Patents for H05K 1 - Printed circuits (98,583)
01/2012
01/25/2012CN102332890A Surface mounted quartz crystal oscillator of PCB (Printed Circuit Board) base and manufacture method thereof
01/25/2012CN101900894B Liquid crystal display module and flexible printed circuit board
01/25/2012CN101794667B Production method of laminated inductance substrate
01/25/2012CN101695221B Technique for accommodating electronic components on a multilayer signal routing device
01/25/2012CN101668385B Delay line suitable for printed circuit board
01/25/2012CN101665616B Liquid composition of polythienyl-based conducting polymer, conducting polymer film and application thereof
01/25/2012CN101568224B Circuit board and electronic device having circuit board
01/25/2012CN101553104B Circuit board with electromagnetic interference preventing structure
01/25/2012CN101522752B Thermosetting resin composition and prepreg and laminate obtained with the same
01/25/2012CN101485237B Circuit board device, method for connecting wiring boards, and circuit substrate module device
01/25/2012CN101478034B Protective circuit board, battery pack, and associated methods
01/25/2012CN101457048B Conductive pattern forming ink, conductive pattern, and wiring substrate
01/25/2012CN101268146B Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
01/25/2012CN101206282B Optical circuit board
01/25/2012CN101164392B Communications jack with printed wiring board having paired coupling conductors
01/24/2012USRE43124 Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel
01/24/2012US8102671 Serial connection external interface riser cards avoidance of abutment of parallel connection external interface memory modules
01/24/2012US8102667 Method and apparatus for spatially optimizing surface mount pads on a ball grid array package
01/24/2012US8102665 Integrated circuit with intra-chip clock interface and methods for use therewith
01/24/2012US8102664 Printed circuit board and method of manufacturing the same
01/24/2012US8102660 Multi-layer printed wiring board, electronic device, and fabrication method of electronic device
01/24/2012US8102659 Flexible printed circuit board and liquid crystal display having the same
01/24/2012US8102657 Single shot molding method for COB USB/EUSB devices with contact pad ribs
01/24/2012US8102235 Coreless printed-circuit-board (PCB) transformers and operating techniques therefor
01/24/2012US8102063 Pad structure with a nano-structured coating film
01/24/2012US8102005 Wiring substrate, semiconductor device and manufacturing method thereof
01/24/2012US8101871 Aluminum bond pads with enhanced wire bond stability
01/24/2012US8101870 Method for manufacturing printed circuit board, printed circuit board, and electronic apparatus
01/24/2012US8101869 Mounting structure, electro-optical device, and electronic apparatus
01/24/2012US8101868 Multilayered printed circuit board and method for manufacturing the same
01/24/2012US8101867 Electroless Ni-P plating method and substrate for electronic component
01/24/2012US8101865 Printed wiring board and a method of production thereof
01/24/2012US8101864 Electronic device substrate and its fabrication method, and electronic device and its fabrication method
01/24/2012US8101863 Printed circuit board
01/24/2012US8100702 Receptacle connector
01/24/2012US8100699 Connector assembly having a connector extender module
01/24/2012CA2524673C Method for mounting an electronic component on a substrate
01/24/2012CA2518618C Polymeric epoxy resin composition
01/24/2012CA2504182C Cooling stations for use in a web printing process for the manufacture of electrochemical sensors
01/23/2012CA2747147A1 Mobile wireless communications device with electrically conductive continuous ring and related methods
01/23/2012CA2747048A1 Mobile wireless communications device with shunt component and related methods
01/19/2012WO2012008260A1 Copper foil complex
01/19/2012WO2012006776A1 Composite material and high frequency circuit substrate manufactured with the composite material and the manufacturing method thereof
01/19/2012WO2011094303A3 hBN INSULATOR LAYERS AND ASSOCIATED METHODS
01/19/2012US20120014080 Electronic device having circuit board with co-layout design of multiple connector placement sites and related circuit board thereof
01/19/2012US20120014078 Electronic Component Structure and Electronic Device
01/19/2012US20120014073 Conductive nanoparticle substrate and method of manufacture
01/19/2012US20120014017 Suspension substrate, suspension, head suspension, hard disk drive, method for manufacturing suspension substrate, and method for testing continuity of suspension
01/19/2012US20120012380 Back Drill Verification Feature
01/19/2012US20120012379 Printed circuit board
01/19/2012US20120012378 Printed circuit board and method of manufacturing the same
01/19/2012US20120012377 Printed circuit board
01/19/2012US20120012376 Assembly, and associated method, for forming a solder connection
01/19/2012US20120012375 Insulating material and printed circuit board having the same
01/19/2012US20120012374 Electrical feedthrough assembly
01/19/2012US20120012373 Submount and Method of Manufacturing the Same
01/19/2012US20120012372 Method and Structure to Improve the Conductivity of Narrow Copper Filled Vias
01/19/2012US20120012371 Manufacturing method for circuit board, and circuit board
01/19/2012US20120012370 Transparent conductive laminate and touch panel therewith
01/19/2012US20120012369 Circuit board
01/19/2012US20120012368 Multilayer wiring board and method for manufacturing the same
01/19/2012US20120012367 Flexible Laminate and Flexible Electronic Circuit Board Formed by using the same
01/19/2012US20120012366 Polyamic acid, polyimide, photosensitive resin composition comprising the same, and dry film manufactured from the same
01/19/2012US20120012365 Thermal flex contact carriers #2
01/19/2012US20120012153 Connection sheet for solar battery cell electrode, process for manufacturing solar cell module, and solar cell module
01/19/2012DE112009002625T5 Beschichtungsmittel, Substrat zum Montieren eines optischen Halbleiterelements unter Verwendung desselben und optische Halbleitervorrichtung Coating agent, the substrate for mounting an optical semiconductor element using the same, and optical semiconductor device
01/19/2012DE102010027149A1 Verbiegbare Metallkernleiterplatte Bendable metal core printed circuit board
01/19/2012DE102010027130A1 Modul und Anordnung zur Messung eines Hochfrequenzstroms durch einen Leiter And module arrangement for measuring a high frequency current through a conductor
01/18/2012EP2408285A1 Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same
01/18/2012EP2408284A1 Assembly, and associated method, for forming a solder connection
01/18/2012EP2408282A1 Module connection in a printed wiring board
01/18/2012EP2408281A1 Connection structure, circuit device, and electronic equipment
01/18/2012EP2408280A2 Electronic device having a circuit board with co-layout design of multiple connector placement sites and related circuit board
01/18/2012EP2408279A1 Bendable metal core PCB
01/18/2012EP2408278A1 Control device
01/18/2012EP2408277A1 Fuse element
01/18/2012EP2407503A1 Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
01/18/2012EP2407084A1 Electric connector for endoscope, endoscope, and method for assembling electric connector
01/18/2012EP2407013A1 Electrically conductive pins for microcircuit tester
01/18/2012EP2406965A2 Hybrid acoustic/electric signal converting device
01/18/2012EP2406605A1 Method for monitoring the temperature-time-load of at least one printed circuit board and/or one component on a printed circuit board, and a respective temperature-time-indicator and application thereof
01/18/2012EP2046104B1 Circuit connection material, circuit member connecting structure and method of connecting circuit member
01/18/2012EP1774453B1 System and method for mounting an image capture device on a flexible substrate
01/18/2012EP1651806B1 Cellulosic fibers having enhanced reversible thermal properties and methods of forming thereof
01/18/2012CN202121908U Movable third generation telecommunication (3G) module converter for vehicle-mounted device
01/18/2012CN202121907U Movable 3G module converter for vehicle-loaded device
01/18/2012CN202121873U Pad structure of circuit board
01/18/2012CN202121872U Copper foil for printed circuit board
01/18/2012CN202121871U Foldable circuit board
01/18/2012CN202121870U Circuit board
01/18/2012CN202121869U Spacing-column structure of circuit board
01/18/2012CN202121868U Copper foil for printed circuit board
01/18/2012CN202121867U Double-sided copper clad laminate
01/18/2012CN202121866U Copper foil substrate of flexible circuit board
01/18/2012CN202121865U Copper foil base plate used for flexible printed circuit
01/18/2012CN202121864U Flexible circuit board
01/18/2012CN202121863U Anti-interference flexible printed circuit
01/18/2012CN202121862U Flexible circuit board used for printer
01/18/2012CN202121861U Enhanced flexible circuit board
01/18/2012CN202121860U Flexible circuit board used for precision electronic device