Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2012
11/01/2012US20120276724 Spin-on formulation and method for stripping an ion implanted photoresist
11/01/2012US20120276723 Ion injection simulation method, ion injection simulation device, method of producing semiconductor device, and method of designing semiconductor device
11/01/2012US20120276722 Method for growing semipolar nitride
11/01/2012US20120276721 Method of forming an oxide layer and method of manufacturing semiconductor device including the oxide layer
11/01/2012US20120276720 Control of threshold voltages in high-k metal gate stack and structures for cmos devices
11/01/2012US20120276719 Methods of forming semiconductor memory devices having vertically stacked memory cells therein
11/01/2012US20120276718 Method of fabricating graphene-based field effect transistor
11/01/2012US20120276717 Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same
11/01/2012US20120276716 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
11/01/2012US20120276715 Method for manufacturing combined substrate having silicon carbide substrate
11/01/2012US20120276714 Method of oxidizing polysilazane
11/01/2012US20120276713 Method for manufacturing semiconductor device
11/01/2012US20120276712 Semiconductor device and fabrication method thereof
11/01/2012US20120276711 Method for manufacturing semiconductor device having spacer with air gap
11/01/2012US20120276710 Semiconductor device and method of manufacturing same
11/01/2012US20120276709 Method of fabricating semiconductor device
11/01/2012US20120276708 Method of fabricating semiconductor device
11/01/2012US20120276707 Method for forming trench isolation
11/01/2012US20120276706 Damascene metal-insulator-metal (mim) device improved scaleability
11/01/2012US20120276705 Method of making a semiconductor device as a capacitor
11/01/2012US20120276704 Electrostatic discharge protection device
11/01/2012US20120276703 Method of forming an insulated gate field effect transistor device having a shield electrode structure
11/01/2012US20120276702 Method of manufacturing semiconductor device
11/01/2012US20120276701 Superjunction Structures for Power Devices and Methods of Manufacture
11/01/2012US20120276700 Read-only memory and method of manufacture thereof
11/01/2012US20120276699 Memory array with ultra-thin etched pillar surround gate access transistors and buried data/bit lines
11/01/2012US20120276698 Semiconductor device and method of manufacturing the semiconductor device
11/01/2012US20120276697 Manufacturing method of array substrate
11/01/2012US20120276696 Vertical structure non-volatile memory device and method of manufacturing the same
11/01/2012US20120276695 Strained thin body CMOS with Si:C and SiGe stressor
11/01/2012US20120276694 Manufacturing method of semiconductor device
11/01/2012US20120276693 Module Comprising a Semiconductor Chip
11/01/2012US20120276692 Method for Assemblying a Semiconductor Chip Package with Deflection-Resistant Leadfingers
11/01/2012US20120276691 Wafer Level Die Integration and Method
11/01/2012US20120276690 Semiconductor device and method for manufacturing the same
11/01/2012US20120276689 Glass Wafers for Semiconductor Fabrication Processes and Methods of Making Same
11/01/2012US20120276688 Method for forming a self-aligned bit line for pcram and self-aligned etch back process
11/01/2012US20120276677 Method and structure of wafer level encapsulation of integrated circuits with cavity
11/01/2012US20120276675 Apparatus and method for measuring local surface temperature of semiconductor device
11/01/2012US20120276674 Three-Axis Accelerometers and Fabrication Methods
11/01/2012US20120276665 Apparatus and method for electrical characterization by selecting and adjusting the light for a target depth of a semiconductor
11/01/2012US20120276664 Methods of inspecting and manufacturing semiconductor wafers
11/01/2012US20120276663 Equipment and method for manufacturing semiconductor device
11/01/2012US20120276662 Eddy current monitoring of metal features
11/01/2012US20120276661 High sensitivity eddy current monitoring system
11/01/2012US20120276660 System for non radial temperature control for rotating substrates
11/01/2012US20120276659 Semiconductor device and manufacturing method thereof
11/01/2012US20120276658 Method of etching a workpiece
11/01/2012US20120276657 Method of patterning of magnetic tunnel junctions
11/01/2012US20120275793 Laser diode, method for manufacturing laser diode and passive optical network system
11/01/2012US20120275220 Three-dimensional multi-bit non-volatile memory and method for manufacturing the same
11/01/2012US20120275208 Reliable electrical fuse with localized programming and method of making the same
11/01/2012US20120275207 Sram cell parameter optimization
11/01/2012US20120274944 Titanium-doped amorphous aluminum nitride microlaser device and method for making and using same
11/01/2012US20120274911 Lithographic apparatus and device manufacturing method
11/01/2012US20120274347 Integrated high-speed probe system
11/01/2012US20120274273 Integrated-circuit battery devices
11/01/2012US20120274014 Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
11/01/2012US20120273975 Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet
11/01/2012US20120273969 Semiconductor device having groove-shaped via-hole
11/01/2012US20120273967 Semiconductor Wafer Having Through-Hole Vias on Saw Streets with Backside Redistribution Layer
11/01/2012US20120273965 Semiconductor memory device and method of manufacturing the same
11/01/2012US20120273964 Manufacturing method of semiconductor device and semiconductor device
11/01/2012US20120273963 Microelectronic interconnect substrate and packaging techniques
11/01/2012US20120273962 Semiconductor device having air gap and method for manufacturing the same
11/01/2012US20120273960 Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Encapsulant with TMV for Vertical Interconnect in POP
11/01/2012US20120273959 Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POP
11/01/2012US20120273958 Multilayer interconnect structure and method for integrated circuits
11/01/2012US20120273957 Chip-packaging module for a chip and a method for forming a chip-packaging module
11/01/2012US20120273956 Semiconductor device having groove-shaped via-hole
11/01/2012US20120273955 System comprising a semiconductor device and structure
11/01/2012US20120273954 Semiconductor device with protective material and method for encapsulating
11/01/2012US20120273953 Semiconductor device having groove-shaped via-hole
11/01/2012US20120273952 Microelectronic chip, component containing such a chip and manufacturing method
11/01/2012US20120273951 Contact Metal for Hybridization and Related Methods
11/01/2012US20120273950 Integrated circuit structure including copper-aluminum interconnect and method for fabricating the same
11/01/2012US20120273949 Method of forming oxide encapsulated conductive features
11/01/2012US20120273948 Integrated circuit structure including a copper-aluminum interconnect and method for fabricating the same
11/01/2012US20120273947 Chip package with a chip embedded in a wiring body
11/01/2012US20120273946 Semiconductor device
11/01/2012US20120273943 Solder Joint Flip Chip Interconnection Having Relief Structure
11/01/2012US20120273942 Flip-chip Mounting Structure and Flip-chip Mounting Method
11/01/2012US20120273941 Package structure having embedded electronic component and fabrication method thereof
11/01/2012US20120273940 Semiconductor apparatus and method for fabricating the same
11/01/2012US20120273938 Semiconductor Device and Method of Forming an Interconnect Structure with Conductive Material Recessed Within Conductive Ring Over Surface of Conductive Pillar
11/01/2012US20120273937 Semiconductor Device and Method of Forming Bump Interconnect Structure with Conductive Layer Over Buffer Layer
11/01/2012US20120273936 Micro Bump And Method For Forming The Same
11/01/2012US20120273935 Semiconductor Device and Method of Making a Semiconductor Device
11/01/2012US20120273933 Three-dimensional system-in-a-package
11/01/2012US20120273932 Power supply module and packaging and integrating method thereof
11/01/2012US20120273931 Integrated circuit chip package and manufacturing method thereof
11/01/2012US20120273930 Semiconductor package structure and method of fabricating the same
11/01/2012US20120273929 Multi-die packages incorporating flip chip dies and associated packaging methods
11/01/2012US20120273928 Chip on film type semiconductor package
11/01/2012US20120273926 Semiconductor Device and Method of Forming Shielding Layer Over Active Surface of Semiconductor Die
11/01/2012US20120273924 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern using the composition
11/01/2012US20120273923 Method of manufacturing semiconductor device and wafer
11/01/2012US20120273922 Semiconductor device and method of manufacturing the same
11/01/2012US20120273921 Semiconductor device and method for fabricating the same
11/01/2012US20120273919 Semiconductor cell and method for forming the same
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