Patents for H05K 1 - Printed circuits (98,583)
01/2012
01/31/2012US8107253 Printed circuit board
01/31/2012US8107249 Display panel apparatus
01/31/2012US8107248 Flexible device, flexible pressure sensor
01/31/2012US8106677 Signal transmitting device suited to fast signal transmission
01/31/2012US8106516 Wafer-level chip scale package
01/31/2012US8106507 Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket
01/31/2012US8106310 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
01/31/2012US8106309 Flexible printed circuit, display device including the same, and manufacturing method thereof
01/31/2012US8106308 Printed circuit board for package and manufacturing method thereof
01/31/2012US8106307 Substrate structure and electronic apparatus
01/31/2012US8106306 Ceramic multi-layer circuit substrate and manufacturing method thereof
01/31/2012US8106305 Print circuit board with high insulated region, method of manufacturing thereof, and print circuit board assembly thereof
01/31/2012US8106304 Mounting structure of electronic component
01/31/2012US8106303 Printed wiring board including a thermal land for supressing heat dissipation
01/31/2012US8106302 Circuit board of communication product and manufacturing method thereof
01/31/2012US8105690 Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
01/31/2012CA2557376C Method of securing an electrical sub-circuit assembly to a printed circuit board
01/31/2012CA2549568C Liquid or gas sensor and method
01/26/2012WO2012012360A1 Printed circuit board for telecommunication modules
01/26/2012WO2012011916A1 Double-folded flexible printed circuit board for slider devices
01/26/2012WO2012011701A2 Radiant heat circuit board and method for manufacturing the same
01/26/2012WO2012011607A1 Process for production of polyimide film laminate, and polyimide film laminate
01/26/2012WO2012011526A1 Band-pass filter module and module substrate
01/26/2012WO2012011491A1 Conductive film
01/26/2012WO2012011398A1 Conductive resin composition
01/26/2012WO2012011230A1 Method for filling through hole of substrate with metal and substrate
01/26/2012WO2012011193A1 Connection structure between flexible substrate and partner member
01/26/2012WO2012011165A1 Multilayer printed circuit board and manufacturing method therefor
01/26/2012WO2012011046A1 Optical interconnects in cooling substrates
01/26/2012WO2012009999A1 Four-layered printed circuit board with vias and mobile terminal use it
01/26/2012WO2012009842A1 Method of manufacturing single sided circuit board by using carrier glue film and juxtaposition flat wiring
01/26/2012WO2012009841A1 Single-sided circuit board made by bonding juxtaposition flat wiring with thermosetting glue film
01/26/2012WO2012009840A1 Single-side circuit board with flat wires arranged in parallel and method for making the same
01/26/2012WO2012009831A1 Wiring board and manufacturing method thereof
01/26/2012US20120021621 Method for manufacturing multilayered flexible circuit board
01/26/2012US20120020416 Flexible cable and transmission system
01/26/2012US20120020096 Light Module, Composite Circuit Board Device Used Therein, and Assembling Method Thereof
01/26/2012US20120020042 Noise suppressor for semiconductor packages
01/26/2012US20120020041 Device and manufacturing method of the same
01/26/2012US20120020040 Package-to-package stacking by using interposer with traces, and or standoffs and solder balls
01/26/2012US20120020033 Skin-Safe Conductive Ink and Method for Application on the Body
01/26/2012US20120020018 Component for a notebook computer for receiving external antennas
01/26/2012US20120019106 Ultrasonic array transducer, associated circuit and method of making the same
01/26/2012US20120018864 Bonding structure and method
01/26/2012US20120018772 Light emitting device and method of manufacturing the light emitting device
01/26/2012US20120018210 Printed circuit board
01/26/2012US20120018209 Printed circuit board
01/26/2012US20120018208 Coupler apparatus
01/26/2012US20120018207 Circuit substrate and fabricating process of circuit substrate
01/26/2012US20120018206 Solid electrolytic capacitor
01/26/2012US20120018205 Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board
01/26/2012US20120018204 Ceramic electronic component and wiring board
01/26/2012US20120018203 Electronic module with embedded jumper conductor
01/26/2012US20120018202 Circuit device
01/26/2012US20120018201 Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof, and conductive foil provided with insulating layer
01/26/2012US20120018200 Transparent conductive film for touch panel and method for manufacturing the same
01/26/2012US20120018199 Printed circuit board
01/26/2012US20120018198 Electronic component and printed wiring board
01/26/2012US20120018197 Novel ductile metal foil laminate and method for producing the same
01/26/2012US20120018196 Flexible printed circuit board with waterproof structure
01/26/2012US20120018195 Printed circuit board
01/26/2012US20120018194 Multilayer wiring board and manufacturing method thereof
01/26/2012US20120018193 Multi layer circuit board and method of manufacturing the same
01/26/2012DE10357789B4 Leistungs-Halbleitervorrichtung Power semiconductor device
01/26/2012DE102010038294A1 Elektronische Baugruppe mit einem von einer Vergussmasse umschlossenen Bauteil und Verfahren zu deren Herstellung Electronic assembly with a space enclosed by a casting compound component and processes for their preparation
01/26/2012DE102004062635B4 Elektrische Baugruppe mit Abstandshaltern zwischen mehreren Schaltungsträgern The electrical assembly with spacers between multiple circuit boards
01/25/2012EP2410827A1 Circuit board and mother laminated body
01/25/2012EP2410826A1 Flexible printed circuit board with waterproof structure
01/25/2012EP2410825A1 Printed circuit board for telecommunication modules
01/25/2012EP2410824A2 Porous film and layered product including porous film
01/25/2012EP2410565A1 Component to connection to an antenna
01/25/2012EP2410473A1 Article with an electromagnetic-coupling module
01/25/2012EP2409979A1 Process for production of phosphorus-atom-containing phenol, novel phosphorus-atom-containing phenol, curable resin composition, cured product thereof, printed circuit board, and semiconductor sealing material
01/25/2012EP2409662A2 Electrosurgical systems and printed circuit boards for use therewith
01/25/2012EP2408836A2 Liquid coverlays for flexible printed circuit boards
01/25/2012EP1553519B1 Adapter, memory card, and memory card module
01/25/2012EP1550361B1 Three-dimensional electronic module
01/25/2012EP1520454B1 Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof
01/25/2012CN202127549U Plugging device for PCB (Printed Circuit Board)
01/25/2012CN202127548U Digital television circuit board
01/25/2012CN202127547U Ceramic interconnecting high-density circuit board
01/25/2012CN202127546U Circuit board for tricolor high-power energy-saving lamp
01/25/2012CN202127545U Circuit board
01/25/2012CN202127544U Circuit board
01/25/2012CN202127543U Circuit boards with grounding holes
01/25/2012CN202127038U Substrate for light-emitting diode (LED) suitable for stamping process
01/25/2012CN1938380B Thermosetting resin composition and multilayered printed wiring board comprising the same
01/25/2012CN1822746B Printed board
01/25/2012CN1739323B Multilayer wiring board and its manufacturing method
01/25/2012CN102334391A Multi-layer circuit carrier and method for the production thereof
01/25/2012CN102334390A Printed circuit board module
01/25/2012CN102334389A 连接单元 Connection unit
01/25/2012CN102334184A 电子电路装置 Electronic circuit means
01/25/2012CN102333836A Adhesive resin compositions, and laminates and flexible printed wiring boards using same
01/25/2012CN102333835A Adhesive resin compositions, and laminates and flexible printed wiring boards using same
01/25/2012CN102333735A Glass composition for glass fiber, glass fiber, and sheet-shaped material of glass fiber
01/25/2012CN102333428A Electronic fixing device
01/25/2012CN102333415A PCB (printed circuit board) and base station communication equipment
01/25/2012CN102333414A Heat dissipation structure, manufacturing method for the same and electronic device with the same
01/25/2012CN102333413A Printed circuit board