Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
03/2012
03/06/2012US8129628 Multilayer wiring board and method for manufacturing multilayer wiring board
03/06/2012US8129627 Circuit board having semiconductor chip
03/06/2012US8129626 Multilayer wiring substrate with a reinforcing layer for preventing a warp
03/06/2012US8129625 Multilayer printed wiring board
03/06/2012US8129624 Pressure sensor
03/06/2012US8129623 Resin film, adhesive sheet, circuit board, and electronic apparatus
03/06/2012US8129456 Flame retardant compositions with a phosphorated compound
03/06/2012US8127997 Method for mounting an electronic component on a substrate
03/06/2012US8127440 Method of making bondable flexible printed circuit
03/06/2012CA2504223C Ink composition for use in a continuous web process for the manufacture of electrochemical sensors
03/01/2012WO2012026871A1 A foldable card with usb plug
03/01/2012WO2012026628A1 Film for conductive surface mount terminal and method for manufacturing same
03/01/2012WO2012026470A1 Circuit connecting material and method for connecting circuit members using same
03/01/2012WO2012026454A1 Capacitor holder
03/01/2012WO2012026418A1 Semiconductor device
03/01/2012WO2012026012A1 Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
03/01/2012WO2012025446A1 Method for populating a circuit board with a plurality of components and electrical circuit having a circuit board and a plurality of components mounted thereon
03/01/2012WO2012025100A1 Multi-level circuit board for high-frequency applications
03/01/2012WO2012005434A3 Microphone
03/01/2012US20120052695 Electrical connector assembly
03/01/2012US20120051017 Electronic Component and Method of Manufacturing the Same
03/01/2012US20120051016 Semiconductor socket
03/01/2012US20120051008 Circuit board with via hole and electronic device equipped with the same
03/01/2012US20120051005 Stretchable electronic device
03/01/2012US20120051004 Electronic Apparatus and Flexible Printed Circuit Board
03/01/2012US20120051001 Printed circuit board
03/01/2012US20120051000 Leadframe package with integrated partial waveguide interface
03/01/2012US20120050190 Display apparatus
03/01/2012US20120049384 Buffer Layer to Enhance Photo and/or Laser Sintering
03/01/2012US20120049343 Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method
03/01/2012US20120048703 Printed circuit board and method for avoiding electromagnetic interference
03/01/2012US20120048611 Embedded multi-layer circiut board and noise suppression method
03/01/2012US20120048610 Printed circuit board
03/01/2012US20120048609 Suspension substrate, suspension, and manufacturing method of suspension substrate
03/01/2012US20120048608 Circuit boards
03/01/2012US20120048607 Electronic device
03/01/2012US20120048606 Adhesive composition, film-like adhesive, and connection structure for circuit member
03/01/2012US20120048605 Method for controlling warpage within electronic products and an electronic product
03/01/2012US20120048604 Glass Interposer Panels And Methods For Making The Same
03/01/2012US20120048603 Printed circuit board and method for manufacturing same
03/01/2012US20120048602 Method of manufacturing ceramic substrate for probe card and ceramic substrate for probe card
03/01/2012US20120048601 Printed circuit board
03/01/2012US20120048600 Circuit Apparatus Having a Rounded Differential Pair Trace
03/01/2012US20120048599 Method and Device for Differential Signal Channel Length Compensation in Electronic System
03/01/2012US20120048598 Adhesive resin composition, and laminate and flexible printed wiring board using the same
03/01/2012US20120048597 Bundled flexible cable with water resistant structure
03/01/2012US20120048595 Wiring board and method of manufacturing a semiconductor device
03/01/2012US20120048594 Photosensitive composition, photosensitive film, photosensitive laminate, method of forming a permanent pattern, and printed board
03/01/2012DE102010035488A1 Verfahren zur Herstellung einer keramischen Grünfolie A process for producing a ceramic green sheet
03/01/2012DE102010035453A1 Mehrebenenleiterplatte für Hochfrequenz-Anwendungen Multilayer PCB for high frequency applications
03/01/2012CA2807751A1 Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
02/2012
02/29/2012EP2424339A1 Electronic component and method of manufacturing the same
02/29/2012EP2424338A1 Multilayer printed wiring boards with holes requiring copper wrap plate
02/29/2012EP2424033A1 Mobile wireless communications device having a frequency selective grounding circuit
02/29/2012EP2424005A1 Battery pack comprising a protection circuit module
02/29/2012EP2423955A1 Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein
02/29/2012EP2422590A1 Circuit board base material for high frequency applications, circuit board for high frequency applications and housing
02/29/2012EP2422589A2 Lighting electronic structure
02/29/2012EP2422300A2 Miniature rfid tag
02/29/2012EP2201643B1 Method for producing a vehicle antenna device
02/29/2012EP2178353B1 Circuit module, and electronic device using the module
02/29/2012EP2083019B1 Photocurable/thermosetting resin composition and obtained dry film
02/29/2012EP2057873B1 Sub-mezzanine structure for printed circuit card assemblies
02/29/2012EP2040347B1 A busbar device and circuit board mounted with the same
02/29/2012EP1812967B1 Off-width pitch for improved circuit card routing
02/29/2012EP1795336B1 Electrolytic copper foil with carrier foil furnished with primer resin layer and process for producing the same
02/29/2012CN202153809U 一种带导通孔的铝基电路板 An aluminum board with vias
02/29/2012CN102365908A Connector with liquid dielectric reservoir
02/29/2012CN102365907A High speed interconnect cable assembly
02/29/2012CN102365738A Assembly of optoelectronic components
02/29/2012CN102365733A Process for producing metallized substrate, and metallized substrate
02/29/2012CN102365690A Photosensitive electrically conductive paste and electrode pattern
02/29/2012CN102365310A Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
02/29/2012CN102365165A Metal foil with electric resistance film and production method therefor
02/29/2012CN102364996A Transplantation structure for connected printed circuit boards
02/29/2012CN102364995A Golden finger for flexible printed circuit board (FPC)
02/29/2012CN102364383A Liquid crystal display panel, flexible circuit board and liquid crystal display device
02/29/2012CN102363891A Double photoelectrolysis copper foil replacing rolled copper foil and used for production of flexible copper clad laminate, and production process of double photoelectrolysis copper foil
02/29/2012CN101959362B Circuit board assembly
02/29/2012CN101932207B Multilayer PCB (Printed Circuit Board) and design method thereof
02/29/2012CN101843179B Device having at least two circuit boards
02/29/2012CN101790279B Composite reinforcing film and manufacturing method thereof
02/29/2012CN101777547B Bonding structure of pattern electrodes using ultra-violet curing agent including naturally curing agent
02/29/2012CN101546053B Mounting structure, electro-optical device, and electronic apparatus
02/29/2012CN101516161B Manufacturing method of projection PCB circuit board
02/29/2012CN101340773B Wired circuit board and producing method thererof
02/29/2012CN101228667B Composite porous resin base material and method for manufacturing same
02/29/2012CN101143500B Laminate and use thereof
02/28/2012US8125795 Circuit module and circuit board assembly having surface-mount connector
02/28/2012US8125794 Multilayer printed wiring board and electronic device using the same
02/28/2012US8125790 OC2 oriented connections 2
02/28/2012US8125786 Memory card
02/28/2012US8125632 Fabrication method of semiconductor integrated circuit device
02/28/2012US8125488 Computer system having a combined GPU-video BIOS package
02/28/2012US8125087 High-density flip-chip interconnect
02/28/2012US8125065 Elimination of RDL using tape base flip chip on flex for die stacking
02/28/2012US8124886 Membrane circuit board
02/28/2012US8124884 Printed circuit board
02/28/2012US8124883 Ceramic multilayer substrate and method for manufacturing the same
02/28/2012US8124882 Multilayer printed wiring board
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