Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2012
10/31/2012CN102760754A Depletion type VDMOS (Vertical Double-diffusion Metal Oxide Semiconductor) and manufacturing method thereof
10/31/2012CN102760751A Structure of semiconductor device and formation method
10/31/2012CN102760750A Organic light emitting diode (OLED) metal oxide and preparation method thereof
10/31/2012CN102760747A Method of manufacturing organic electroluminescence display device
10/31/2012CN102760740A Non-volatile memory device and method for fabricating the same
10/31/2012CN102760739A Semiconductor memory device and method of manufacturing the same
10/31/2012CN102760738A 3-D non-volatile memory device and method of manufacturing the same
10/31/2012CN102760737A Floating gate type EEPROM (Electrically Erasable Programmable Read Only Memory) device and manufacturing method thereof
10/31/2012CN102760736A Semiconductor device and method for fabricating the same
10/31/2012CN102760734A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/31/2012CN102760723A Semiconductor device
10/31/2012CN102760722A Integrated circuit structure including a copper-aluminum interconnect and method for fabricating the same
10/31/2012CN102760720A Electronic programmable fuse wire vacant active area adding method and electronic programmable fuse wire
10/31/2012CN102760715A Package structure having embedded electronic component and fabrication method thereof
10/31/2012CN102760713A Chip-packaging module for a chip and a method for forming a chip-packaging module
10/31/2012CN102760711A 半导体器件及其编程方法 Semiconductor device and programming
10/31/2012CN102760710A Through-silicon via structure and formation method thereof
10/31/2012CN102760701A Methods for fabricating gate dielectric layer and for fabricating gate structure
10/31/2012CN102760700A Method for forming self-aligned contact and integrated circuit with a self-aligned contact
10/31/2012CN102760699A Method of cutting wafer used for preparation of sensor chip into grains
10/31/2012CN102760698A Method for manufacturing organic EL display device
10/31/2012CN102760697A Manufacturing method of semiconductor device
10/31/2012CN102760696A Through hole priority copper interconnection manufacturing method
10/31/2012CN102760695A Multilayer interconnect structure and method for integrated circuits
10/31/2012CN102760694A Method of forming oxide encapsulated conductive features
10/31/2012CN102760693A Method of forming semiconductor device
10/31/2012CN102760692A Method for preparing contact plug structure
10/31/2012CN102760691A Formation method of silicon through hole
10/31/2012CN102760690A Manufacture method and wafer of semiconductor device
10/31/2012CN102760689A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/31/2012CN102760688A Dual damascene structure and formation method thereof as well as semiconductor device
10/31/2012CN102760687A Semiconductor device with air space and manufacture method thereof
10/31/2012CN102760686A Semiconductor device and forming method of interconnection structure
10/31/2012CN102760685A Etching post-processing method of copper interconnection line
10/31/2012CN102760684A 金属互连方法 Metal interconnect method
10/31/2012CN102760683A Method for manufacturing semiconductor device having spacer with air gap
10/31/2012CN102760682A Method for forming trench isolation and method for producing semiconductor assembly
10/31/2012CN102760681A Method for fabricating intra-device isolation structure
10/31/2012CN102760680A Chuck assembly applicable to semiconductor substrate processing device
10/31/2012CN102760679A Substrate bracket and substrate processing apparatus employing the same
10/31/2012CN102760678A System and method for actively correcting offset drift and wire bonder
10/31/2012CN102760677A Substrate conveying apparatus and method
10/31/2012CN102760676A Loading and unloading basket device for silicon wafers
10/31/2012CN102760675A Angle adjusting mechanism of soft landing push-pull boat of diffusion furnace
10/31/2012CN102760674A Push-boat movement executing device for soft-landing diffusion furnace
10/31/2012CN102760673A Substrate processing apparatus and method of displaying abnormal state of substrate processing apparatus
10/31/2012CN102760672A Etching device and a method for etching a material of a workpiece
10/31/2012CN102760671A Temperature-measuring substrate and heat treatment apparatus
10/31/2012CN102760670A Hand-free ternary inspection machine
10/31/2012CN102760669A Memory device having buried bit line and vertical transistor and fabrication method thereof
10/31/2012CN102760668A Single-side three-dimensional circuit chip upside-down-charging packaging-before-etching method and packaging structure thereof
10/31/2012CN102760667A Semiconductor packaging method for forming two-sided electromagnetic shielding layer as well as construction thereof
10/31/2012CN102760666A Linkage vac-sorb tool used for IGBT (insulated gate bipolar translator)
10/31/2012CN102760665A Semiconductor packaging structure and method for making the same
10/31/2012CN102760664A Semiconductor device and method of making a semiconductor device
10/31/2012CN102760663A Mould for sintering metallic packaging shell
10/31/2012CN102760662A Method for fabricating semiconductor power device
10/31/2012CN102760661A Method of forming an oxide layer and method of manufacturing semiconductor device including the oxide layer
10/31/2012CN102760660A method of oxidizing polysilazane and method of forming trench isolation structure
10/31/2012CN102760659A Table modeling process of common power rectifying diode chip
10/31/2012CN102760658A Manufacturing method of gate dielectric layer
10/31/2012CN102760657A Method for preparing high K grating medium film and MIS (Management Information System) capacitor on InP (Indium Phosphide) substrate
10/31/2012CN102760656A Method for fabricating a gate dielectric layer and for fabricating a gate structure
10/31/2012CN102760655A Manufacturing method of gate dielectric layer
10/31/2012CN102760654A Semiconductor device and method for forming grid pattern
10/31/2012CN102760653A Formation method of metal gate
10/31/2012CN102760652A Manufacture method of semiconductor device
10/31/2012CN102760651A Layout logic-operation method for vertical and shallow injection layers and integrated circuit manufacturing method
10/31/2012CN102760650A Layout logical operation method and integrated circuit manufacturing method
10/31/2012CN102760649A Processing system
10/31/2012CN102760648A Manufacturing method of voltage division ring of plane high-voltage transistor
10/31/2012CN102760647A Superstructure power device manufacturing method and semiconductor device manufacturing method
10/31/2012CN102760646A Prevention of line bending and tilting for etch with tri-layer mask
10/31/2012CN102760645A Method for fabricating hole pattern in semiconductor device
10/31/2012CN102760644A Method of cleaning substrate processing apparatus
10/31/2012CN102760643A Method of bevel trimming three dimensional semiconductor device
10/31/2012CN102760642A Metallic packaging shell sintering mould capable of controlling uniformity of leads in height
10/31/2012CN102760641A Graphite mould controlling consistency of lead wires during sintering of flat metal casing
10/31/2012CN102760640A Thermal oxidation system with liquid accumulation preventing function and thermal oxidation method
10/31/2012CN102760639A Configurable process variation monitoring circuit and monitoring method for crystal particles
10/31/2012CN102760638A Heating method used for maintaining thermal budget to be stable
10/31/2012CN102760563A Integrierter transformator
10/31/2012CN102760386A Display device and method of manufacturing the same
10/31/2012CN102759860A Coating treatment apparatus, coating and developing treatment system, and coating treatment method
10/31/2012CN102759854A Method of nano-patterning and method of manufacturing nano-imprint master and discrete track magnetic recording media
10/31/2012CN102759853A Method of manufacturing discrete track magnetic recording medium
10/31/2012CN102759832A Liquid crystal display substrate and manufacturing method thereof
10/31/2012CN102759815A Manufacturing method and device of liquid crystal panel
10/31/2012CN102759697A Method for testing package level of metal oxide semiconductor (MOS) transistor and MOS transistor manufacturing method
10/31/2012CN102759417A Temperature measuring device, temperature calibrating device and temperature calibrating method
10/31/2012CN102758191A Apparatus and method for treating substrate
10/31/2012CN102756334A 切割装置 Cutting device
10/31/2012CN102756323A Chemical mechanical polishing equipment and chemical mechanical polishing method
10/31/2012CN102755980A 晶圆清洗刷和晶圆清洗装置 Wafer cleaning brush and wafer cleaning device
10/31/2012CN102755976A Substrate cleaning chamber and cleaning and conditioning methods
10/31/2012CN102755964A Testing and classifying machine for memory cards
10/31/2012CN102332407B Technology for manufacturing ceramic cofiring four-side lead flat package
10/31/2012CN102306632B Planarization method suitable for photoetching technology
10/31/2012CN102222672B Bismuth ferrite base film layer stacked structure capacitor and preparation method thereof
10/31/2012CN102163567B Method and device for controlling end point of process