Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2012
11/08/2012US20120282763 Process Flow to Reduce Hole Defects in P-Active Regions and to Reduce Across-Wafer Threshold Voltage Scatter
11/08/2012US20120282762 Method For Forming Gallium Nitride Semiconductor Device With Improved Forward Conduction
11/08/2012US20120282761 Method for reuse of wafers for growth of vertically-aligned wire arrays
11/08/2012US20120282760 Enhancing interface characteristics between a channel semiconductor alloy and a gate dielectric by an oxidation process
11/08/2012US20120282759 Method for making semi-conductor nanocrystals oriented along a predefined direction
11/08/2012US20120282758 Method for making semi-conductor nanocrystals
11/08/2012US20120282757 Method for manufacturing soi substrate
11/08/2012US20120282756 Thin Film Filling Method
11/08/2012US20120282755 Method for fabricating nonvolatile memory device
11/08/2012US20120282754 Methods of Forming Capacitors Having Dielectric Regions That Include Multiple Metal Oxide-Comprising Materials
11/08/2012US20120282753 Semiconductor Devices and Methods of Manufacture Thereof
11/08/2012US20120282752 Fabricating current-confining structures in phase change memory switch cells
11/08/2012US20120282751 Methods of fabricating semiconductor devices including fine patterns
11/08/2012US20120282750 Semiconductor device having capacitors fixed to support patterns and method for manufacturing the same
11/08/2012US20120282749 High performance resonant element
11/08/2012US20120282748 Method for manufacturing stack structure of PMOS device and adjusting gate work function
11/08/2012US20120282747 Effecting selectivity of silicon or silicon-germanium deposition on a silicon or silicon-germanium substrate by doping
11/08/2012US20120282746 Inverted-trench grounded-source fet structure using conductive substrates, with highly doped substrates
11/08/2012US20120282745 Method of fabricating semiconductor device
11/08/2012US20120282744 Reduced Threshold Voltage-Width Dependency and Reduced Surface Topography in Transistors Comprising High-K Metal Gate Electrode Structures by a Late Carbon Incorporation
11/08/2012US20120282743 Semiconductor device manufacturing method
11/08/2012US20120282742 Semiconductor device and method for manufacturing the same
11/08/2012US20120282741 Method for manufacturing thin film transistor device
11/08/2012US20120282740 Electronic device and process for manufacturing electronic device
11/08/2012US20120282739 Manufacturing a filling of a gap in semiconductor devices
11/08/2012US20120282738 Circuit structure and manufacturing method thereof
11/08/2012US20120282737 Manufacturing method of semiconductor device
11/08/2012US20120282736 Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same
11/08/2012US20120282735 Method of manufacturing chip-stacked semiconductor package
11/08/2012US20120282734 Oxide thin film transistor and method of manufacturing the same
11/08/2012US20120282733 Method for band gap tuning of metal oxide semiconductors
11/08/2012US20120282730 Ink composition, Chalcogenide Semiconductor Film, Photovoltaic Device and Methods for Forming the same
11/08/2012US20120282729 Methods for manufacturing semiconductor apparatus and cmos image sensor
11/08/2012US20120282721 Method for forming Chalcogenide Semiconductor Film and Photovoltaic Device
11/08/2012US20120282719 Methods for forming a micro electro-mechanical device
11/08/2012US20120282717 Thin film transistor, display device and liquid crystal display device and method for manufacturing the same
11/08/2012US20120282715 Structure manufacturing method and liquid discharge head substrate manufacturing method
11/08/2012US20120282714 Susceptor with backside area of constant emissivity
11/08/2012US20120282713 Method of manufacturing semiconductor device and system for manufacturing semiconductor device
11/08/2012US20120282712 Dopant marker for precise recess control
11/08/2012US20120282711 Magnetic tunnel junction (mtj) formation using multiple etching processes
11/08/2012US20120282553 Immersion upper layer film forming composition and method of forming photoresist pattern
11/08/2012US20120282483 Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers
11/08/2012US20120282142 Gas sensor
11/08/2012US20120282067 Rack-to-rack packaged semiconductor device exchanger
11/08/2012US20120281727 Surface-emitting semiconductor laser device in which an edge-emitting laser is integrated with a diffractive lens, and a method for making the device
11/08/2012US20120281490 Semiconductor device, semiconductor module and method of manufacturing the same
11/08/2012US20120281478 Thermally assisted flash memory with diode strapping
11/08/2012US20120281451 Ferro-Resistive Random Access Memory (FERRO-RRAM), Operation Method and Manufacturing Method Thereof
11/08/2012US20120281408 High efficiency solid-state light source and methods of use and manufacture
11/08/2012US20120281376 Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unit
11/08/2012US20120281333 Temperature-controllable electrostatic chuck
11/08/2012US20120281329 Transient voltage suppressor (tvs) with improved clamping voltage
11/08/2012US20120281274 Semiconductor optical devices and methods of fabricating the same
11/08/2012US20120281177 Liquid crystal display device and method of manufacturing the same
11/08/2012US20120280755 Flip-chip power amplifier and impedance matching network
11/08/2012US20120280742 670 ghz schottky diode based subharmonic mixer with cpw circuits and 70 ghz if
11/08/2012US20120280738 Variable attenuator having stacked transistors
11/08/2012US20120280425 Mold for measuring flow characteristics, method for measuring flow characteristics, resin composition for encapsulating semiconductor, and method for manufacturing semiconductor apparatus
11/08/2012US20120280409 Micromechanical Method and Corresponding Assembly for Bonding Semiconductor Substrates and Correspondingly Bonded Semiconductor Chip
11/08/2012US20120280408 Integrated circuit packaging system with formed interconnects and method of manufacture thereof
11/08/2012US20120280407 Integrated circuit packaging system with electrical interface and method of manufacture thereof
11/08/2012US20120280402 Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die
11/08/2012US20120280400 Electronic circuits including planar electronic devices
11/08/2012US20120280399 Buffer pad in solder bump connections and methods of manufacture
11/08/2012US20120280397 Semiconductor device and method of manufacturing the same
11/08/2012US20120280396 Semiconductor device having groove-shaped via-hole
11/08/2012US20120280395 3-D Integration using Multi Stage Vias
11/08/2012US20120280394 Semiconductor device with seg film active region
11/08/2012US20120280393 Electromechanical Microswitch for Switching an Electrical Signal, Microelectromechanical System, Integrated Circuit, and Method for Producing an Integrated Circuit
11/08/2012US20120280392 Semiconductor Component Havin a Plated Through-Hole and method for the Production Thereof
11/08/2012US20120280391 Semiconductor device conductive pattern structures and methods of manufacturing the same
11/08/2012US20120280390 Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
11/08/2012US20120280389 Chip package and fabrication method thereof
11/08/2012US20120280388 Copper pillar bump with non-metal sidewall protection structure and method of making the same
11/08/2012US20120280387 Three-dimensional stacked substrate arrangements
11/08/2012US20120280386 Package-on-package assembly with wire bonds to encapsulation surface
11/08/2012US20120280384 Semiconductor structure and fabrication method thereof
11/08/2012US20120280383 Semiconductor device and method of producing same
11/08/2012US20120280381 Window Interposed Die Packaging
11/08/2012US20120280377 Integrated circuit packaging system with pad connection and method of manufacture thereof
11/08/2012US20120280376 Integrated circuit packaging system with pad connection and method of manufacture thereof
11/08/2012US20120280374 Semiconductor Device and Method of Mounting Cover to Semiconductor Die and Interposer with Adhesive Material
11/08/2012US20120280373 Active electronics on strengthened glass with alkali barrier
11/08/2012US20120280372 Method for Reducing Thickness of Interfacial Layer, Method for Forming High Dielectric Constant Gate Insulating Film, High Dielectric Constant Gate Insulating Film, High Dielectric Constant Gate Oxide Film, and Transistor Having High Dielectric Constant Gate Oxide Film
11/08/2012US20120280371 Circuit structure and manufacturing method thereof
11/08/2012US20120280370 Semiconductor device devoid of an interfacial layer and methods of manufacture
11/08/2012US20120280369 Method for manufacturing semiconductor device, substrate processing apparatus, and semiconductor device
11/08/2012US20120280368 Laminated structure for semiconductor devices
11/08/2012US20120280367 Method for manufacturing a semiconductor substrate
11/08/2012US20120280363 Semiconductor device and method for manufacturing thereof
11/08/2012US20120280362 Simple route for alkali metal incorporation in solution-processed crystalline semiconductors
11/08/2012US20120280361 High voltage resistor with biased-well
11/08/2012US20120280360 Semiconductor Device and Method for Low Resistive Thin Film Resistor Interconnect
11/08/2012US20120280358 Integrated circuits including metal-insulator-metal capacitors and methods of forming the same
11/08/2012US20120280355 Sos substrate with reduced stress
11/08/2012US20120280354 Methods for fabricating high-density integrated circuit devices
11/08/2012US20120280353 Protective element for electronic circuits
11/08/2012US20120280340 Memory devices and methods of manufacturing the same
11/08/2012US20120280338 Spin torque mram using bidirectional magnonic writing