H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
12/2011
12/20/2011	US8081480 Fixing module and case having the fixing module
12/20/2011	US8081047 Multi-band circuit with first and second signal branches
12/20/2011	US8080741 Printed circuit board
12/20/2011	US8080740 Printed circuit board and method of manufacturing the same
12/20/2011	US8080739 Signal connecting component
12/20/2011	US8080738 Printed circuit having ground vias between signal vias
12/20/2011	US8080737 Ceramic substrate, method of manufacturing the same, and electrical device using the same
12/20/2011	US8080736 Non-planar microcircuit structure and method of fabricating same
12/20/2011	US8079142 Printed circuit board manufacturing method
12/20/2011	CA2578584C Laminate composition for producing reduced curl flat thin core laminate
12/20/2011	CA2504311C Preconditioning of a substrate in a continuous process for manufacture of electrochemical sensors
12/20/2011	CA2489385C Polyester-type formaldehyde free insulation binder
12/20/2011	CA2461338C Low viscosity precursor compositions and methods for the deposition of conductive electronic features
12/20/2011	CA2460840C Thin electronic label and method for making same
12/16/2011	DE202011105817U1 Mehrlagige elektrische Leiterplatte Multi-layer electrical circuit board
12/15/2011	WO2011155562A1 Flow channel member, heat exchanger using same, and electronic component device
12/15/2011	WO2011155340A1 Flexible printed wiring board
12/15/2011	WO2011154478A1 Electronic card programmed with an external programming device
12/15/2011	WO2011127905A8 Ion-sensitive sensor element
12/15/2011	WO2011109389A3 Thermal sensor device with average temperature and hot spot feedback
12/15/2011	US20110305852 Electronic circuit substrate
12/15/2011	US20110304999 Interposer-on-Glass Package Structures
12/15/2011	US20110304998 Package Substrate
12/15/2011	US20110304997 Printed wiring board, electronic device, and printed wiring board manufacturing method
12/15/2011	US20110304995 Television apparatus and electronic device
12/15/2011	US20110304994 Conductive via structures for routing porosity and low via resistance, and processes of making
12/15/2011	US20110304993 Circuit module
12/15/2011	US20110304991 Thermally enhanced electronic package
12/15/2011	US20110304990 Heat-radiating substrate and method of manufacturing the same
12/15/2011	US20110304554 Keypad stiffener and method of manufacture
12/15/2011	US20110304059 Circuit board, circuit board assembly, and semiconductor device
12/15/2011	US20110304026 Via and method of via forming and method of via filling
12/15/2011	US20110303454 Laminated circuit board and board producing method
12/15/2011	US20110303453 Laminated circuit board and board producing method
12/15/2011	US20110303452 Electromagnetic bandgap structure and printed circuit board
12/15/2011	US20110303451 Multilayer printed wiring board
12/15/2011	US20110303450 Mounting structure, electronic component, circuit board, board assembly, electronic device, and stress relaxation member
12/15/2011	US20110303449 Packaging structure, printed circuit board assembly and fixing method
12/15/2011	US20110303448 Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder
12/15/2011	US20110303447 Low profile tape structures
12/15/2011	US20110303446 Epoxy resin composition, and prepreg and printed circuit board using the same
12/15/2011	US20110303445 Printed Circuit Board With Reduced Dielectric Loss
12/15/2011	US20110303444 Laminated circuit board, bonding sheet, laminated-circuit-board producing method, and bonding -sheet producing method
12/15/2011	US20110303443 Mount structure, electronic apparatus, stress relieving unit, and method of manufacturing stress relieving unit
12/15/2011	US20110303442 Substrate strip with wiring and method of manufacturing the same
12/15/2011	US20110303441 Board reinforcing structure, board assembly, and electronic device
12/15/2011	US20110303440 Hybrid heat-radiating substrate and method of manufacturing the same
12/15/2011	US20110303439 Adhesive resin compositions, and laminates and flexible printed wiring boards using same
12/15/2011	US20110303438 Composition for Polyimide Resin, and Polyimide Resin Made of the Composition for Polyimide Resin
12/15/2011	US20110303437 Heat-radiating substrate and method of manufacturing the same
12/15/2011	US20110302777 Electronic Component Protection Device Panel
12/15/2011	DE112006000519B4 Integrierter Dünnschicht-Kondensator mit optimierter Temperaturkennlinie Integrated thin-film capacitor with optimized temperature characteristic
12/15/2011	DE10213648B4 Leistungshalbleitermodul The power semiconductor module
12/15/2011	DE102011076749A1 Silbernanopartikelzusammensetzung, umfassend Lösungsmittel mit spezifischen Hansen-Löslichkeitsparametern Silver nanoparticles composition comprising solvent with specific Hansen solubility parameters
12/15/2011	DE102011007219A1 Halbleitereinrichtung und Herstellungsverfahren zur Herstellung einer Halbleitereinrichtung A semiconductor device and manufacturing method for manufacturing a semiconductor device
12/15/2011	DE102010029868A1 Transmission control unit for use in motor car, has pressure sensor permanently arranged at support plate without carrier housing portion using support member, where support member is contacted with through-hole of support plate
12/15/2011	DE102010016288B4 Elektronische Baueinheit und Weltraumfahrzeug damit Electronic assembly and spacecraft so that
12/15/2011	DE102006058000B4 Platinenanordnung Board assembly
12/14/2011	EP2395821A1 Printed wiring board, electronic device, and printed wiring board manufacturing method
12/14/2011	EP2395820A1 Board reinforcing structure, board assembly, and electronic device
12/14/2011	EP2395598A1 Coaxial waveguide microstructures and methods of formation
12/14/2011	EP2394499A1 Electro-optical control or regulation device and method for exchanging control or regulation signals
12/14/2011	EP1954111B1 Process for producing multilayer ceramic substrate
12/14/2011	EP1474091B1 Blister pack system
12/14/2011	EP1433220B1 Inverted coplanar waveguide coupler with integral microstrip connection ports
12/14/2011	EP1372364B1 Method of manufacturing printed circuit boards
12/14/2011	CN202077266U 高散热多层式复合基板 High heat multi-layered composite substrate
12/14/2011	CN202077265U Circuit board
12/14/2011	CN202077264U Combined type circuit board
12/14/2011	CN202077263U 一种无沉铜线路板 A non-PTH PCB
12/14/2011	CN102282918A 布线基板、布线基板的制造方法、以及通路膏糊 A printed circuit board, method of manufacturing a wiring board, and via pastes
12/14/2011	CN102282213A 用于柔性印刷电路板的聚酰胺膜 Polyamide film for flexible printed circuit boards
12/14/2011	CN102282192A 可溶性酰亚胺骨架树脂、可溶性酰亚胺骨架树脂溶液组合物、固化性树脂组合物及其固化物 Soluble imide skeleton resin, a soluble polyimide resin solution composition of the skeleton, the curable resin composition and a cured product
12/14/2011	CN102281748A Emi噪声屏蔽板 Emi noise shielding plate
12/14/2011	CN102281715A 板加强结构、板组件、以及电子装置 Plate reinforcing structure, the plate assembly, and an electronic device
12/14/2011	CN102281714A 印刷电路板 A printed circuit board
12/14/2011	CN102281713A 印刷电路板及电子设备 Printed circuit boards and electronic equipment
12/14/2011	CN102281712A 叠层电路基板、粘结片及它们的制造方法 Laminated circuit substrate, the adhesive sheet and manufacturing method thereof
12/14/2011	CN102281711A 叠层电路基板以及基板制造方法 And a laminated circuit board substrate manufacturing method
12/14/2011	CN102281710A 焊垫结构 Pad structure
12/14/2011	CN102281709A 一种手机和pcb板组件以及pcb板的螺母结构 A mobile phone and pcb board assembly pcb board structure and nuts
12/14/2011	CN102281708A 基于交指电容电磁带隙结构的电路板 Interdigital capacitor based EBG board
12/14/2011	CN102281707A 电路模块 Circuit module
12/14/2011	CN102281706A 防锡珠印刷模板开孔结构 Anti-tin beads stencil aperture structure
12/14/2011	CN102281705A Fpc电镀制程底部结构 Fpc bottom plating process structure
12/14/2011	CN102281704A 配线基板 Wiring board
12/14/2011	CN102281703A 层叠电路基板以及基板制造方法 And a multilayer circuit board substrate manufacturing method
12/14/2011	CN102281702A 基板布局与其形成方法 Its method of forming the substrate layout
12/14/2011	CN102281701A 一种led灯上的立体拉伸螺旋状线路板及其制作方法 A stereoscopic drawing board spiral light on its production methods led
12/14/2011	CN102281700A 多层印刷电路板电性结构及其制造方法 Electrical structure multilayer printed wiring board and its manufacturing method
12/14/2011	CN102280415A 封装结构、印制电路板组件和固定方法 Package, printed circuit board assembly and method of fixing
12/14/2011	CN102280326A 印刷电路板、电子器件以及印刷电路板的制造方法 The method of manufacturing printed circuit boards, electronic components and a printed circuit board
12/14/2011	CN102280076A 户外led显示屏结构 Outdoor led display structure
12/14/2011	CN102276654A Uv屏蔽性能优异的磷改性阻燃固化剂的制造方法 Uv shielding method for producing high performance of flame retardant phosphorus-modified curing agent
12/14/2011	CN101750797B 用于液晶显示设备的背光单元及其制造方法 A backlight unit for liquid crystal display device and manufacturing method thereof
12/14/2011	CN101636040B 印刷电路板 A printed circuit board
12/14/2011	CN101423681B 导体图案形成用墨液、导体图案及布线基板 The ink for forming a conductor pattern, the conductor pattern and a printed circuit board
12/14/2011	CN101032192B 无源器件结构 Passive device structure
12/13/2011	US8079011 Printed circuit boards having pads for solder balls and methods for the implementation thereof
12/13/2011	US8077478 Module board

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