Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2012
10/25/2012US20120267595 Memory component and a memory cell
10/25/2012US20120267532 Ir emitter and ndir sensor
10/25/2012US20120267346 Support assembly
10/25/2012US20120267050 Plasma processing apparatus
10/25/2012US20120266945 Thin-film component on glass, a method for the production thereof and the use thereof
10/25/2012US20120266673 Inertial sensor and method of manufacturing the same
10/25/2012US20120266462 Sealed electronic housing and method for the sealed assembly of such a housing
10/25/2012US20120266425 Thermal processing system and method of using
10/25/2012DE112010003998T5 Vorrichtung und Verfahren zur verbesserten Steuerung des Erwärmens und Abkühlens vonSubstraten VonSubstraten apparatus and method for improved control of the heating and cooling
10/25/2012DE112010003509T5 Vakuumübergang zum Füllen einer Form mit Lotkontaktierhügeln Vacuum transition to fill a form with Lotkontaktierhügeln
10/25/2012DE112010002935T5 Epitaktischer Siliciumwafer und Verfahren zur Herstellung desselben Epitaxial silicon wafer and method for manufacturing the same
10/25/2012DE112010001432T5 Vorrichtung und Verfahren zur Aufbereitung einer Ätzlösung Apparatus and method for processing an etching solution
10/25/2012DE112006001589B4 Verfahren zur Bildung von Halbleiterstrukturen A method for forming semiconductor structures,
10/25/2012DE102012206605A1 Transistoranordnung mit einem mosfet und herstellungsverfahren Manufacturing processes transistor arrangement with a mosfet and
10/25/2012DE102012206461A1 Planarisierungsschema für Silizium-Durchkontaktierungen Planarization scheme for silicon vias
10/25/2012DE102012205662A1 MOS-Halbleitervorrichtung und Verfahren zu deren Herstellung MOS semiconductor device and process for their preparation
10/25/2012DE102012103517A1 Dummy-Strukturen und Verfahren Dummy structures and procedures
10/25/2012DE102012103243A1 Verfahren zur zeitlichen Veränderung der Laserintensität während des Ritzens einer Photovoltaikvorrichtung Methods for temporal variation of the laser intensity during the scribing of a photovoltaic device
10/25/2012DE102012103157A1 Halbleitervorrichtung und Bonddraht Semiconductor device and bonding wire
10/25/2012DE102012007954A1 Doppelschichtmetall- (DLM) Leistungs-MOSFET Doppelschichtmetall- (DLM) power MOSFET
10/25/2012DE102011088638B3 Method for manufacturing high voltage component e.g. N-channel metal oxide semiconductor transistor, in mobile telephone, involves forming connection to field structure, and coupling connection with potential distributing field in substrate
10/25/2012DE102011018544A1 Method for connecting mating face of substrate, electronic portion and mating face of electronic portion for electronic component, involves forming film between mating face(s) and adhering mating face(s) with intermediate film
10/25/2012DE102011018460A1 Prozessierungssystem Processing system
10/25/2012DE102011018450A1 Semiconductor device i.e. complementary metal-oxide semiconductor device, for dual CPU assembly, has n-doped region, and transistor structure including potential terminal that is connected with tub terminal over resistor
10/25/2012DE102011018374A1 Verfahren zur Herstellung einer metallischen Kontaktstruktur einer Halbleiterstruktur mit Durchkontaktierung und photovoltaische Solarzelle A method of manufacturing a metal contact structure of a semiconductor structure having plated-through hole and photovoltaic solar cell
10/25/2012DE102011018359A1 Method for wire sawing of brittle workpiece with saw wire for manufacturing solar wafer, involves determining whether feed rate of brittle workpiece during saw wire return is larger than that of workpiece during saw wire advancement
10/25/2012DE102011018324A1 Heißdrahtverfahren zur Abscheidung von Halbleiter-Material auf einem Substrat und Vorrichtung zur Durchführung des Verfahrens Hot-wire method for deposition of semiconductor material on a substrate and apparatus for carrying out the method
10/25/2012DE102011018295A1 Verfahren zum Schneiden eines Trägers für elektrische Bauelemente A method for cutting a carrier for electrical components
10/25/2012DE102011007682A1 Suszeptor zum Abstützen einer Halbleiterscheibe und Verfahren zum Abscheiden einer Schicht auf einer Vorderseite einer Halbleiterscheibe Susceptor for supporting a semiconductor wafer and method for depositing a layer on a front side of a semiconductor wafer
10/25/2012DE102011002236A1 Verfahren zur Herstellung einer polykristallinen Schicht A process for producing a polycrystalline layer
10/25/2012DE102010042229B4 Verfahren zum Steigern der Integrität eines Gatestapels mit großem ε durch Erzeugen einer gesteuerten Unterhöhlung auf der Grundlage einer Nasschemie und mit den Verfahren hergestellter Transistor A method of increasing the integrity of a gate stack with large ε by generating a controlled undercut on the basis of a wet chemical and the process produced transistor
10/25/2012DE102009037112B4 Optisches System zum Erzeugen eines Lichtstrahls zur Behandlung eines Substrats An optical system for generating a light beam for treating a substrate
10/25/2012DE102008005872B4 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof
10/25/2012DE102007019561B4 Halbleitervorrichtung und Herstellungsverfahren derselben A semiconductor device and manufacturing method thereof
10/25/2012DE102007017546B4 Mehrzahl von Multichipmodulen und Verfahren zur Herstellung Plurality of multichip modules, and methods for preparing
10/25/2012DE102005030466B4 Halbleiterwafer mit Verdrahtungsstrukturen und Halbleiterbauelement sowie Verfahren zur Herstellung desselben Of the same semiconductor wafer having wiring patterns, and semiconductor device and methods for preparing
10/25/2012DE102005027445B4 Dünnschichttransistorarray-Substrat und Herstellungsverfahren für ein solches Thin film transistor array substrate and manufacturing method for such a
10/25/2012DE10102315B4 Verfahren zum Herstellen von Halbleiterbauelementen und Zwischenprodukt bei diesen Verfahren A method of manufacturing semiconductor devices and an intermediate in this process
10/24/2012EP2515435A2 Power amplifier
10/24/2012EP2515346A1 Process for producing semiconductor layer, process for producing photoelectric converter, and solution for forming semiconductor layer
10/24/2012EP2515345A1 Method for manufacturing semiconductor device and back junction solar cell
10/24/2012EP2515337A1 Driver circuit and semiconductor device
10/24/2012EP2515336A1 Sic semiconductor element and manufacturing method for same
10/24/2012EP2515329A1 Method for producing electronic device, electronic device, method for producing electronic device package, and electronic device package
10/24/2012EP2515328A1 Method for manufacturing semiconductor device
10/24/2012EP2515327A1 Method for etching a BST layer
10/24/2012EP2515326A1 Etchant and method for manufacturing semiconductor device using same
10/24/2012EP2515324A1 Substrate treatment device
10/24/2012EP2515323A1 Method and apparatus for cleaning semiconductor substrates
10/24/2012EP2515322A1 Pair of substrate holders, method for manufacturing device, separation device, method for separating substrates, substrate holder, and device for positioning substrate
10/24/2012EP2515169A1 Photomask blank, and process for production of photomask
10/24/2012EP2514858A1 Group iii nitride crystal substrate, group iii nitride crystal substrate having epitaxial layer, and semiconductor device and method for producing the same
10/24/2012EP2514857A1 SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME
10/24/2012EP2514856A2 Plating of copper on semiconductors
10/24/2012EP2514720A1 Preparation method of high density zinc oxide nanometer granules
10/24/2012EP2513972A2 Isolation for nanowire devices
10/24/2012EP2513966A1 Semiconductor device
10/24/2012EP2513965A1 Systems and methods employing a physically asymmetric semiconductor device having symmetrical electrical behavior
10/24/2012EP2513964A1 Process for recycling a substrate.
10/24/2012EP2513963A2 High temperature chuck and method of using same
10/24/2012EP2513962A2 Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin
10/24/2012EP2513961A2 Cylindrical magnetic levitation stage and lithography
10/24/2012EP2513960A2 Mobile vacuum carriers for thin wafer processing
10/24/2012EP2513959A1 Method for making a semiconductor device by laser irradiation
10/24/2012EP2513958A2 Hermetic electrical feedthrough
10/24/2012EP2513957A2 Method for producing an electronic unit and electronic unit
10/24/2012EP2513956A1 Circuit board with via trace connection and method of making the same
10/24/2012EP2513955A1 Polishing method, polishing apparatus and polishing tool
10/24/2012EP2513954A2 Device and process for liquid treatment of a wafer shaped article
10/24/2012EP2513953A1 Electrophysiology in-vivo using conformal electronics
10/24/2012EP2513952A1 Deposition of nanoparticles
10/24/2012EP2513951A1 Pinning and affixing nano-active material
10/24/2012EP2513950A1 Semiconductor device structures with modulated doping and related methods
10/24/2012EP2513949A1 Method and device for controlling the manufacture of semiconductor by measuring contamination
10/24/2012EP2513912A1 Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
10/24/2012EP2512664A1 Advanced catalysts for automotive applications
10/24/2012EP2159838B1 Liquid-cooled-type cooling device
10/24/2012CN202503019U Multifunction quartz boat
10/24/2012CN202503018U Solar silicon wafer carrier with cushion
10/24/2012CN202502989U Vacuum suction pen apparatus
10/24/2012CN202502988U Insulating treatment die for film solar cell
10/24/2012CN202502987U Wafer processing device
10/24/2012CN202502986U 一种igbt模块 One kind igbt module
10/24/2012CN202502985U Lead frame transport device
10/24/2012CN202502984U Lead frame guiding device
10/24/2012CN202502983U Semiconductor wafer spraying liquid etching system
10/24/2012CN202498315U Copper wire welding cooper ball protection apparatus for semiconductor devices
10/24/2012CN1988083B Thin-film capacitor and method for fabricating the same, electronic device and circuit board
10/24/2012CN1901208B Array substrate for display device
10/24/2012CN102754535A Method for manufacturing an electronic box
10/24/2012CN102754214A Systems and methods for a continuous-well decoupling capacitor
10/24/2012CN102754213A 半导体装置 Semiconductor device
10/24/2012CN102754208A Bypass capacitor circuit and method of providing a bypass capacitance for an integrated circuit die
10/24/2012CN102754207A Resistive memory and methods of processing resistive memory
10/24/2012CN102754203A Bond pad with multiple layer over pad metallization and method of formation
10/24/2012CN102754201A Etching process for producing a tft matrix
10/24/2012CN102754200A Adhesive tape for protecting surface of semiconductor wafer
10/24/2012CN102754199A Mobile vacuum carriers for thin wafer processing
10/24/2012CN102754198A Method and device for treating a substrate surface of a substrate
10/24/2012CN102754197A Arrangement, system, and method for processing multilayer bodies