Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2012
10/17/2012CN102738036A Wafer level mosfet metallization
10/17/2012CN102738035A Film transfer frame
10/17/2012CN102738034A Semiconductor processing apparatus provided with structure for processing fluid leakage recovery
10/17/2012CN102738033A Semiconductor processing apparatus provided with modified column structure
10/17/2012CN102738032A Semiconductor processing apparatus capable of correcting smoothness of working surface
10/17/2012CN102738031A Semiconductor processing apparatus containing drawable cavity
10/17/2012CN102738030A PN junction depth estimation method
10/17/2012CN102738029A Method for detecting specific defect and system and program used for detecting specific defect
10/17/2012CN102738028A System for detecting chip inclination
10/17/2012CN102738027A Thermal processing equipment and temperature calibration method thereof and temperature calibration apparatus thereof
10/17/2012CN102738026A Methods of forming bonded semiconductor structures and semiconductor structures formed by such methods
10/17/2012CN102738025A Method of forming bonded semiconductor structure, and semiconductor structure formed by such method
10/17/2012CN102738024A Semiconductor packaging and lead frames thereof
10/17/2012CN102738023A System and method for securing a semiconductor device to a printed wire board
10/17/2012CN102738022A Method for assembling semiconductor device containing insulating substrate and heat sink
10/17/2012CN102738021A Positioning structure of semi-conductor chip cantilever package
10/17/2012CN102738020A Integrated circuit plastic packaging mold for preventing horizontal overflowed material at cored hole
10/17/2012CN102738019A Technology for producing secondary plastic package of AAQFN product on basis of framework carrier open pore and die film
10/17/2012CN102738018A Framework carrier pore opening and solder ball film sticking based AAQFN (quad flat no-lead) product secondary plastic packaging manufacturing technology
10/17/2012CN102738017A Secondary plastic package manufacturing process of AAQFN product based on sand blasting
10/17/2012CN102738016A Framework carrier pore opening based AAQFN product secondary plastic packaging manufacturing technology
10/17/2012CN102738015A Secondary plastic packaging manufacturing process of AAQFN products based on corrosion and sand blasting
10/17/2012CN102738014A Flip chip packaging method
10/17/2012CN102738013A Chip packaging body and method for manufacturing the same
10/17/2012CN102738012A Method for producing sensor unit
10/17/2012CN102738011A Chip pin adjusting device
10/17/2012CN102738010A Technology for producing AAQFN framework product quad flat package on basis of sand blasting
10/17/2012CN102738009A Manufacturing process of flat packaging piece of AAQFN framework product based on brushing
10/17/2012CN102738008A Method for fabricating groove field effect transistor
10/17/2012CN102738007A Manufacturing method of thin film transistor and manufacturing method of array base plate
10/17/2012CN102738006A Pre-metal dielectric integration process for 45-nm and below technical nodes
10/17/2012CN102738005A Method for forming a semiconductor device having nanocrystal
10/17/2012CN102738004A Process for forming an epitaxial layer
10/17/2012CN102738003A Manufacturing method of semiconductor device
10/17/2012CN102738002A Manufacturing method of semiconductor device
10/17/2012CN102738001A Method for fabricating power transistor possessing super interface
10/17/2012CN102738000A Ultra-shallow junction formation method
10/17/2012CN102737999A Method for preparing metal-oxide-semiconductor field effect transistor on germanium substrate
10/17/2012CN102737998A Method and system for processing a semiconductor device
10/17/2012CN102737997A Preparation method of semiconductor device
10/17/2012CN102737996A Method for manufacturing transistor and semiconductor device
10/17/2012CN102737995A Method for manufacturing semiconductor device
10/17/2012CN102737994A Method for manufacturing semiconductor device
10/17/2012CN102737993A Groove DMOS device and manufacturing method thereof
10/17/2012CN102737992A Method for manufacturing semiconductor device
10/17/2012CN102737991A Method for producing composite back potential energy barrier gallium nitride heterojunction field effect tube
10/17/2012CN102737990A Method for processing semiconductor device, apparatus and system thereof
10/17/2012CN102737989A Sintering method of mono-like silicon wafer
10/17/2012CN102737988A Heat treatment apparatus and heat treatment method
10/17/2012CN102737987A Plasma nitriding method, plasma nitriding apparatus and method of manufacturing semiconductor device
10/17/2012CN102737986A Chemical mechanical polishing method
10/17/2012CN102737985A Method of fabricating semiconductor component
10/17/2012CN102737984A Semiconductor structure formation method
10/17/2012CN102737983A Method for forming semiconductor structure
10/17/2012CN102737982A Movable texturing device for silicon wafer
10/17/2012CN102737981A Method for realizing silicon wafer singleside polishing
10/17/2012CN102737980A Wafer grinding method
10/17/2012CN102737979A Slicing device and slicing method
10/17/2012CN102737978A Process of planarizing wafer
10/17/2012CN102737977A Plasma-nitriding method
10/17/2012CN102737976A Plasma doping to reduce dielectric loss during removal of dummy layers in a gate structure
10/17/2012CN102737975A Layouts of poly cut openings overlapping active regions
10/17/2012CN102737974A Method of fabricating a plurality of gate structures
10/17/2012CN102737973A Device manufacturing method for enhancing IGBT (Insulated Gate Bipolar Translator) reliability
10/17/2012CN102737972A Recessed trench gate structure and method of fabricating same
10/17/2012CN102737971A Semiconductor element provided with metal gate and manufacturing method thereof
10/17/2012CN102737970A Semiconductor device and manufacturing method for gate dielectric layer thereof
10/17/2012CN102737969A Equipment for preparing ultra-shallow junction on surface of crystalline silicon by laser
10/17/2012CN102737968A Well injection method, silicon-on-insulator device manufacturing method and silicon-on-insulator device
10/17/2012CN102737967A Semiconductor device and substrate with chalcogen doped region
10/17/2012CN102737966A Method of gate work function adjustment and metal gate transistor
10/17/2012CN102737965A Formation method of Halo structure
10/17/2012CN102737964A Crystal wafer and diffusion method thereof
10/17/2012CN102737963A Method for preparing semiconductor material through ion injection and fixed-point adsorption technologies
10/17/2012CN102737962A Epitaxial structure and preparation method thereof
10/17/2012CN102737961A Method for reducing collapsing or shift of photoresist (PR) mask
10/17/2012CN102737960A Method and system for feed-forward advanced process control
10/17/2012CN102737959A Model of defining a photoresist pattern collapse rule, and photomask layout, semiconductor substrate and method for improving photoresist pattern collapse
10/17/2012CN102737958A Substrate transfer method and substrate transfer apparatus
10/17/2012CN102737957A Method of depositing silicon oxide film and silicon nitride film, film forming apparatus, and method of manufacturing semiconductor device
10/17/2012CN102737956A Integrated circuit receiving device
10/17/2012CN102737955A Semiconductor processing device
10/17/2012CN102737954A Method and device for reducing electronic component manufacturing tool bodies
10/17/2012CN102737946A 等离子体处理方法 The plasma processing method
10/17/2012CN102737939A Plasma processing equipment and working method thereof
10/17/2012CN102736446A Exposure apparatus, exposure method, and method for producing device
10/17/2012CN102736434A Forming method of packaging pattern
10/17/2012CN102736433A Protection device for leak of workpiece platform
10/17/2012CN102736429A Silicon chip temperature stabilizing device
10/17/2012CN102736399A Method of forming standard mask for inspection system
10/17/2012CN102736340A Electro-optic device, electronic device, and method of manufacturing electro-optic device
10/17/2012CN102736338A 液晶显示装置及其制造方法 The liquid crystal display device and manufacturing method
10/17/2012CN102736333A Array substrate, liquid crystal display device and manufacture method for array substrate
10/17/2012CN102736325A Pixel structure and manufacturing method and display device of same
10/17/2012CN102736298A Manufacturing method of liquid crystal display device and liquid crystal display device
10/17/2012CN102736008A Method of inspecting light-emitting devices
10/17/2012CN102732969A Crystal bar surface nanocystalized process and wafer manufacture method
10/17/2012CN102732956A MO source supply system for GaN epitaxy of MOCVD equipment
10/17/2012CN102732955A Semiconductor epitaxial wafer gripper used for electron beam evaporation
10/17/2012CN102732925A Method and device for filling interconnection structure
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