Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2012
10/24/2012CN102754196A Panelized packaging with transferred dielectric
10/24/2012CN102754195A Circuit board with via trace connection and method of making the same
10/24/2012CN102754194A Substrate wiring method and semiconductor manufacturing device
10/24/2012CN102754193A Flowable dielectric using oxide liner
10/24/2012CN102754192A Substrate cleaning method and substrate cleaning device
10/24/2012CN102754191A Heating apparatus and annealing apparatus
10/24/2012CN102754190A Flow control features of cvd chambers
10/24/2012CN102754189A Semiconductor substrate, semiconductor device, and method for manufacturing semiconductor substrate
10/24/2012CN102754188A Method for manufacturing galium naitride wafer
10/24/2012CN102754187A Method for manufacturing crystalline semiconductor film, substrate provided with crystalline semiconductor film, and thin film transistor
10/24/2012CN102754186A Semiconductor device fabrication using a multiple exposure and block mask approach to reduce design rule violations
10/24/2012CN102754185A Method for manufacturing semiconductor device, and semiconductor device
10/24/2012CN102754184A Semiconductor Device Structures With Modulated Doping And Related Methods
10/24/2012CN102754163A Semiconductor device
10/24/2012CN102754162A Semiconductor device and driving method of semiconductor device
10/24/2012CN102754102A Design support device and design support method for three-dimensional integrated circuit
10/24/2012CN102754034A Composition for formation of resist underlayer film containing silicon having nitrogen-containing ring
10/24/2012CN102754033A Underlayer film material, and method for formation of multilayer resist pattern
10/24/2012CN102754030A Photocurable resin composition, dry film, cured article, and printed wiring board
10/24/2012CN102754029A Photosensitive resin composition, method for manufacturing structural body, and liquid discharge head
10/24/2012CN102753737A Internal reforming substrate for epitaxial growth, internal reforming substrate with multilayer film, semiconductor device, bulk semiconductor substrate, and production methods therefor
10/24/2012CN102753727A Plasma processing device and plasma processing method
10/24/2012CN102753726A Oxygen radical generation for radical-enhanced thin film deposition
10/24/2012CN102753724A Material for forming ruthenium film and method for forming ruthenium film
10/24/2012CN102753620A Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices
10/24/2012CN102753509A Cyclic compound, process for production of the cyclic compound, radiation-sensitive composition, and method for formation of resist pattern
10/24/2012CN102753458A Transfer vehicle system
10/24/2012CN102753260A Apparatus for production of particles, process for production of particles, and process for production of resin composition for semiconductor sealing purposes
10/24/2012CN102752962A Substrate provided with metal layer and manufacturing method thereof
10/24/2012CN102751438A Organic EL device manufacture method
10/24/2012CN102751395A Manufacture method for high-voltage alternating-current LED (light emitting diode) chip modules
10/24/2012CN102751335A Gallium nitride semiconductor devices
10/24/2012CN102751334A Non-volatile memory device and method of fabricating the same
10/24/2012CN102751333A Active component and method for manufacturing same
10/24/2012CN102751332A Depletion type power semiconductor device and manufacturing method thereof
10/24/2012CN102751331A Strain SiGe square-in-square type channel NMOS (N-channel Metal Oxide Semiconductor) integrated device and preparation method thereof
10/24/2012CN102751330A Horizontal high-voltage device and manufacturing method thereof
10/24/2012CN102751328A Semiconductor device and method of enlarging active area of semiconductor device
10/24/2012CN102751325A Tunneling effect transistor and production method thereof
10/24/2012CN102751322A Gate associated transistor of groove-shaped gate polycrystalline silicon structure and manufacturing method thereof
10/24/2012CN102751319A Chalcogenide compound-based surge protection device and preparation method thereof
10/24/2012CN102751318A ZnO (zinc oxide) homogeneous pn junction and preparation method of ZnO homogeneous pn junction
10/24/2012CN102751314A Groove mean opinion score (MOS) structure semiconductor device and preparation method thereof
10/24/2012CN102751313A Super junction device and manufacture method of super junction device
10/24/2012CN102751312A OLED (Organic Light Emitting Diode) display and manufacturing method thereof
10/24/2012CN102751305A Display device structure, display device, manufacturing method thereof, and connection pad structure
10/24/2012CN102751294A Substrate of active matrix/organic light emitting diode (AMOLED) device and mask plates of substrate
10/24/2012CN102751293A SOI (silicon-on-insulator) three-strain planar BiCMOS (complementary metal oxide semiconductor) integrated device and preparation method thereof
10/24/2012CN102751292A Three-polycrystalline SiGe HBT (Heterojunction Bipolar Transistor)-based hybrid crystal face strain BiCOMS integrated device and preparation method thereof
10/24/2012CN102751291A Mixed crystal face double strain silicon substrate complementary metal oxide semiconductor (CMOS) integrated device and preparation method
10/24/2012CN102751290A Tri-polycrystal mixed crystal face strain BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device and preparation method thereof
10/24/2012CN102751289A Tri-strain SOI (Silicon On Insulator) Si based BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device based on crystal face selection and preparation method thereof
10/24/2012CN102751288A SiGe based strain BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device and preparation method thereof
10/24/2012CN102751286A Embedded dynamic memory compatible with deep sub-micron complementary metal-oxide-semiconductor (CMOS) logic technology and preparation method
10/24/2012CN102751283A Mixed crystal face strain Si, strain SiGe and planar BiCMOS (complementary metal oxide semiconductor) integrated device and preparation method thereof
10/24/2012CN102751282A Strain BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device based on crystal face selection and preparation method thereof
10/24/2012CN102751281A Strain BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device based on tri-polycrystal SiGe HBT (Heterojunction Bipolar Transistor) and preparation method thereof
10/24/2012CN102751280A Strain SiGe square-in-square type channel BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device and preparation method thereof
10/24/2012CN102751279A Crystal face selection-based dual-strain BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device and preparation method
10/24/2012CN102751278A Strain SiGe BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device based on SOI (Silicon On Insulator) substrate and preparation method
10/24/2012CN102751277A Power device integrated with Schottky diode and method for manufacturing the same
10/24/2012CN102751276A Method for manufacturing array substrate, array substrate and display device
10/24/2012CN102751268A MOSFET pair with stack capacitor and manufacturing method thereof
10/24/2012CN102751267A Semiconductor packaging structure for stacking and manufacturing method thereof
10/24/2012CN102751266A Wafer package and forming method thereof
10/24/2012CN102751264A Capacitor structure with metal bilayer and method for using the same
10/24/2012CN102751259A Integrated circuit device and method of manufacturing the same
10/24/2012CN102751257A Chip on board (COB) module and manufacture method thereof
10/24/2012CN102751256A Packaging substrate of embedded passive assembly and manufacture method of packaging substrate
10/24/2012CN102751255A Semiconductor bond pad structure, manufacturing method thereof and integrated circuit
10/24/2012CN102751254A Semiconductor packaging piece, stack packaging piece using semiconductor packaging piece and manufacturing method of semiconductor packaging piece
10/24/2012CN102751253A Semiconductor Device and Bonding Wire
10/24/2012CN102751249A Heat radiator and manufacturing method thereof
10/24/2012CN102751248A Packaging structure with embedded perforation chip and manufacture method thereof
10/24/2012CN102751246A Power semiconductor module and manufacturing method thereof
10/24/2012CN102751245A Method of manufacturing non-volatile memory devices
10/24/2012CN102751244A Semiconductor device and forming method of semiconductor device as well as radio frequency identification chip and forming method of radio frequency identification chip
10/24/2012CN102751243A Semiconductor device and manufacture method of semiconductor device
10/24/2012CN102751242A Method for fabricating array substrate having embedded photovoltaic cell and array substrate fabricated by method
10/24/2012CN102751241A Manufacturing method of array substrate via holes and manufacturing method of array substrate
10/24/2012CN102751240A Thin film transistor array substrate, manufacturing method thereof, display panel and display device
10/24/2012CN102751239A Through hole preferential copper interconnection production method
10/24/2012CN102751238A Through hole preferential copper interconnection production method
10/24/2012CN102751237A Manufacturing method of metal interconnection structure
10/24/2012CN102751236A Method for forming interconnection structure
10/24/2012CN102751235A Semiconductor device and fabricating method thereof
10/24/2012CN102751234A Semiconductor device, manufacturing method thereof, solid-state imaging device, and electronic apparatus
10/24/2012CN102751233A Interconnection structure forming method
10/24/2012CN102751232A Method for preparing SiGe or Ge nanowire by using germanium concentration technology
10/24/2012CN102751231A Semiconductor structure and forming method thereof
10/24/2012CN102751230A Isolated capacitors within shallow trench isolation
10/24/2012CN102751229A Shallow trench isolation (STI) structure, manufacture method thereof and device based on (STI) structure
10/24/2012CN102751228A Wafer clamping device by utilizing spring pinch cock
10/24/2012CN102751227A Electrostatic chuck device
10/24/2012CN102751226A Test carrier and board assembly
10/24/2012CN102751225A Methods and apparatus for thin die processing
10/24/2012CN102751224A Sucker, sucker system and transmission system with sucker
10/24/2012CN102751223A Control circuit of wafer transmission device, wafer transmission device and lithography equipment
10/24/2012CN102751222A Loading unit and processing system
10/24/2012CN102751221A Susceptor for supporting a semiconductor wafer and method for depositing a layer on a front side of a semiconductor wafer