Waterborne through-hole silver paste and preparation method and application thereof
11/16/2011	CN101803477B Electronic component package and method for producing the same
11/16/2011	CN101735611B Thermosetting resin composition with high heat conductivity, prepreg manufactured by adopting same and copper-clad laminate
11/16/2011	CN101715274B Circuit board and process thereof
11/16/2011	CN101702870B Interconnection method of flexible board and rigid board and system
11/16/2011	CN101692756B Prepreg and its application products for low thermal expansion and low dielectric loss
11/16/2011	CN101690422B High temperature ceramic socket configured to test packaged semiconductor devices
11/16/2011	CN101686609B Circuit board
11/16/2011	CN101668380B Flexible printed circuit board structure
11/16/2011	CN101663925B 电子电路装置 Electronic circuit means
11/16/2011	CN101646305B Method for manufacturing lead on non-conductor substrate
11/16/2011	CN101636036B Flexible circuit board as well as hot-pressed device and method for manufacturing same
11/16/2011	CN101520559B Display panel having noise shielding structure
11/16/2011	CN101518165B Conductor carrier and arrangement comprising a conductor carrier
11/16/2011	CN101489346B Pattern structure of circuit board
11/16/2011	CN101409979B Circuit board and processing method thereof
11/16/2011	CN101353424B Thermoplastic polyimide resin containing active lateral group, flexible copper clad laminate manufactured with the same and manufacturing method thereof
11/16/2011	CN101217851B Printed circuit board and liquid crystal display having the same
11/16/2011	CN101160027B Method of producing circuit board and compound circuit substrates with through-hole plating structure
11/16/2011	CN101146850B Polyimide film
11/16/2011	CN101064294B Circuit device and method for manufacturing circuit device
11/15/2011	US8060665 Integrated circuit input/output interface with empirically determined delay matching
11/15/2011	US8059424 Electronic board incorporating a heating resistor
11/15/2011	US8059423 Enhanced localized distributive capacitance for circuit boards
11/15/2011	US8059422 Thermally enhanced package structure
11/15/2011	US8059420 Surface mountable device
11/15/2011	US8059414 Miniature portable memory device
11/15/2011	US8059384 Printed circuit board reinforcement structure and integrated circuit package using the same
11/15/2011	US8058568 Circuit board and method for fabricating the same
11/15/2011	US8058567 High density package substrate and method for fabricating the same
11/15/2011	US8058566 Packaging substrate structure and manufacturing method thereof
11/15/2011	US8058565 Wiring board, semiconductor device, and method for manufacturing wiring board
11/15/2011	US8058564 Circuit board surface structure
11/15/2011	US8058563 Interposer and method for manufacturing interposer
11/15/2011	US8058562 Wiring substrate and method of manufacturing the same
11/15/2011	US8058561 Circuit board and manufacturing method thereof
11/15/2011	US8058560 Bendable area design for flexible printed circuitboard
11/15/2011	US8058559 Flexible printed circuit board and electronic apparatus
11/15/2011	US8058558 Printed circuit board and manufacturing method thereof
11/15/2011	US8058557 Printed circuit board
11/15/2011	US8057110 Card guide and heatsink assemblies for pluggable electro-optic modules
11/15/2011	US8056221 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
11/15/2011	CA2712949C A radio frequency circuit board topology
11/15/2011	CA2458151C Fatty acid containing fiberglass binder
11/15/2011	CA2458062C Improved water repellant fiberglass binder
11/10/2011	WO2011140141A2 Printed circuit board with embossed hollow heatsink pad
11/10/2011	WO2011139882A2 Method of fabricating micro structured surfaces with electrically conductive patterns
11/10/2011	WO2011139619A1 Semiconductor device package adapter
11/10/2011	WO2011138940A1 Electronic device, cable connection structure, and process for production of electronic device
11/10/2011	WO2011138876A1 Copper foil for printed circuit
11/10/2011	WO2011138865A1 Epoxy resin composition for circuit boards, prepreg, laminate, resin sheet, laminate for printed wiring boards, printed wiring boards, and semiconductor devices
11/10/2011	WO2011138382A1 Circuit board for display and display module with display and circuit board
11/10/2011	WO2011137845A1 Manufacturing method for power supply module circuit board, power supply module and magnetic core thereof
11/10/2011	WO2011137767A1 Heat conducting device and electronic device applying the same
11/10/2011	WO2011119707A3 Etch patterning of nanostructure conductors with metal nanowires
11/10/2011	US20110273859 Electrical apparatus
11/10/2011	US20110273858 Circuit board socket with support structure
11/10/2011	US20110273857 Contact springs for silicon chip packages
11/10/2011	US20110273856 Circuit Board, Electronic Device Including a Circuit Board, and Method of Manufacturing a Circuit Board
11/10/2011	US20110273855 Power and ground vias for power distribution systems
11/10/2011	US20110273853 Computer system with riser card
11/10/2011	US20110273202 Circut board and mehtod for testing component built in the circuit board
11/10/2011	US20110272816 Wiring over substrate, semiconductor device, and methods for manufacturing thereof
11/10/2011	US20110272187 Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module
11/10/2011	US20110272186 Printed circuit board with low propagation skew between signal traces
11/10/2011	US20110272185 Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
11/10/2011	US20110272184 Lead frame and manufacturing method thereof
11/10/2011	US20110272183 (poly)carbonate polyol and carboxyl group-containing polyurethane obtained from the (poly)carbonate polyol
11/10/2011	US20110272182 Carboxyl group-containing polyurethane
11/10/2011	US20110272181 Multilayer Stretchable Cable
11/10/2011	US20110272180 Method for producing a flexible circuit configuration, flexible circuit configuration, and electrical circuit configuration having such a flexible circuit configuration
11/10/2011	US20110272178 Substrate for an electrical device
11/10/2011	US20110272177 Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method
11/10/2011	US20110272176 Pattern electrode manufacturing method and pattern electrode
11/10/2011	US20110271757 Wiring substrate, piezoelectric oscillator, gyrosensor and manufacturing method of wiring substrate
11/10/2011	DE102011017543A1 Elektronische Vorrichtung, Verdrahtungsplatine und Verfahren zur Fertigung der elektrischen Vorrichtung An electronic apparatus wiring board and method for manufacturing the electric device
11/10/2011	DE102010019709A1 Device for electrical interconnection of electrical contact area of e.g. direct copper bonded ceramic substrate, with electrical contacting area of printed circuit board, has contacting region contacting contacting area at or in board
11/10/2011	DE102010019597A1 Verfahren zum Herstellen einer Elektrodenstruktur sowie Elektrodenstruktur für eine neuronale Schnittstelle A method for producing an electrode structure and electrode structure for a neural interface
11/10/2011	DE102010016780A1 Verfahren zur Herstellung einer flexiblen Schaltungsanordnung, flexible Schaltungsanordnung und elektrische Schaltungsanordnung mit einer solchen flexiblen Schaltungsanordnung A process for producing a flexible circuit assembly, flexible circuit arrangement and electrical circuit arrangement having such a flexible circuit arrangement
11/10/2011	DE102010016779A1 Verfahren zur Herstellung einer flexiblen Schaltungsanordnung A method of manufacturing a flexible circuit arrangement
11/10/2011	DE102007035181B4 Verfahren zur Herstellung eines Moduls und Modul A process for preparing a module and module
11/10/2011	DE102006062919A1 Integrierter Dünnschicht-Kondensator mit optimierter Temperaturkennlinie Integrated thin-film capacitor with optimized temperature characteristic

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