Patents for H05K 1 - Printed circuits (98,583)
03/2012
03/15/2012WO2012032905A1 Composition for use in forming layer to be plated, method for manufacturing metal pattern material, and novel polymer
03/15/2012WO2012032903A1 Film exposure device
03/15/2012WO2012032375A1 Modular wireless station for data acquisition
03/15/2012WO2012032062A1 Printed circuit board for population with luminous bodies
03/15/2012WO2012032012A1 Optoelectronic semiconductor component and method for producing it
03/15/2012WO2012031708A2 Antenna component and method for producing an antenna component
03/15/2012WO2012031537A1 Epoxy resin composition and copper clad laminate manufactured by using same
03/15/2012WO2012031517A1 Design method of multilayer printed circuit board and multilayer printed circuit board
03/15/2012WO2011101172A3 Light source having led arrays for direct operation in an alternating current network and production method therefor
03/15/2012US20120063787 Connector and optical transmission apparatus
03/15/2012US20120063785 Connector, optical transmission device, and connector connection method
03/15/2012US20120063110 Module board
03/15/2012US20120063109 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
03/15/2012US20120063108 Circuit board and semiconductor module including the same
03/15/2012US20120063106 Rf layered module using three dimensional vertical wiring and disposing method thereof
03/15/2012US20120062345 Low resistance electrical conductor
03/15/2012US20120061836 SPRAY PYROLYSIS OF Y-DOPED ZnO
03/15/2012US20120061133 High-frequency circuit package and high-frequency circuit device
03/15/2012US20120061132 Printed circuit board having metal bumps
03/15/2012US20120061131 Encapsulation Substrate for Organic Light Emitting Diode Display and Method of Manufacturing the Encapsulation Substrate
03/15/2012US20120061130 Conductive substrate
03/15/2012US20120061129 Circuit board structure with low capacitance
03/15/2012US20120061128 Photosensitive resin, curable resin composition containing the same, dry film thereof, and printed circuit board using them
03/15/2012US20120061127 Electrical component assembly for thermal transfer
03/15/2012US20120061126 Paste composition and printed circuit board
03/15/2012DE202011108794U1 Montagestruktur für Schaltungsplatte Mounting structure for circuit board
03/15/2012DE102011005606A1 Textile-type electronic component package for implementing textile-type/cloth-type computing system on e.g. transfer paper, has via-hole-type coupling parts electrically coupling mounting pads and conductive patterns
03/14/2012EP2429268A1 Thermal interface material for reducing thermal resistance and method of making the same
03/14/2012EP2429267A1 Multi-layer circuit board with circuit board fixing
03/14/2012EP2428971A1 Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
03/14/2012EP2428105A1 Method and apparatus for improving power and loss for interconect configurations
03/14/2012EP2428104A1 High impedance trace
03/14/2012EP1471103B1 Process for producing porous polyimide resin and porous polyimide resin
03/14/2012CN202168280U 一种led灯电路板 One kind of led light board
03/14/2012CN202168279U 埋入平面电容的多层线路板 Planar capacitor embedded in the multilayer wiring board
03/14/2012CN202168278U 电路板的焊接结构 Board welded structure
03/14/2012CN202168277U 具有盘中孔的多层线路板 Multi-layer circuit board with a pan hole
03/14/2012CN202168276U 可内层互连的多层线路板 May be interconnected inner multilayer wiring board
03/14/2012CN202168275U 一种bga非smd与smd混合设计的焊盘结构 One kind bga smd mixed with non smd pad structure design
03/14/2012CN202168274U 一种尖端过镀金手指 A sophisticated over-gilded finger
03/14/2012CN202168273U Novel circuit board
03/14/2012CN202168272U Novel circuit board
03/14/2012CN202168271U 电路板 Board
03/14/2012CN202168270U 电路板 Board
03/14/2012CN202168269U 电路板 Board
03/14/2012CN202168268U 一种可提高散热效果的印制线路板 One kind can improve the cooling effect of the printed circuit board
03/14/2012CN202168267U 一种多层铜箔电路板 A multilayer copper circuit board
03/14/2012CN202166802U 一种绑定芯片的柔性电路板及压接后的液晶面板 Bindings for a flexible circuit board and the chip after the crimping of the liquid crystal panel
03/14/2012CN102379167A Connector using liquid dielectric for improved performance
03/14/2012CN102378556A Radiating device of circuit board
03/14/2012CN102378497A Flexible print circuit and print circuit board combination method and circuit board structure
03/14/2012CN102378491A Circuit board
03/14/2012CN102378490A Printed circuit board assembly sheet and method for manufacturing the same
03/14/2012CN102378489A 软硬线路板及其制造方法 Flex circuit board and its manufacturing method
03/14/2012CN102378488A 印刷电路板及其设计方法 Printed circuit board and design methods
03/14/2012CN102378487A Printed circuit board and method of manufacturing the same
03/14/2012CN102378486A Printed circuit board and method for manufacturing the same
03/14/2012CN102378485A 印刷电路板 A printed circuit board
03/14/2012CN102378484A Method for improving solder joint reliability, printed circuit board, packaging device and packaging module
03/14/2012CN102378483A Printed circuit board and method of manufacturing the same
03/14/2012CN102378482A Circuit board substrate and manufacturing method thereof
03/14/2012CN102378481A Insulation sheet of circuit board
03/14/2012CN102378480A Substrate of circuit board and manufacturing method thereof
03/14/2012CN102378479A Circuit board substrate and manufacturing method thereof
03/14/2012CN102378478A Printed wiring board and a method of manufacturing a printed wiring board
03/14/2012CN102378477A 线路板及其制造方法 Circuit board and its manufacturing method
03/14/2012CN102378476A 印刷电路板 A printed circuit board
03/14/2012CN102378475A Improved structure of circuit board connector
03/14/2012CN102378474A Fixing rivet used for circuit board
03/14/2012CN102378473A Membrane circuit board with spacer
03/14/2012CN102378472A Flexible circuit board
03/14/2012CN102378471A Flat cable connection structure of printed circuit board
03/14/2012CN102378470A Flexible circuit board with electromagnetic shielding layer
03/14/2012CN102378469A Crack preventing structure of circuit board
03/14/2012CN102378468A Improved structure of circuit board
03/14/2012CN102378467A 印刷电路板 A printed circuit board
03/14/2012CN102378466A Circuit board with semiconductor light source, bearing body, system of circuit board and beating body, and fixing method
03/14/2012CN102378465A Combined type printed circuit board and television applying same
03/14/2012CN102378464A 电路板模块 Circuit board module
03/14/2012CN102377420A Electronic switch module
03/14/2012CN102377089A Aperture flat cable applicable to multi-directional rotating shafts
03/14/2012CN102377076A 连接器 Connector
03/14/2012CN102376699A LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof
03/14/2012CN102376688A Interconnection structure for interposer and packaging component having the same
03/14/2012CN102376679A Package substrate and flip chip package including the same
03/14/2012CN102376594A Electronic package structure and package method thereof
03/14/2012CN102375339A Alkali development-type photosensitive resin composition
03/14/2012CN102375295A Camera module
03/14/2012CN102375294A 照相机模块 Camera Module
03/14/2012CN102375092A Multilayer wiring board and method for evaluating multilayer wiring board
03/14/2012CN102373447A Plating solution for forming tin alloy and method of forming tin alloy film
03/14/2012CN102372900A Epoxy resin composition, and prepreg material and printed circuit board prepared from the same
03/14/2012CN102371739A 胶片及其制作方法 Film and production methods
03/14/2012CN101827493B Combination of chip and circuit board and assembly method for chip
03/14/2012CN101730383B Printed circuit board
03/14/2012CN101472391B Copper foil
03/14/2012CN101452128B Touch control display device and electronic device
03/14/2012CN101421672B Alkali developable solder resist, cured product of the same and printed wiring board obtained using the same
03/14/2012CN101329455B Electro-optical device and electronic apparatus
03/14/2012CN101220160B Prepreg applied for multi-layer board of printed electronic circuit