Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2012
10/17/2012CN102738176A Strain SiGe plane Si-based BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device on basis of SOI (Silicon On Insulator) substrate and preparation method
10/17/2012CN102738175A BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device on basis of SOI (Silicon On Insulator) substrate and preparation method
10/17/2012CN102738174A Three-strained fully planar SOI (silicon on insulator) BiCMOS (bipolar complementary metal oxide semiconductor) integrated device and preparation method
10/17/2012CN102738173A Strained SiGe return-type channel SOI (silicon on insulator) BiCMOS (bipolar complementary metal oxide semiconductor) integrated device and preparation method
10/17/2012CN102738172A Double-polysilicon planar SOI (silicon on insulator) BiCMOS (bipolar complementary metal oxide semiconductor) integrated device and preparation method
10/17/2012CN102738171A Display panel and method manufacturing same
10/17/2012CN102738170A Nonvolatile memory and preparation method thereof
10/17/2012CN102738169A Flash memory and manufacturing method thereof
10/17/2012CN102738168A Semiconductor device and fabrication method therefor
10/17/2012CN102738167A Semiconductor device and forming method thereof
10/17/2012CN102738166A Mixed crystal face three-strain BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device and manufacturing method thereof
10/17/2012CN102738165A Mixed crystal plane strain BiCMOS (Bipolar Complementary Metal Oxide Semiconductor Transistor) integrated device and manufacturing method thereof
10/17/2012CN102738164A Plane strain BiCMOS (Bipolar-Complementary Metal-Oxide-Semiconductor) integrated component based on self-aligned technology and preparation method thereof
10/17/2012CN102738163A Dual polycrystalline SiGe HBT (Silicon Germanium Heterojunction Bipolar Transistor) and mixed crystal face BiCMOS (Bipolar Complementary Metal Oxide Semiconductor Transistor) integrated device and manufacturing method thereof
10/17/2012CN102738162A Mixed crystal face double polycrystal BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device based on self-aligning process and manufacturing method thereof
10/17/2012CN102738161A Double-polycrystal and double-strain mixed crystal face Si-base Bi CMOS (complementary metal-oxide-semiconductor transistor) integrated device and manufacturing method thereof
10/17/2012CN102738160A Mixed crystal plane silicon-on-insulator (SOI) bipolar complementary metal oxide semiconductor (BiCMOS) integrated device based on square channel process and preparation method
10/17/2012CN102738159A Dual polycrystalline strain SiGe plane bipolar complementary metal oxide semiconductor (BiCMOS) integrated device and preparation method
10/17/2012CN102738158A Strain Si Bi CMOS (complementary metal-oxide-semiconductor transistor) integrated device based on autocollimation technology and manufacturing method thereof
10/17/2012CN102738157A Strained Si/strained SiGe-HBT (heterojunction bipolar transistor) BiCMOS (bipolar complementary metal oxide semiconductor) integrated device and preparation method
10/17/2012CN102738156A SiGe base vertical channel strain BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device and manufacturing method
10/17/2012CN102738155A Mixed crystal face double polycrystal BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device and manufacturing method thereof
10/17/2012CN102738154A Vertical-channel mixed-lattice-strain BiCMOS (bipolar complementary metal oxide semiconductor) integrated device and preparation method
10/17/2012CN102738153A SiGe HBT (Heterojunction Bipolar Transistor) double-strain-plane BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device and manufacturing method thereof
10/17/2012CN102738152A Double-polysilicon strained Si BiCMOS (bipolar complementary metal oxide semiconductor) integrated device and preparation method
10/17/2012CN102738151A SiGe HBT (Heterojunction Bipolar Transistor) device strain Si BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device and manufacturing method thereof
10/17/2012CN102738150A Strained SiGe BiCMOS (bipolar complementary metal oxide semiconductor) integrated device and preparation method
10/17/2012CN102738149A BiCMOS (bipolar complementary metal oxide semiconductor) integrated device based on plane-strained SiGe HBT (heterojunction bipolar transistor) device and fabrication method
10/17/2012CN102738148A Power transistor device vertical integration
10/17/2012CN102738146A Electrooptic device substrate, electrooptic device, method of manufacturing electrooptic device, and electronic apparatus
10/17/2012CN102738141A Semiconductor structure and manufacturing method and operating method thereof
10/17/2012CN102738133A Semiconductor device and method of fabricating the same
10/17/2012CN102738131A Semiconductor module, packaging structure and packaging method thereof
10/17/2012CN102738130A Die arrangement and method of forming die arrangement
10/17/2012CN102738128A Large inductance integrated magnetic induction devices and methods of fabricating the same
10/17/2012CN102738126A Die arrangements and methods of manufacturing a die arrangement
10/17/2012CN102738121A Inspection mark for overlay deviation and preparation method thereof
10/17/2012CN102738120A Semiconductor package assembly and manufacturing method thereof
10/17/2012CN102738117A Interconnection structure and forming method thereof
10/17/2012CN102738116A Electronic component-embeded board and method for manufacturing same
10/17/2012CN102738115A Integrated circuit device and method for manufacturing same
10/17/2012CN102738114A Non-salicide polysilicon fuse
10/17/2012CN102738113A Monolithic integrated capacitors for high-efficiency power converters
10/17/2012CN102738112A Packaging substrate and method of fabricating same
10/17/2012CN102738105A Semiconductor device and method of manufacturing the same
10/17/2012CN102738104A Via network structures and method therefor
10/17/2012CN102738103A Short and low loop wire bonding
10/17/2012CN102738095A Semiconductor device and manufacturing method of the semiconductor device
10/17/2012CN102738094A Semiconductor packaging structure for stacking and manufacturing method thereof
10/17/2012CN102738090A Light emitting device-light receiving device assembly, and manufacturing method thereof
10/17/2012CN102738086A Assembly of stacked devices with semiconductor components
10/17/2012CN102738085A Patterning a gate stack of a non-volatile memory (NVM) with formation of a capacitor
10/17/2012CN102738084A Method for improving write redundancy of high SRAM (static random access memory)
10/17/2012CN102738083A Manufacture method of semiconductor element with metal gate
10/17/2012CN102738082A Method for manufacturing semiconductor device
10/17/2012CN102738081A Method for preparing ARRAY plate of thin film transistor (TFT) liquid crystal display
10/17/2012CN102738080A Method for manufacturing array substrate with embedded photovoltaic cell
10/17/2012CN102738079A Polysilicon laser annealing device and polysilicon laser annealing method thereof
10/17/2012CN102738078A Method for manufacturing flexible display substrate
10/17/2012CN102738077A Method of manufacturing organic electroluminescence display device
10/17/2012CN102738076A Through hole propriety copper interconnection manufacturing method
10/17/2012CN102738075A Method for adding idle contact hole of electronic programmable fuse and electronic programmable fuse
10/17/2012CN102738074A Method for forming semiconductor structure
10/17/2012CN102738073A Distance piece and manufacturing method thereof
10/17/2012CN102738072A Semiconductor assembly with through-silicon via and manufacturing method thereof
10/17/2012CN102738071A Method and device for filling interconnection structure
10/17/2012CN102738070A Manufacturing method of semiconductor device and semiconductor device
10/17/2012CN102738069A Method for manufacturing semiconductor device
10/17/2012CN102738068A Semiconductor device and method of manufacturing the same
10/17/2012CN102738067A Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different cte insulating layers
10/17/2012CN102738066A Methods of forming through silicon via openings
10/17/2012CN102738065A Layout scheme and method for forming device cells in semiconductor devices
10/17/2012CN102738064A Method for fabricating metal redistribution layer
10/17/2012CN102738063A Circuit interconnecting structure preparation method
10/17/2012CN102738062A Method for manufacturing semiconductor device
10/17/2012CN102738061A Method for forming groove and method for fabricating semiconductor device
10/17/2012CN102738060A Preparation method of gate oxide integrity (GOI) wafer structure
10/17/2012CN102738059A Plasma processing method and device isolation method
10/17/2012CN102738058A Forming method for active area and forming method for STI trench
10/17/2012CN102738057A Method of unifying device performance within die
10/17/2012CN102738056A Push rod-type wafer clamping device which extends with cylinder
10/17/2012CN102738055A Flip chip packaging system and raise clamp thereof
10/17/2012CN102738054A Method for producing electrostatic chuck and electrostatic chuck
10/17/2012CN102738053A Electrostatic chuck
10/17/2012CN102738052A Tool and electronic component film coating method utilizing the same
10/17/2012CN102738051A Automatic charging tray moving machine
10/17/2012CN102738050A Automatic silicon wafer conveying system for solar cell production line
10/17/2012CN102738049A Substrate transport method, substrate transport apparatus, and coating and developing system
10/17/2012CN102738048A Substrate processing apparatus
10/17/2012CN102738047A Loading unit and processing system
10/17/2012CN102738046A Substrate transfer apparatus and substrate transfer method
10/17/2012CN102738045A Substrate support instrument, and vertical heat treatment apparatus and driving method thereof
10/17/2012CN102738044A Member for semiconductor manufacturing apparatus
10/17/2012CN102738043A Manual inspection servo driving turnover machine
10/17/2012CN102738042A Substrate processing apparatus, program for controlling the same, and method for fabricating semiconductor device
10/17/2012CN102738041A Ceiling electrode plate and substrate processing apparatus
10/17/2012CN102738040A Method for processing a semiconductor wafer or die, and particle deposition device
10/17/2012CN102738039A Measuring apparatus and plasma processing apparatus
10/17/2012CN102738038A Arm type carrying device
10/17/2012CN102738037A Heat treatment control system and heat treatment control method
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