Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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10/24/2012 | CN102754196A Panelized packaging with transferred dielectric |
10/24/2012 | CN102754195A Circuit board with via trace connection and method of making the same |
10/24/2012 | CN102754194A Substrate wiring method and semiconductor manufacturing device |
10/24/2012 | CN102754193A Flowable dielectric using oxide liner |
10/24/2012 | CN102754192A Substrate cleaning method and substrate cleaning device |
10/24/2012 | CN102754191A Heating apparatus and annealing apparatus |
10/24/2012 | CN102754190A Flow control features of cvd chambers |
10/24/2012 | CN102754189A Semiconductor substrate, semiconductor device, and method for manufacturing semiconductor substrate |
10/24/2012 | CN102754188A Method for manufacturing galium naitride wafer |
10/24/2012 | CN102754187A Method for manufacturing crystalline semiconductor film, substrate provided with crystalline semiconductor film, and thin film transistor |
10/24/2012 | CN102754186A Semiconductor device fabrication using a multiple exposure and block mask approach to reduce design rule violations |
10/24/2012 | CN102754185A Method for manufacturing semiconductor device, and semiconductor device |
10/24/2012 | CN102754184A Semiconductor Device Structures With Modulated Doping And Related Methods |
10/24/2012 | CN102754163A Semiconductor device |
10/24/2012 | CN102754162A Semiconductor device and driving method of semiconductor device |
10/24/2012 | CN102754102A Design support device and design support method for three-dimensional integrated circuit |
10/24/2012 | CN102754034A Composition for formation of resist underlayer film containing silicon having nitrogen-containing ring |
10/24/2012 | CN102754033A Underlayer film material, and method for formation of multilayer resist pattern |
10/24/2012 | CN102754030A Photocurable resin composition, dry film, cured article, and printed wiring board |
10/24/2012 | CN102754029A Photosensitive resin composition, method for manufacturing structural body, and liquid discharge head |
10/24/2012 | CN102753737A Internal reforming substrate for epitaxial growth, internal reforming substrate with multilayer film, semiconductor device, bulk semiconductor substrate, and production methods therefor |
10/24/2012 | CN102753727A Plasma processing device and plasma processing method |
10/24/2012 | CN102753726A Oxygen radical generation for radical-enhanced thin film deposition |
10/24/2012 | CN102753724A Material for forming ruthenium film and method for forming ruthenium film |
10/24/2012 | CN102753620A Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices |
10/24/2012 | CN102753509A Cyclic compound, process for production of the cyclic compound, radiation-sensitive composition, and method for formation of resist pattern |
10/24/2012 | CN102753458A Transfer vehicle system |
10/24/2012 | CN102753260A Apparatus for production of particles, process for production of particles, and process for production of resin composition for semiconductor sealing purposes |
10/24/2012 | CN102752962A Substrate provided with metal layer and manufacturing method thereof |
10/24/2012 | CN102751438A Organic EL device manufacture method |
10/24/2012 | CN102751395A Manufacture method for high-voltage alternating-current LED (light emitting diode) chip modules |
10/24/2012 | CN102751335A Gallium nitride semiconductor devices |
10/24/2012 | CN102751334A Non-volatile memory device and method of fabricating the same |
10/24/2012 | CN102751333A Active component and method for manufacturing same |
10/24/2012 | CN102751332A Depletion type power semiconductor device and manufacturing method thereof |
10/24/2012 | CN102751331A Strain SiGe square-in-square type channel NMOS (N-channel Metal Oxide Semiconductor) integrated device and preparation method thereof |
10/24/2012 | CN102751330A Horizontal high-voltage device and manufacturing method thereof |
10/24/2012 | CN102751328A Semiconductor device and method of enlarging active area of semiconductor device |
10/24/2012 | CN102751325A Tunneling effect transistor and production method thereof |
10/24/2012 | CN102751322A Gate associated transistor of groove-shaped gate polycrystalline silicon structure and manufacturing method thereof |
10/24/2012 | CN102751319A Chalcogenide compound-based surge protection device and preparation method thereof |
10/24/2012 | CN102751318A ZnO (zinc oxide) homogeneous pn junction and preparation method of ZnO homogeneous pn junction |
10/24/2012 | CN102751314A Groove mean opinion score (MOS) structure semiconductor device and preparation method thereof |
10/24/2012 | CN102751313A Super junction device and manufacture method of super junction device |
10/24/2012 | CN102751312A OLED (Organic Light Emitting Diode) display and manufacturing method thereof |
10/24/2012 | CN102751305A Display device structure, display device, manufacturing method thereof, and connection pad structure |
10/24/2012 | CN102751294A Substrate of active matrix/organic light emitting diode (AMOLED) device and mask plates of substrate |
10/24/2012 | CN102751293A SOI (silicon-on-insulator) three-strain planar BiCMOS (complementary metal oxide semiconductor) integrated device and preparation method thereof |
10/24/2012 | CN102751292A Three-polycrystalline SiGe HBT (Heterojunction Bipolar Transistor)-based hybrid crystal face strain BiCOMS integrated device and preparation method thereof |
10/24/2012 | CN102751291A Mixed crystal face double strain silicon substrate complementary metal oxide semiconductor (CMOS) integrated device and preparation method |
10/24/2012 | CN102751290A Tri-polycrystal mixed crystal face strain BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device and preparation method thereof |
10/24/2012 | CN102751289A Tri-strain SOI (Silicon On Insulator) Si based BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device based on crystal face selection and preparation method thereof |
10/24/2012 | CN102751288A SiGe based strain BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device and preparation method thereof |
10/24/2012 | CN102751286A Embedded dynamic memory compatible with deep sub-micron complementary metal-oxide-semiconductor (CMOS) logic technology and preparation method |
10/24/2012 | CN102751283A Mixed crystal face strain Si, strain SiGe and planar BiCMOS (complementary metal oxide semiconductor) integrated device and preparation method thereof |
10/24/2012 | CN102751282A Strain BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device based on crystal face selection and preparation method thereof |
10/24/2012 | CN102751281A Strain BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device based on tri-polycrystal SiGe HBT (Heterojunction Bipolar Transistor) and preparation method thereof |
10/24/2012 | CN102751280A Strain SiGe square-in-square type channel BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device and preparation method thereof |
10/24/2012 | CN102751279A Crystal face selection-based dual-strain BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device and preparation method |
10/24/2012 | CN102751278A Strain SiGe BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device based on SOI (Silicon On Insulator) substrate and preparation method |
10/24/2012 | CN102751277A Power device integrated with Schottky diode and method for manufacturing the same |
10/24/2012 | CN102751276A Method for manufacturing array substrate, array substrate and display device |
10/24/2012 | CN102751268A MOSFET pair with stack capacitor and manufacturing method thereof |
10/24/2012 | CN102751267A Semiconductor packaging structure for stacking and manufacturing method thereof |
10/24/2012 | CN102751266A Wafer package and forming method thereof |
10/24/2012 | CN102751264A Capacitor structure with metal bilayer and method for using the same |
10/24/2012 | CN102751259A Integrated circuit device and method of manufacturing the same |
10/24/2012 | CN102751257A Chip on board (COB) module and manufacture method thereof |
10/24/2012 | CN102751256A Packaging substrate of embedded passive assembly and manufacture method of packaging substrate |
10/24/2012 | CN102751255A Semiconductor bond pad structure, manufacturing method thereof and integrated circuit |
10/24/2012 | CN102751254A Semiconductor packaging piece, stack packaging piece using semiconductor packaging piece and manufacturing method of semiconductor packaging piece |
10/24/2012 | CN102751253A Semiconductor Device and Bonding Wire |
10/24/2012 | CN102751249A Heat radiator and manufacturing method thereof |
10/24/2012 | CN102751248A Packaging structure with embedded perforation chip and manufacture method thereof |
10/24/2012 | CN102751246A Power semiconductor module and manufacturing method thereof |
10/24/2012 | CN102751245A Method of manufacturing non-volatile memory devices |
10/24/2012 | CN102751244A Semiconductor device and forming method of semiconductor device as well as radio frequency identification chip and forming method of radio frequency identification chip |
10/24/2012 | CN102751243A Semiconductor device and manufacture method of semiconductor device |
10/24/2012 | CN102751242A Method for fabricating array substrate having embedded photovoltaic cell and array substrate fabricated by method |
10/24/2012 | CN102751241A Manufacturing method of array substrate via holes and manufacturing method of array substrate |
10/24/2012 | CN102751240A Thin film transistor array substrate, manufacturing method thereof, display panel and display device |
10/24/2012 | CN102751239A Through hole preferential copper interconnection production method |
10/24/2012 | CN102751238A Through hole preferential copper interconnection production method |
10/24/2012 | CN102751237A Manufacturing method of metal interconnection structure |
10/24/2012 | CN102751236A Method for forming interconnection structure |
10/24/2012 | CN102751235A Semiconductor device and fabricating method thereof |
10/24/2012 | CN102751234A Semiconductor device, manufacturing method thereof, solid-state imaging device, and electronic apparatus |
10/24/2012 | CN102751233A Interconnection structure forming method |
10/24/2012 | CN102751232A Method for preparing SiGe or Ge nanowire by using germanium concentration technology |
10/24/2012 | CN102751231A Semiconductor structure and forming method thereof |
10/24/2012 | CN102751230A Isolated capacitors within shallow trench isolation |
10/24/2012 | CN102751229A Shallow trench isolation (STI) structure, manufacture method thereof and device based on (STI) structure |
10/24/2012 | CN102751228A Wafer clamping device by utilizing spring pinch cock |
10/24/2012 | CN102751227A Electrostatic chuck device |
10/24/2012 | CN102751226A Test carrier and board assembly |
10/24/2012 | CN102751225A Methods and apparatus for thin die processing |
10/24/2012 | CN102751224A Sucker, sucker system and transmission system with sucker |
10/24/2012 | CN102751223A Control circuit of wafer transmission device, wafer transmission device and lithography equipment |
10/24/2012 | CN102751222A Loading unit and processing system |
10/24/2012 | CN102751221A Susceptor for supporting a semiconductor wafer and method for depositing a layer on a front side of a semiconductor wafer |