Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2012
10/18/2012US20120264291 Process for forming cobalt-containing materials
10/18/2012US20120264290 Method and apparatus for filling interconnect structures
10/18/2012US20120264289 Integrated circuit interconnect structure
10/18/2012US20120264288 Method for manufacturing a semiconductor device
10/18/2012US20120264287 Method for forming an interconnect structure
10/18/2012US20120264286 Methods of manufacturing semiconductor devices
10/18/2012US20120264285 Recessed workfunction metal in cmos transistor gates
10/18/2012US20120264284 Manufacturing method for metal gate structure
10/18/2012US20120264283 Methods of fabricating field effect transistors including titanium nitride gates over partially nitrided oxide and devices so fabricated
10/18/2012US20120264282 Method for forming a semiconductor device having nanocrystals
10/18/2012US20120264281 Method of fabricating a plurality of gate structures
10/18/2012US20120264280 Methods of Fabricating Semiconductor Devices Having Buried Word Line Interconnects
10/18/2012US20120264279 Method for fabricating semiconductor device
10/18/2012US20120264278 Epitaxial lift off stack having a non-uniform handle and methods thereof
10/18/2012US20120264277 Method for forming a semiconductor device having nanocrystal
10/18/2012US20120264276 Method of processing a wafer by using and reusing photolithographic masks
10/18/2012US20120264275 Field effect transistor with air gap dielectric
10/18/2012US20120264274 Transistor of semiconductor device and method for fabricating the same
10/18/2012US20120264273 Semiconductor devices and methods of fabricating the same
10/18/2012US20120264272 Methods Of Forming A Nonvolatile Memory Cell And Methods Of Forming An Array Of Nonvolatile Memory Cells Array Of Nonvolatile Memory Cells
10/18/2012US20120264271 Method of forming a capacitor and method of manufacturing a semiconductor device using the same
10/18/2012US20120264270 Methods for forming high gain tunable bipolar transistors
10/18/2012US20120264269 Bipolar Junction Transistors and Methods of Fabrication Thereof
10/18/2012US20120264268 Methods of forming electrical isolation regions between gate electrodes
10/18/2012US20120264267 Method for fabricating mos transistor
10/18/2012US20120264266 Semiconductor device and method for fabricating the same
10/18/2012US20120264265 Semiconductor device and production method therefor
10/18/2012US20120264264 Method of fabricating non-volatile memory device
10/18/2012US20120264263 Structure and Fabrication of Like-polarity Field-effect Transistors Having Different Configurations of Source/Drain Extensions, Halo Pockets, and Gate Dielectric Thicknesses
10/18/2012US20120264262 Method for forming semiconductor structure
10/18/2012US20120264261 Method for manufacturing an nmos with improved carrier mobility
10/18/2012US20120264260 Tft array substrate and method for manufacturing the same
10/18/2012US20120264259 Method for Forming a Semiconductor Device and a Semiconductor Device
10/18/2012US20120264258 Method of assembling semiconductor device including insulating substrate and heat sink
10/18/2012US20120264257 Mold array process method to prevent exposure of substrate peripheries
10/18/2012US20120264256 Method and system for template assisted wafer bonding
10/18/2012US20120264250 Method of forming membranes with modified stress characteristics
10/18/2012US20120264249 Method for etched cavity devices
10/18/2012US20120264247 Method of Separating Nitride Films from the Growth Substrates by Selective Photo-Enhanced Wet Oxidation
10/18/2012US20120264246 Method of Selective Photo-Enhanced Wet Oxidation for Nitride Layer Regrowth on Substrates
10/18/2012US20120264245 Semiconductor device and fabrication method thereof
10/18/2012US20120264241 Test structure and methodology for three-dimensional semiconductor structures
10/18/2012US20120264240 Semiconductor device and manufacturing method thereof
10/18/2012US20120264238 Program controlled dicing of a substrate using a pulsed laser beam
10/18/2012US20120264237 Methods for designing, fabricating, and predicting shape formations in a material
10/18/2012US20120264236 Fluorescent powder applying device and method capable of detecting instantly color temperature of white light in a manufacturing process
10/18/2012US20120264067 Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server
10/18/2012US20120264051 Pedestal covers
10/18/2012US20120263946 Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layer
10/18/2012US20120263920 Photosensitive Polymer Composition, Method of Producing Pattern and Electronic Parts
10/18/2012US20120263562 Carrier transfer facilitating device
10/18/2012US20120263559 Electronic component handler having gap set device
10/18/2012US20120262989 Nonvolatile semiconductor memory device including plural memory cells and a dummy cell coupled to an end of a memory cell
10/18/2012US20120262985 Mulit-bit cell
10/18/2012US20120262973 Arrays Of Nonvolatile Memory Cells And Methods Of Forming Arrays Of Nonvolatile Memory Cells
10/18/2012US20120262965 Single-wall carbon nanotube diodes
10/18/2012US20120262835 Method for fabricating a dram capacitor
10/18/2012US20120262834 Electrostatic chuck and a method for supporting a wafer
10/18/2012US20120262229 On-chip capacitors with a variable capacitance for a radiofrequency integrated circuit
10/18/2012US20120262198 Semiconductor device
10/18/2012US20120262029 Forming a membrane having curved features
10/18/2012US20120261841 Article and Panel Comprising Semiconductor Chips, Casting Mold and Methods of Producing the Same
10/18/2012US20120261839 Dicing tape-integrated wafer back surface protective film
10/18/2012US20120261838 Multi-chip package and method of providing die-to-die interconnects in same
10/18/2012US20120261836 Active area bonding compatible high current structures
10/18/2012US20120261832 Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board
10/18/2012US20120261831 Integrated circuit device and method for manufacturing same
10/18/2012US20120261830 Mems device etch stop
10/18/2012US20120261829 Middle of line structures and methods for fabrication
10/18/2012US20120261828 Interconnect structure and method for fabricating on-chip interconnect structures by image reversal
10/18/2012US20120261827 Through-silicon vias for semicondcutor substrate and method of manufacture
10/18/2012US20120261826 Tsv structure and method for forming the same
10/18/2012US20120261823 Interconnect structures with engineered dielectrics with nanocolumnar porosity
10/18/2012US20120261822 Out-of-Plane Spacer Defined Electrode
10/18/2012US20120261820 Assembly of stacked devices with semiconductor components
10/18/2012US20120261819 Bridging arrangement and method for manufacturing a bridging arrangement
10/18/2012US20120261817 Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
10/18/2012US20120261816 Device package substrate and method of manufacturing the same
10/18/2012US20120261814 Packaging an Electronic Device
10/18/2012US20120261813 Reinforced via farm interconnect structure, a method of forming a reinforced via farm interconnect structure and a method of redesigning an integrated circuit chip to include such a reinforced via farm interconnect structure
10/18/2012US20120261812 Semiconductor chip with patterned underbump metallization
10/18/2012US20120261809 Chip package and manufacturing method thereof
10/18/2012US20120261808 Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
10/18/2012US20120261806 Lead frame strip for reduced mold sticking during degating
10/18/2012US20120261805 Through package via structures in panel-based silicon substrates and methods of making the same
10/18/2012US20120261804 Vertical substrate diode, method of manufacture and design structure
10/18/2012US20120261803 High-k gate dielectric material and method for preparing the same
10/18/2012US20120261802 Semiconductor device and manufacturing method thereof
10/18/2012US20120261800 Wafer with recessed plug
10/18/2012US20120261796 Die arrangements and methods of manufacturing a die arrangement
10/18/2012US20120261793 Electrical fuse and method of making the same
10/18/2012US20120261792 Soi device with dti and sti
10/18/2012US20120261791 Wide and Deep Oxide Trench in A Semiconductor Substrate with Interspersed Vertical Oxide Ribs
10/18/2012US20120261790 Substrate structure, semiconductor device, and method for manufacturing the same
10/18/2012US20120261789 Wafer with Spacer Including Horizontal Member
10/18/2012US20120261788 Self-aligned airgap interconnect structures and methods of fabrication
10/18/2012US20120261787 Passive devices fabricated on glass substrates, methods of manufacture and design structures
10/18/2012US20120261777 Magnetoresistive Element and Method of Manufacturing the Same
10/18/2012US20120261776 Method and system for providing magnetic layers having insertion layers for use in spin transfer torque memories
10/18/2012US20120261775 MEMS microphone device and method for making same