| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/07/2011 | CN101661945B 光学器件 Optics |
| 12/07/2011 | CN101646307B 一种fpc制作方法及fpc One kind of production methods and fpc fpc |
| 12/07/2011 | CN101599583B 芯片卡卡持结构及应用其的电路板组件 Chip card holding structure and application of its circuit board assembly |
| 12/07/2011 | CN101562953B 多层基板及其制造方法 Multi-layer substrate and manufacturing method thereof |
| 12/07/2011 | CN101483973B 补强板及包括该补强板的补强软性电路板 Reinforcement plate and the reinforcing plate includes a flexible circuit board reinforcement |
| 12/07/2011 | CN101461293B 电路载体及其制造方法 Circuit carrier and its manufacturing method |
| 12/07/2011 | CN101403856B 组合物、干膜、固化物和印刷线路板 Composition, dry film, cured and printed wiring board |
| 12/07/2011 | CN101374391B 多层布线基板 A multilayer wiring board |
| 12/07/2011 | CN101238528B 导电复合材料及制备方法、包括导电复合材料的存储器件 Conductive composite material and preparation methods, including conductive composites memory devices |
| 12/07/2011 | CN101236946B 布线板和半导体器件 Wiring boards and semiconductor devices |
| 12/07/2011 | CN101135753B 光组件 Optical Components |
| 12/06/2011 | US8073295 Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly |
| 12/06/2011 | US8072775 Printed circuit board |
| 12/06/2011 | US8072774 Substrate including wiring for transmitting signal, apparatus and system including the substrate |
| 12/06/2011 | US8072769 Component-embedded module and manufacturing method thereof |
| 12/06/2011 | US8072768 Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor |
| 12/06/2011 | US8072765 Electro-optical apparatus, flexible printed circuit board, manufacturing method for electro-optical apparatus, and electronic equipment |
| 12/06/2011 | US8072764 Multi-part substrate assemblies for low profile portable electronic devices |
| 12/06/2011 | US8072709 Flex cable for a hard disk drive having an interrogation trace |
| 12/06/2011 | US8072096 Integrated circuit with multiple independent power supply zones |
| 12/06/2011 | US8072046 Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode |
| 12/06/2011 | US8071891 Interconnect structure |
| 12/06/2011 | US8071890 Electrically conductive structure of circuit board and circuit board using the same |
| 12/06/2011 | US8071889 Electronic device with EMI screen and packing process thereof |
| 12/06/2011 | US8071888 Electrically conductive ink, electrically conductive circuit, and non-contact-type medium |
| 12/06/2011 | US8071887 Printed circuit board and method for manufacturing same |
| 12/06/2011 | US8071886 Wired circuit board having a semiconductive grounding layer and producing method thereof |
| 12/06/2011 | US8071885 Printed circuit board |
| 12/06/2011 | US8071884 Flexible printed circuit board having curved edge |
| 12/06/2011 | US8071883 Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same |
| 12/06/2011 | US8071882 Metal base circuit board, LED, and LED light source unit |
| 12/06/2011 | US8071881 Wiring board, method for manufacturing same and semiconductor device |
| 12/06/2011 | US8071271 Conductive film and method for producing the same |
| 12/06/2011 | US8070932 Insulating layer within circuit board has non-circuit area free of circuit layout; openings are formed therein; patterned circuit layer is formed on insulating layer; metal identifiable information is disposed in openings; product status of board can be traced, identified via metal patterned information |
| 12/06/2011 | US8070496 Contact terminal unit and socket connector incorporated with the same contact terminal units |
| 12/06/2011 | US8069560 Method of manufacturing multilayer wiring board |
| 12/06/2011 | US8069558 Method for manufacturing substrate having built-in components |
| 12/06/2011 | DE202011108052U1 Verbindungselement Connecting element |
| 12/01/2011 | WO2011149222A2 Hybrid acoustic/electric signal converting device |
| 12/01/2011 | WO2011149097A1 Multi-chip wiring board and process for producing same, and wiring board and process for producing same |
| 12/01/2011 | WO2011149065A1 Circuit board and electronic device using the same |
| 12/01/2011 | WO2011148915A1 Module substrate and method for manufacturing same |
| 12/01/2011 | WO2011148805A1 Laminate for circuit boards and metal-based circuit boards |
| 12/01/2011 | WO2011148615A1 Substrate with built-in component |
| 12/01/2011 | WO2011148532A1 Flexible circuit board |
| 12/01/2011 | WO2011147284A1 Ceramic printed circuit board structure |
| 12/01/2011 | US20110294308 Substrate and ic socket |
| 12/01/2011 | US20110292629 Receiving apparatus |
| 12/01/2011 | US20110292623 Methods for assembling electronic devices by internally curing light-sensitive adhesive |
| 12/01/2011 | US20110292622 Method for electric circuit deposition |
| 12/01/2011 | US20110292621 Grounded lid for micro-electronic assemblies |
| 12/01/2011 | US20110292296 Television apparatus, electronic device, and circuit board structure |
| 12/01/2011 | US20110291968 Transparent electrically conductive substrate |
| 12/01/2011 | US20110291809 Drug Delivery Management System |
| 12/01/2011 | US20110291253 Lead frame, electronic component including the lead frame, and manufacturing method thereof |
| 12/01/2011 | US20110291032 Electromagnetic shielding composition, electromagnetic shielding device, anti-electrostatic device and method of manufacturing electromagnetic shielding structure |
| 12/01/2011 | US20110290549 Wiring board, wiring board manufacturing method, and via paste |
| 12/01/2011 | US20110290548 Method for manufacturing insulated conductive pattern and laminate |
| 12/01/2011 | US20110290547 Electrode structure of multiple dielectric island layer and manufacturing method thereof |
| 12/01/2011 | US20110290546 Printed circuit board having electronic component and method for manufacturing thereof |
| 12/01/2011 | US20110290545 Through wiring board and method of manufacturing the same |
| 12/01/2011 | US20110290544 Printed wiring board and manufacturing method of printed wiring board |
| 12/01/2011 | US20110290543 Method for producing wiring board and wiring board |
| 12/01/2011 | US20110290542 Ceramic electronic component and method for manufacturing the same |
| 12/01/2011 | US20110290541 Flexible flat cable |
| 12/01/2011 | US20110290540 Embedded printed circuit board and method of manufacturing the same |
| 12/01/2011 | US20110290539 Pressure sensor |
| 12/01/2011 | US20110290538 Connecting structure and adhesion method of pcb using anisotropic conductive film, and method for evaluating connecting condition using the same |
| 12/01/2011 | US20110290537 Multilayer circuit substrate |
| 12/01/2011 | US20110290536 Wiring substrate |
| 12/01/2011 | US20110290535 Wiring substrate and method for manufacturing wiring substrate |
| 12/01/2011 | US20110290534 Printed circuit board |
| 12/01/2011 | DE102011076319A1 Leiterplattensystem für Kraftfahrzeug-Stromrichter Board system for automotive power converter |
| 12/01/2011 | DE102005042083B4 Chipkartenmodul und Verfahren zur Herstellung eines Chipkartenmoduls Chip card module and method of producing a smart card module |
| 11/30/2011 | EP2391192A1 Multilayer circuit substrate |
| 11/30/2011 | EP2391191A1 Interconnection device for electronic circuits, in particular hyperfrequency electronic circuits |
| 11/30/2011 | EP2390277A1 (poly)carbonate polyol and carboxyl group-containing polyurethane using the (poly)carbonate polyol as starting material |
| 11/30/2011 | EP2389535A1 Light band and method for producing a light band |
| 11/30/2011 | EP1641096B1 Electric junction box and its assembling process |
| 11/30/2011 | CN202059688U 一种副pcb与主pcb不共面的车载电器pcb新结构 A new structure of the electrical pcb pcb with the main pcb vice non-coplanar |
| 11/30/2011 | CN202059687U 具有副板的电路板 A circuit board having a sub-plate |
| 11/30/2011 | CN202059686U 具有防止手指半孔平孔的软性印刷线路板 Preventing fingers half-well flat flexible printed circuit board holes |
| 11/30/2011 | CN202059685U 一种能改善板体柔软度的柔性线路板 A flexible circuit board can improve softness plate |
| 11/30/2011 | CN202059684U Circuit board using solder paste as jumper element |
| 11/30/2011 | CN202059683U 十字贴面成型焊接结构 Cross veneer forming welded structures |
| 11/30/2011 | CN202059682U Printed circuit board |
| 11/30/2011 | CN202059681U 一种手指位不易变形的柔性印刷线路板 Bit of a flexible printed circuit board fingers easily deformed |
| 11/30/2011 | CN202059680U 一种具有防撕裂功能的柔性印刷线路板 Flexible printed circuit board having a tear function |
| 11/30/2011 | CN202059679U 具有防止管位孔易被撕裂的柔性印刷线路板 Preventing tube bore easily torn bits of flexible printed circuit boards |
| 11/30/2011 | CN202059678U 一种新型柔性印刷电路 A novel flexible printed circuit |
| 11/30/2011 | CN202059677U 一种防积水型柔性印刷电路板 An anti-water type flexible printed circuit board |
| 11/30/2011 | CN202059676U 一种多层印制线路板 A multi-layer printed circuit boards |
| 11/30/2011 | CN202059675U 一种印制线路板 One kind of printed circuit boards |
| 11/30/2011 | CN202059674U 一种具有基板层的印制线路板 A printed wiring board having a substrate layer |
| 11/30/2011 | CN202059673U 用于驻极体话筒的线路板 Electret microphone for PCB |
| 11/30/2011 | CN202059672U 一种pcb板结构 One kind pcb board structure |
| 11/30/2011 | CN202059671U 一种新型led线路板 A new board led |
| 11/30/2011 | CN202059670U Circuit board |
| 11/30/2011 | CN202059669U Circuit board |
| 11/30/2011 | CN202059668U 电压兼容的软性线路板 Voltage compatible flexible circuit boards |